TWI668859B - 顯示裝置 - Google Patents
顯示裝置 Download PDFInfo
- Publication number
- TWI668859B TWI668859B TW107117259A TW107117259A TWI668859B TW I668859 B TWI668859 B TW I668859B TW 107117259 A TW107117259 A TW 107117259A TW 107117259 A TW107117259 A TW 107117259A TW I668859 B TWI668859 B TW I668859B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring
- oxide semiconductor
- semiconductor layer
- layer
- thin film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/13624—Active matrix addressed cells having more than one switching element per pixel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electroluminescent Light Sources (AREA)
- Shift Register Type Memory (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008258992 | 2008-10-03 | ||
| JP2008-258992 | 2008-10-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201901962A TW201901962A (zh) | 2019-01-01 |
| TWI668859B true TWI668859B (zh) | 2019-08-11 |
Family
ID=42073578
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107117259A TWI668859B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
| TW098133405A TWI594386B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
| TW105119309A TWI668828B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
| TW105119310A TWI606566B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098133405A TWI594386B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
| TW105119309A TWI668828B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
| TW105119310A TWI606566B (zh) | 2008-10-03 | 2009-10-01 | 顯示裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (7) | US8319215B2 (enExample) |
| JP (8) | JP2010109359A (enExample) |
| KR (9) | KR101579050B1 (enExample) |
| TW (4) | TWI668859B (enExample) |
| WO (1) | WO2010038820A1 (enExample) |
Families Citing this family (111)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7868903B2 (en) * | 2004-10-14 | 2011-01-11 | Daktronics, Inc. | Flexible pixel element fabrication and sealing method |
| KR101579050B1 (ko) | 2008-10-03 | 2015-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
| CN103928476A (zh) | 2008-10-03 | 2014-07-16 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
| EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| CN101719493B (zh) | 2008-10-08 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置 |
| JP5361651B2 (ja) | 2008-10-22 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8741702B2 (en) * | 2008-10-24 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR20180137606A (ko) | 2008-10-24 | 2018-12-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| EP2180518B1 (en) | 2008-10-24 | 2018-04-25 | Semiconductor Energy Laboratory Co, Ltd. | Method for manufacturing semiconductor device |
| JP5616012B2 (ja) * | 2008-10-24 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR101667909B1 (ko) | 2008-10-24 | 2016-10-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| KR101432764B1 (ko) | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| KR102556313B1 (ko) | 2008-11-21 | 2023-07-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| TWI529942B (zh) * | 2009-03-27 | 2016-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| KR101476817B1 (ko) | 2009-07-03 | 2014-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 트랜지스터를 갖는 표시 장치 및 그 제작 방법 |
| KR101857405B1 (ko) | 2009-07-10 | 2018-05-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| KR101782176B1 (ko) | 2009-07-18 | 2017-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| DE102009038589B4 (de) * | 2009-08-26 | 2014-11-20 | Heraeus Materials Technology Gmbh & Co. Kg | TFT-Struktur mit Cu-Elektroden |
| KR102221207B1 (ko) | 2009-09-04 | 2021-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
| WO2011034012A1 (en) * | 2009-09-16 | 2011-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit, light emitting device, semiconductor device, and electronic device |
| CN105448937A (zh) | 2009-09-16 | 2016-03-30 | 株式会社半导体能源研究所 | 晶体管及显示设备 |
