TWI548458B - 用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 - Google Patents
用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 Download PDFInfo
- Publication number
- TWI548458B TWI548458B TW102134175A TW102134175A TWI548458B TW I548458 B TWI548458 B TW I548458B TW 102134175 A TW102134175 A TW 102134175A TW 102134175 A TW102134175 A TW 102134175A TW I548458 B TWI548458 B TW I548458B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- spray
- barrier
- spray mechanism
- dispensing
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 title claims description 159
- 239000012530 fluid Substances 0.000 title claims description 75
- 238000000034 method Methods 0.000 title claims description 54
- 230000008569 process Effects 0.000 title claims description 34
- 238000004377 microelectronic Methods 0.000 title claims description 29
- 238000011282 treatment Methods 0.000 title description 24
- 239000007921 spray Substances 0.000 claims description 209
- 238000012545 processing Methods 0.000 claims description 132
- 239000000463 material Substances 0.000 claims description 70
- 230000007246 mechanism Effects 0.000 claims description 42
- 238000005507 spraying Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 description 68
- 239000007789 gas Substances 0.000 description 64
- 230000000694 effects Effects 0.000 description 25
- 125000006850 spacer group Chemical group 0.000 description 21
- 238000009826 distribution Methods 0.000 description 18
- 239000011148 porous material Substances 0.000 description 18
- 230000008878 coupling Effects 0.000 description 15
- 238000010168 coupling process Methods 0.000 description 15
- 238000005859 coupling reaction Methods 0.000 description 15
- 238000001035 drying Methods 0.000 description 10
- 239000000945 filler Substances 0.000 description 9
- 238000003491 array Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000011344 liquid material Substances 0.000 description 6
- 239000003595 mist Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 230000002262 irrigation Effects 0.000 description 5
- 238000003973 irrigation Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000009950 felting Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 206010043528 Throat tightness Diseases 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000029142 excretion Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000008263 liquid aerosol Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81913306P | 2006-07-07 | 2006-07-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201402218A TW201402218A (zh) | 2014-01-16 |
| TWI548458B true TWI548458B (zh) | 2016-09-11 |
Family
ID=38728960
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102134175A TWI548458B (zh) | 2006-07-07 | 2007-06-29 | 用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 |
| TW102134174A TWI548457B (zh) | 2006-07-07 | 2007-06-29 | 用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 |
| TW096123640A TWI461244B (zh) | 2006-07-07 | 2007-06-29 | 用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102134174A TWI548457B (zh) | 2006-07-07 | 2007-06-29 | 用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 |
| TW096123640A TWI461244B (zh) | 2006-07-07 | 2007-06-29 | 用於使用一或多個處理流體加工微電子工件之工具的屏障結構及噴嘴裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (5) | US8387635B2 (enExample) |
| JP (4) | JP2009543338A (enExample) |
| KR (1) | KR101191337B1 (enExample) |
| CN (4) | CN101484974B (enExample) |
| TW (3) | TWI548458B (enExample) |
| WO (1) | WO2008008154A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI704017B (zh) * | 2019-05-14 | 2020-09-11 | 大陸商瀋陽芯源微電子設備股份有限公司 | 一種晶圓表面顆粒清洗雙旋噴嘴 |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100993311B1 (ko) * | 2005-04-01 | 2010-11-09 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체로 마이크로일렉트로닉 작업물을 처리하는 장치용 이동 및 중첩 가능한 배플들을 포함하는 소형 덕트 시스템 |
| CN101484974B (zh) | 2006-07-07 | 2013-11-06 | Fsi国际公司 | 用于处理微电子工件的设备和方法以及遮挡结构 |