| KR101730347B1 (ko) | 2009-09-16 | 2017-04-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| KR101693544B1 (ko) | 2009-09-24 | 2017-01-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막 및 반도체 장치 |
| WO2011043203A1 (en) | 2009-10-08 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device, and electronic appliance |
| KR101980505B1 (ko) | 2009-10-08 | 2019-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체층, 반도체 장치 및 그 제조 방법 |
| KR101396096B1 (ko) | 2009-10-09 | 2014-05-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| KR101759504B1 (ko) | 2009-10-09 | 2017-07-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 표시 장치 및 이를 포함한 전자 기기 |
| WO2011046048A1 (en) | 2009-10-16 | 2011-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN105702688B (zh) * | 2009-10-21 | 2020-09-08 | 株式会社半导体能源研究所 | 液晶显示器件及包括该液晶显示器件的电子设备 |
| KR102019239B1 (ko) | 2009-10-30 | 2019-09-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101629194B1 (ko) | 2009-10-30 | 2016-06-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 논리 회로 및 반도체 장치 |
| KR102481935B1 (ko) | 2009-11-06 | 2022-12-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| KR102220606B1 (ko) | 2009-11-06 | 2021-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| KR102513073B1 (ko) | 2009-11-13 | 2023-03-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| WO2011065244A1 (en) * | 2009-11-28 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN105206514B (zh) | 2009-11-28 | 2018-04-10 | 株式会社半导体能源研究所 | 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法 |
| CN103746001B (zh) | 2009-12-04 | 2017-05-03 | 株式会社半导体能源研究所 | 显示装置 |
| WO2011068033A1 (en) | 2009-12-04 | 2011-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2011081008A1 (en) * | 2009-12-28 | 2011-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device |
| WO2011081011A1 (en) * | 2009-12-28 | 2011-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and manufacturing method thereof |
| KR101749944B1 (ko) | 2009-12-28 | 2017-06-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 액정 표시 장치 및 전자 기기 |
| WO2011081041A1 (en) | 2009-12-28 | 2011-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| US8879010B2 (en) | 2010-01-24 | 2014-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| WO2011089844A1 (en) | 2010-01-24 | 2011-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| TWI402968B (zh) * | 2010-02-10 | 2013-07-21 | Au Optronics Corp | 畫素結構及其製造方法以及電子裝置的製造方法 |
| US9000438B2 (en) | 2010-02-26 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN102213854B (zh) | 2010-04-09 | 2015-08-05 | 株式会社半导体能源研究所 | 液晶显示装置及电子设备 |
| WO2011142147A1 (ja) * | 2010-05-13 | 2011-11-17 | シャープ株式会社 | 回路基板及び表示装置 |
| JP5852793B2 (ja) | 2010-05-21 | 2016-02-03 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| WO2011145634A1 (en) * | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2012015491A (ja) | 2010-06-04 | 2012-01-19 | Semiconductor Energy Lab Co Ltd | 光電変換装置 |
| US8610180B2 (en) | 2010-06-11 | 2013-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Gas sensor and method for manufacturing the gas sensor |
| US8552425B2 (en) | 2010-06-18 | 2013-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TWI565001B (zh) * | 2010-07-28 | 2017-01-01 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的驅動方法 |
| TWI562285B (en) * | 2010-08-06 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device and method for manufacturing the same |
| US8766253B2 (en) * | 2010-09-10 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8558960B2 (en) * | 2010-09-13 | 2013-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
| JP5864047B2 (ja) | 2010-09-23 | 2016-02-17 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5908263B2 (ja) * | 2010-12-03 | 2016-04-26 | 株式会社半導体エネルギー研究所 | Dc−dcコンバータ |
| KR102505248B1 (ko) | 2010-12-03 | 2023-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막 및 반도체 장치 |