| JP5199339B2 (ja) * | 2007-05-18 | 2013-05-15 | ティーイーエル エフエスアイ，インコーポレイティド | 水蒸気または蒸気を用いた基板の処理方法 |
| WO2009020524A1 (en) * | 2007-08-07 | 2009-02-12 | Fsi International, Inc. | Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses |
| CN102683249B (zh) | 2008-05-09 | 2015-06-17 | 泰尔Fsi公司 | 用于处理微电子工件的系统 |
| US20100124410A1 (en) * | 2008-11-18 | 2010-05-20 | Fsi International, Inc. | System for supplying water vapor in semiconductor wafer treatment |
| CN102834182B (zh) * | 2010-04-27 | 2016-11-02 | 泰尔Fsi公司 | 在邻近基板表面处的受控流体混合情况下的微电子基板的湿处理 |
| JP6046608B2 (ja) * | 2010-06-11 | 2016-12-21 | テル エフエスアイ インコーポレイテッド | 超小型電子ワークピースの加工に使用されるツールにおけるツール表面を洗浄する方法 |
| CN110189995A (zh) | 2010-12-10 | 2019-08-30 | 东京毅力科创Fsi公司 | 用于从衬底选择性地移除氮化物的方法 |
| US9573297B2 (en) * | 2011-11-21 | 2017-02-21 | Reza Reza Youssefi | Method and system for enhancing polymerization and nanoparticle production |
| US9038262B2 (en) * | 2012-02-23 | 2015-05-26 | Beijing Sevenstar Electronics Co., Ltd. | Device for holding disk-shaped articles and method thereof |
| TWI576938B (zh) | 2012-08-17 | 2017-04-01 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
| US9691641B2 (en) * | 2012-12-13 | 2017-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method of cleaning wafers |
| US8871108B2 (en) | 2013-01-22 | 2014-10-28 | Tel Fsi, Inc. | Process for removing carbon material from substrates |
| US9017568B2 (en) | 2013-01-22 | 2015-04-28 | Tel Fsi, Inc. | Process for increasing the hydrophilicity of silicon surfaces following HF treatment |
| US10262880B2 (en) | 2013-02-19 | 2019-04-16 | Tokyo Electron Limited | Cover plate for wind mark control in spin coating process |
| WO2015073517A1 (en) * | 2013-11-13 | 2015-05-21 | Tel Fsi, Inc. | Improved chamber cleaning when using acid chemistries to fabricate microelectronic devices and precursors thereof |
| KR102006059B1 (ko) * | 2014-02-24 | 2019-07-31 | 도쿄엘렉트론가부시키가이샤 | 스핀 코팅 프로세스에서 결함 제어를 위한 덮개 플레이트 |
| CN104384040A (zh) * | 2014-11-14 | 2015-03-04 | 江苏利诺科技发展有限公司 | 一种雾化镀膜装置 |
| CN104338656A (zh) * | 2014-11-14 | 2015-02-11 | 江苏利诺科技发展有限公司 | 一种防水镀膜装置 |
| CN104438010B (zh) * | 2014-11-27 | 2016-09-07 | 北京时代民芯科技有限公司 | 一种用于非气密性倒装焊器件真空涂覆工艺的装置 |
| CN104572198B (zh) * | 2014-12-31 | 2018-04-10 | 华为技术有限公司 | 一种业务恢复方法及装置 |
| US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
| CA2981364C (en) * | 2015-04-09 | 2019-03-19 | Husqvarna Ab | Spray head and spraying apparatus |
| US10139104B2 (en) * | 2016-06-02 | 2018-11-27 | Steris Instrument Management Services, Inc. | Hand held flow-through steam system |
| JP6762824B2 (ja) * | 2016-09-26 | 2020-09-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| US20190070639A1 (en) * | 2017-09-07 | 2019-03-07 | Applied Materials, Inc. | Automatic cleaning machine for cleaning process kits |
| TWI664023B (zh) * | 2018-02-06 | 2019-07-01 | 漢民科技股份有限公司 | 漿料噴塗遮罩及漿料噴塗治具 |
| CN110620031B (zh) * | 2018-06-20 | 2022-02-11 | 沈阳芯源微电子设备股份有限公司 | 一种晶圆表面颗粒清洗装置 |
| CN108906462B (zh) * | 2018-07-23 | 2020-04-14 | 华进半导体封装先导技术研发中心有限公司 | 一种用于半导体湿法工艺设备的液体雾化装置 |
| CN113134434B (zh) * | 2020-01-17 | 2024-03-29 | 上海芯源微企业发展有限公司 | 晶圆表面颗粒清洗喷嘴 |
| KR20230130648A (ko) | 2021-01-15 | 2023-09-12 | 엘리멘탈 사이언티픽, 인코포레이티드 | 재료 표면을 스캐닝하기 위한 성형-채널 스캐닝 노즐 |
| JP2023087757A (ja) * | 2021-12-14 | 2023-06-26 | 東京エレクトロン株式会社 | ノズル、基板処理装置および基板処理方法 |
| CN119890082A (zh) * | 2024-12-26 | 2025-04-25 | 杭州富芯半导体有限公司 | 一种晶圆热处理装置 |
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| US6776359B2 (en) * | 2001-11-06 | 2004-08-17 | Kolene Corporation | Spray nozzle configuration |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0992628A2 (en) * | 1998-10-07 | 2000-04-12 | Lincoln Global, Inc. | Method, system and barrier plate for welding railroad rails |
| US6776359B2 (en) * | 2001-11-06 | 2004-08-17 | Kolene Corporation | Spray nozzle configuration |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI704017B (zh) * | 2019-05-14 | 2020-09-11 | 大陸商瀋陽芯源微電子設備股份有限公司 | 一種晶圓表面顆粒清洗雙旋噴嘴 |
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