| KR101952570B1 (ko) * | 2011-05-13 | 2019-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| JP2013084333A (ja) | 2011-09-28 | 2013-05-09 | Semiconductor Energy Lab Co Ltd | シフトレジスタ回路 |
| CN103843145B (zh) | 2011-09-29 | 2017-03-29 | 株式会社半导体能源研究所 | 半导体装置 |
| KR20130040706A (ko) | 2011-10-14 | 2013-04-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| SG10201601757UA (en) | 2011-10-14 | 2016-04-28 | Semiconductor Energy Lab | Semiconductor device |
| US8829528B2 (en) * | 2011-11-25 | 2014-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including groove portion extending beyond pixel electrode |
| KR20130085859A (ko) | 2012-01-20 | 2013-07-30 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 그 제조 방법 |
| US9553200B2 (en) | 2012-02-29 | 2017-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| MY167302A (en) * | 2012-03-12 | 2018-08-16 | Sharp Kk | Shift register, driver circuit and display device |
| KR102254731B1 (ko) | 2012-04-13 | 2021-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP6077382B2 (ja) * | 2012-05-11 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
| KR102113160B1 (ko) * | 2012-06-15 | 2020-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US9508758B2 (en) * | 2012-06-15 | 2016-11-29 | Sony Corporation | Display device, semiconductor device, and method of manufacturing display device |
| JP6351947B2 (ja) | 2012-10-12 | 2018-07-04 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| TWI681233B (zh) | 2012-10-12 | 2020-01-01 | 日商半導體能源研究所股份有限公司 | 液晶顯示裝置、觸控面板及液晶顯示裝置的製造方法 |
| KR20220150439A (ko) | 2012-11-08 | 2022-11-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 디스플레이 장치 |
| US9153650B2 (en) | 2013-03-19 | 2015-10-06 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor |
| TWI652822B (zh) | 2013-06-19 | 2019-03-01 | 日商半導體能源研究所股份有限公司 | 氧化物半導體膜及其形成方法 |
| TWI622053B (zh) | 2013-07-10 | 2018-04-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| JP6322503B2 (ja) * | 2013-07-16 | 2018-05-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI608523B (zh) | 2013-07-19 | 2017-12-11 | 半導體能源研究所股份有限公司 | Oxide semiconductor film, method of manufacturing oxide semiconductor film, and semiconductor device |
| JP2015109422A (ja) * | 2013-10-22 | 2015-06-11 | 株式会社半導体エネルギー研究所 | 半導体装置の評価方法 |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2015114870A1 (ja) * | 2014-01-28 | 2015-08-06 | シャープ株式会社 | ガスセンサ |
| TWI727778B (zh) * | 2014-02-21 | 2021-05-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及電子裝置 |
| EP2911199B1 (en) | 2014-02-24 | 2020-05-06 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| EP2911200B1 (en) | 2014-02-24 | 2020-06-03 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US9214508B2 (en) | 2014-02-24 | 2015-12-15 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US10186528B2 (en) | 2014-02-24 | 2019-01-22 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US10325937B2 (en) | 2014-02-24 | 2019-06-18 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US9721973B2 (en) | 2014-02-24 | 2017-08-01 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US10985196B2 (en) | 2014-02-24 | 2021-04-20 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| EP2911202B1 (en) | 2014-02-24 | 2019-02-20 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| WO2015132697A1 (en) | 2014-03-07 | 2015-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN103928343B (zh) * | 2014-04-23 | 2017-06-20 | 深圳市华星光电技术有限公司 | 薄膜晶体管及有机发光二极管显示器制备方法 |
| KR102354008B1 (ko) | 2014-05-29 | 2022-01-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 반도체 장치의 제작 방법 및 전자 기기 |
| JP6497858B2 (ja) * | 2014-07-11 | 2019-04-10 | 株式会社ジャパンディスプレイ | 有機el表示装置及び有機el表示装置の製造方法 |
| JP6521794B2 (ja) | 2014-09-03 | 2019-05-29 | 株式会社半導体エネルギー研究所 | 半導体装置、及び電子機器 |
| TWI841974B (zh) | 2014-11-21 | 2024-05-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US20160155803A1 (en) * | 2014-11-28 | 2016-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor Device, Method for Manufacturing the Semiconductor Device, and Display Device Including the Semiconductor Device |
| CN104752343B (zh) * | 2015-04-14 | 2017-07-28 | 深圳市华星光电技术有限公司 | 双栅极氧化物半导体tft基板的制作方法及其结构 |
| CN104867959B (zh) * | 2015-04-14 | 2017-09-26 | 深圳市华星光电技术有限公司 | 双栅极氧化物半导体tft基板的制作方法及其结构 |
| CN106298859B (zh) * | 2016-09-30 | 2018-09-04 | 京东方科技集团股份有限公司 | 触控面板及显示装置 |
| CN108257971B (zh) * | 2016-12-27 | 2019-07-05 | 昆山工研院新型平板显示技术中心有限公司 | 柔性显示装置及其制造方法 |
| JP2019101128A (ja) * | 2017-11-30 | 2019-06-24 | 株式会社ジャパンディスプレイ | 表示装置、及び表示装置の製造方法 |
| KR102656371B1 (ko) | 2018-04-04 | 2024-04-12 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| US20210388673A1 (en) * | 2020-06-11 | 2021-12-16 | Lafayette Venetian Blind, Inc. | Roller Blind Assembly with Improved Light Absorption or Light Reflection |
| TWI732626B (zh) * | 2020-07-14 | 2021-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
| CN112432263A (zh) * | 2020-11-09 | 2021-03-02 | 好太太电器(中国)有限公司 | 一种新型凉霸设备 |
| JP7646846B2 (ja) | 2021-10-12 | 2025-03-17 | エルジー エナジー ソリューション リミテッド | 二次電池 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200514009A (en) * | 2003-10-15 | 2005-04-16 | Samsung Electronics Co Ltd | Display apparatus having photo sensor |
| TW200801672A (en) * | 2003-07-14 | 2008-01-01 | Semiconductor Energy Lab | Light-emitting device |
Family Cites Families (194)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4470060A (en) | 1981-01-09 | 1984-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display with vertical non-single crystal semiconductor field effect transistors |
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63301565A (ja) * | 1987-05-30 | 1988-12-08 | Matsushita Electric Ind Co Ltd | 薄膜集積回路 |
| US5258635A (en) | 1988-09-06 | 1993-11-02 | Kabushiki Kaisha Toshiba | MOS-type semiconductor integrated circuit device |
| JP3057661B2 (ja) | 1988-09-06 | 2000-07-04 | 株式会社東芝 | 半導体装置 |
| JPH02156676A (ja) | 1988-12-09 | 1990-06-15 | Fuji Xerox Co Ltd | 薄膜半導体装置 |
| DE69107101T2 (de) | 1990-02-06 | 1995-05-24 | Semiconductor Energy Lab | Verfahren zum Herstellen eines Oxydfilms. |
| JPH0443677A (ja) | 1990-06-11 | 1992-02-13 | Toshiba Corp | 半導体装置 |
| JPH04206836A (ja) * | 1990-11-30 | 1992-07-28 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH0566853A (ja) * | 1991-09-06 | 1993-03-19 | Hitachi Ltd | 携帯用小型データ処理装置 |
| JP2816421B2 (ja) | 1992-02-07 | 1998-10-27 | 株式会社 半導体エネルギー研究所 | 液晶電気光学装置 |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JP2572003B2 (ja) | 1992-03-30 | 1997-01-16 | 三星電子株式会社 | 三次元マルチチャンネル構造を有する薄膜トランジスタの製造方法 |
| JPH06202156A (ja) | 1992-12-28 | 1994-07-22 | Sharp Corp | ドライバーモノリシック駆動素子 |
| FR2702882B1 (fr) | 1993-03-16 | 1995-07-28 | Thomson Lcd | Procédé de fabrication de transistors à couches minces étagés directs. |
| US5719065A (en) | 1993-10-01 | 1998-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device with removable spacers |
| JP3393834B2 (ja) | 1993-10-01 | 2003-04-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| WO1997006554A2 (en) | 1995-08-03 | 1997-02-20 | Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| US5847410A (en) | 1995-11-24 | 1998-12-08 | Semiconductor Energy Laboratory Co. | Semiconductor electro-optical device |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP3716580B2 (ja) | 1997-02-27 | 2005-11-16 | セイコーエプソン株式会社 | 液晶装置及びその製造方法、並びに投写型表示装置 |
| JPH10290012A (ja) | 1997-04-14 | 1998-10-27 | Nec Corp | アクティブマトリクス型液晶表示装置およびその製造方法 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| JP2001053283A (ja) | 1999-08-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| JP4963140B2 (ja) * | 2000-03-02 | 2012-06-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2001284592A (ja) | 2000-03-29 | 2001-10-12 | Sony Corp | 薄膜半導体装置及びその駆動方法 |
| US7633471B2 (en) | 2000-05-12 | 2009-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electric appliance |
| US6828587B2 (en) | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP4727024B2 (ja) | 2000-07-17 | 2011-07-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| US6549071B1 (en) | 2000-09-12 | 2003-04-15 | Silicon Laboratories, Inc. | Power amplifier circuitry and method using an inductance coupled to power amplifier switching devices |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP4079655B2 (ja) | 2001-02-28 | 2008-04-23 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| SG179310A1 (en) | 2001-02-28 | 2012-04-27 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| US7061014B2 (en) | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| JP4069648B2 (ja) | 2002-03-15 | 2008-04-02 | カシオ計算機株式会社 | 半導体装置および表示駆動装置 |
| US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
| JP2003280034A (ja) | 2002-03-20 | 2003-10-02 | Sharp Corp | Tft基板およびそれを用いる液晶表示装置 |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| JP2003309266A (ja) | 2002-04-17 | 2003-10-31 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ素子の製造方法 |
| US20030198008A1 (en) | 2002-04-18 | 2003-10-23 | Gateway, Inc. | Computer having detachable wireless independently operable computer |
| US7189992B2 (en) | 2002-05-21 | 2007-03-13 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures having a transparent channel |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| KR100870522B1 (ko) | 2002-09-17 | 2008-11-26 | 엘지디스플레이 주식회사 | 액정표시소자 및 그 제조방법 |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| JP4314843B2 (ja) | 2003-03-05 | 2009-08-19 | カシオ計算機株式会社 | 画像読取装置及び個人認証システム |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| WO2004090853A1 (en) | 2003-04-07 | 2004-10-21 | Samsung Electronics Co., Ltd. | Display panel |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| TW200511589A (en) | 2003-07-25 | 2005-03-16 | Hewlett Packard Development Co | Transistor including a deposited channel region having a doped portion |
| US20050017244A1 (en) | 2003-07-25 | 2005-01-27 | Randy Hoffman | Semiconductor device |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| KR100551046B1 (ko) * | 2003-08-28 | 2006-02-09 | 삼성에스디아이 주식회사 | 유기 이엘 소자 |
| US20070171157A1 (en) | 2003-10-15 | 2007-07-26 | Samsung Electronics Co., Ltd | Display apparatus having photo sensor |
| KR101019045B1 (ko) | 2003-11-25 | 2011-03-04 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판과 그 제조방법 |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| KR101019337B1 (ko) | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| JP4661076B2 (ja) * | 2004-04-16 | 2011-03-30 | 三菱電機株式会社 | Tftアレイ基板、液晶表示パネル及び液晶表示装置 |
| KR101086477B1 (ko) | 2004-05-27 | 2011-11-25 | 엘지디스플레이 주식회사 | 표시 소자용 박막 트랜지스터 기판 제조 방법 |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| US7648861B2 (en) | 2004-08-03 | 2010-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a semiconductor device including separately forming a second semiconductor film containing an impurity element over the first semiconductor region |
| JP4906039B2 (ja) * | 2004-08-03 | 2012-03-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| JP4610285B2 (ja) | 2004-09-30 | 2011-01-12 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| JP4801406B2 (ja) * | 2004-09-30 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| KR101219038B1 (ko) | 2004-10-26 | 2013-01-07 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| CN101057333B (zh) | 2004-11-10 | 2011-11-16 | 佳能株式会社 | 发光器件 |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| JP5053537B2 (ja) | 2004-11-10 | 2012-10-17 | キヤノン株式会社 | 非晶質酸化物を利用した半導体デバイス |
| CA2585190A1 (en) | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| CN101057338B (zh) | 2004-11-10 | 2011-03-16 | 佳能株式会社 | 采用无定形氧化物的场效应晶体管 |
| JP5138163B2 (ja) * | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| US8003449B2 (en) * | 2004-11-26 | 2011-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device having a reverse staggered thin film transistor |
| US8054111B2 (en) * | 2004-12-13 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic appliance using the same |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI569441B (zh) | 2005-01-28 | 2017-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI472037B (zh) | 2005-01-28 | 2015-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| WO2006105077A2 (en) | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| KR20060125066A (ko) | 2005-06-01 | 2006-12-06 | 삼성전자주식회사 | 개구율이 향상된 어레이 기판 및 이의 제조방법 |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP4039446B2 (ja) | 2005-08-02 | 2008-01-30 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
| KR100637228B1 (ko) * | 2005-08-02 | 2006-10-23 | 삼성에스디아이 주식회사 | 개선된 패드구조를 갖는 유기발광 표시장치 및 그의제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5064747B2 (ja) * | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| EP1998374A3 (en) * | 2005-09-29 | 2012-01-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| KR101358954B1 (ko) | 2005-11-15 | 2014-02-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다이오드 및 액티브 매트릭스 표시장치 |
| JP5376750B2 (ja) | 2005-11-18 | 2013-12-25 | 出光興産株式会社 | 半導体薄膜、及びその製造方法、並びに薄膜トランジスタ、アクティブマトリックス駆動表示パネル |
| US7998372B2 (en) | 2005-11-18 | 2011-08-16 | Idemitsu Kosan Co., Ltd. | Semiconductor thin film, method for manufacturing the same, thin film transistor, and active-matrix-driven display panel |
| JP5250929B2 (ja) | 2005-11-30 | 2013-07-31 | 凸版印刷株式会社 | トランジスタおよびその製造方法 |
| JP4492528B2 (ja) | 2005-12-02 | 2010-06-30 | カシオ計算機株式会社 | 液晶表示装置 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| JP4921997B2 (ja) | 2006-02-07 | 2012-04-25 | 三星電子株式会社 | 薄膜トランジスタ表示パネル及びその製造方法 |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| TWI297953B (en) | 2006-02-22 | 2008-06-11 | Au Optronics Corp | Method for manufacturing a bottom substrate of a liquid crystal display device |
| US7435633B2 (en) | 2006-03-14 | 2008-10-14 | Seiko Epson Corporation | Electroluminescence device, manufacturing method thereof, and electronic apparatus |
| JP4930704B2 (ja) * | 2006-03-14 | 2012-05-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置及び電子機器 |
| JP5110803B2 (ja) | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| JP5135709B2 (ja) | 2006-04-28 | 2013-02-06 | 凸版印刷株式会社 | 薄膜トランジスタ及びその製造方法 |
| KR100801961B1 (ko) * | 2006-05-26 | 2008-02-12 | 한국전자통신연구원 | 듀얼 게이트 유기트랜지스터를 이용한 인버터 |
| US7439565B2 (en) | 2006-06-08 | 2008-10-21 | Chunghwa Picture Tubes, Ltd. | Active devices array substrate and repairing method thereof |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| KR101217555B1 (ko) | 2006-06-28 | 2013-01-02 | 삼성전자주식회사 | 접합 전계 효과 박막 트랜지스터 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4404881B2 (ja) * | 2006-08-09 | 2010-01-27 | 日本電気株式会社 | 薄膜トランジスタアレイ、その製造方法及び液晶表示装置 |
| US8400599B2 (en) | 2006-08-16 | 2013-03-19 | Samsung Display Co., Ltd. | Liquid crystal display panel having a light blocking electrode |
| KR20080015696A (ko) | 2006-08-16 | 2008-02-20 | 삼성전자주식회사 | 액정 표시 장치 |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP5164357B2 (ja) * | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| TWI585730B (zh) | 2006-09-29 | 2017-06-01 | 半導體能源研究所股份有限公司 | 顯示裝置和電子裝置 |
| KR100790761B1 (ko) * | 2006-09-29 | 2008-01-03 | 한국전자통신연구원 | 인버터 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| JP4934394B2 (ja) | 2006-10-12 | 2012-05-16 | 株式会社 日立ディスプレイズ | 表示装置 |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| JP5305630B2 (ja) | 2006-12-05 | 2013-10-02 | キヤノン株式会社 | ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法 |
| KR101146574B1 (ko) | 2006-12-05 | 2012-05-16 | 캐논 가부시끼가이샤 | 산화물 반도체를 이용한 박막 트랜지스터의 제조방법 및 표시장치 |
| WO2008069255A1 (en) | 2006-12-05 | 2008-06-12 | Canon Kabushiki Kaisha | Method for manufacturing thin film transistor using oxide semiconductor and display apparatus |
| JP2008151963A (ja) * | 2006-12-15 | 2008-07-03 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の駆動方法 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| JP2008186427A (ja) * | 2007-01-31 | 2008-08-14 | Casio Comput Co Ltd | 電子機器 |
| KR101410926B1 (ko) * | 2007-02-16 | 2014-06-24 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
| KR100858088B1 (ko) | 2007-02-28 | 2008-09-10 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR100857455B1 (ko) | 2007-04-17 | 2008-09-08 | 한국전자통신연구원 | 산화물 반도체막상에 보호막을 형성하여 패터닝하는 박막트랜지스터의 제조방법 |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| WO2008133345A1 (en) | 2007-04-25 | 2008-11-06 | Canon Kabushiki Kaisha | Oxynitride semiconductor |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| JP5217631B2 (ja) * | 2007-05-29 | 2013-06-19 | 住友化学株式会社 | 熱可塑性樹脂成形体及びその製造方法 |
| US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| KR101490112B1 (ko) * | 2008-03-28 | 2015-02-05 | 삼성전자주식회사 | 인버터 및 그를 포함하는 논리회로 |
| TWI476921B (zh) | 2008-07-31 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| KR101579050B1 (ko) * | 2008-10-03 | 2015-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
| EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| CN103928476A (zh) | 2008-10-03 | 2014-07-16 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| KR20180137606A (ko) | 2008-10-24 | 2018-12-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101432764B1 (ko) | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| KR102556313B1 (ko) | 2008-11-21 | 2023-07-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| JP2016006716A (ja) * | 2015-10-15 | 2016-01-14 | 株式会社東芝 | 磁気ヘッド、磁気センサ、および磁気記録再生装置 |
-
2009
- 2009-09-24 KR KR1020147010237A patent/KR101579050B1/ko active Active
- 2009-09-24 KR KR1020157035377A patent/KR101659925B1/ko active Active
- 2009-09-24 WO PCT/JP2009/067119 patent/WO2010038820A1/en not_active Ceased
- 2009-09-24 KR KR1020237022590A patent/KR20230106737A/ko not_active Ceased
- 2009-09-24 KR KR1020177031984A patent/KR101961632B1/ko active Active
- 2009-09-24 KR KR1020197007600A patent/KR102133478B1/ko active Active
- 2009-09-24 KR KR1020217035552A patent/KR20210135349A/ko not_active Ceased
- 2009-09-24 KR KR1020117010132A patent/KR101435501B1/ko not_active Expired - Fee Related
- 2009-09-24 KR KR1020207019645A patent/KR20200085934A/ko not_active Ceased
- 2009-09-24 KR KR1020167025822A patent/KR20160113329A/ko not_active Ceased
- 2009-09-30 US US12/570,481 patent/US8319215B2/en active Active
- 2009-10-01 TW TW107117259A patent/TWI668859B/zh active
- 2009-10-01 TW TW098133405A patent/TWI594386B/zh active
- 2009-10-01 TW TW105119309A patent/TWI668828B/zh active
- 2009-10-01 TW TW105119310A patent/TWI606566B/zh active
- 2009-10-01 JP JP2009229226A patent/JP2010109359A/ja not_active Withdrawn
-
2012
- 2012-08-22 JP JP2012182826A patent/JP2013012757A/ja not_active Withdrawn
- 2012-10-15 US US13/651,750 patent/US9048144B2/en active Active
-
2014
- 2014-05-27 JP JP2014108806A patent/JP5784795B2/ja active Active
-
2015
- 2015-03-06 US US14/640,393 patent/US9659969B2/en active Active
- 2015-07-22 JP JP2015144508A patent/JP2015233152A/ja not_active Withdrawn
-
2017
- 2017-01-13 JP JP2017003767A patent/JP2017076818A/ja not_active Withdrawn
- 2017-05-18 US US15/598,806 patent/US10573665B2/en active Active
-
2018
- 2018-11-06 JP JP2018208740A patent/JP6710256B2/ja active Active
-
2020
- 2020-02-20 US US16/796,130 patent/US10910408B2/en active Active
- 2020-05-26 JP JP2020091556A patent/JP2020167417A/ja not_active Withdrawn
- 2020-12-18 US US17/126,262 patent/US11574932B2/en active Active
-
2022
- 2022-12-12 JP JP2022197726A patent/JP7439225B2/ja active Active
- 2022-12-28 US US18/089,708 patent/US12094884B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200801672A (en) * | 2003-07-14 | 2008-01-01 | Semiconductor Energy Lab | Light-emitting device |
| TW200514009A (en) * | 2003-10-15 | 2005-04-16 | Samsung Electronics Co Ltd | Display apparatus having photo sensor |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI668859B (zh) | 顯示裝置 | |
| KR102378244B1 (ko) | 표시장치 | |
| TWI535037B (zh) | 半導體裝置和其製造方法 |