TWD227747S - 物理氣相沉積腔室的濺射靶材 - Google Patents

物理氣相沉積腔室的濺射靶材 Download PDF

Info

Publication number
TWD227747S
TWD227747S TW110303363F TW110303363F TWD227747S TW D227747 S TWD227747 S TW D227747S TW 110303363 F TW110303363 F TW 110303363F TW 110303363 F TW110303363 F TW 110303363F TW D227747 S TWD227747 S TW D227747S
Authority
TW
Taiwan
Prior art keywords
vapor deposition
physical vapor
deposition chamber
sputter target
design
Prior art date
Application number
TW110303363F
Other languages
English (en)
Inventor
馬丁 萊克
威廉 富奇堤曼
伊利亞 拉維斯基
斯里尼瓦薩勞 葉德拉
基倫古莫妮拉珊卓拉 沙芬戴亞
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD227747S publication Critical patent/TWD227747S/zh

Links

Abstract

【物品用途】;本設計係關於物理氣相沉積腔室的濺射靶材之外觀設計。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。

Description

物理氣相沉積腔室的濺射靶材
本設計係關於物理氣相沉積腔室的濺射靶材之外觀設計。
圖式所揭露之虛線部分,為本案不主張設計之部分。
TW110303363F 2020-03-23 2020-09-23 物理氣相沉積腔室的濺射靶材 TWD227747S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/728,957 USD937329S1 (en) 2020-03-23 2020-03-23 Sputter target for a physical vapor deposition chamber
US29/728,957 2020-03-23

Publications (1)

Publication Number Publication Date
TWD227747S true TWD227747S (zh) 2023-10-01

Family

ID=75900475

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305355F TWD215707S (zh) 2020-03-23 2020-09-23 物理氣相沉積腔室的濺射靶材
TW110303363F TWD227747S (zh) 2020-03-23 2020-09-23 物理氣相沉積腔室的濺射靶材

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109305355F TWD215707S (zh) 2020-03-23 2020-09-23 物理氣相沉積腔室的濺射靶材

Country Status (3)

Country Link
US (2) USD937329S1 (zh)
JP (2) JP1702035S (zh)
TW (2) TWD215707S (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11961723B2 (en) * 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
JP1655453S (zh) * 2019-06-17 2020-03-23
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1001749S1 (en) * 2020-05-13 2023-10-17 University Of South Florida Base plate for a foot pedal
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
JP1700776S (zh) * 2021-03-04 2021-11-29
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (163)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
CA2061119C (en) 1991-04-19 1998-02-03 Pei-Ing P. Lee Method of depositing conductors in high aspect ratio apertures
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
US5958193A (en) 1994-02-01 1999-09-28 Vlsi Technology, Inc. Sputter deposition with mobile collimator
JPH07335552A (ja) 1994-06-08 1995-12-22 Tel Varian Ltd 処理装置
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
US5643428A (en) 1995-02-01 1997-07-01 Advanced Micro Devices, Inc. Multiple tier collimator system for enhanced step coverage and uniformity
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
US5702573A (en) 1996-01-29 1997-12-30 Varian Associates, Inc. Method and apparatus for improved low pressure collimated magnetron sputter deposition of metal films
US5705042A (en) 1996-01-29 1998-01-06 Micron Technology, Inc. Electrically isolated collimator and method
USD411516S (en) 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
AU129071S (en) * 1996-06-07 1997-01-14 Riteflite Pty Ltd Target
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US6362097B1 (en) 1998-07-14 2002-03-26 Applied Komatsu Technlology, Inc. Collimated sputtering of semiconductor and other films
JP3551867B2 (ja) 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
TWM267462U (en) 2000-07-17 2005-06-11 Dura Tek Inc Collimator for sputtering apparatus
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
US20030015421A1 (en) 2001-07-20 2003-01-23 Applied Materials, Inc. Collimated sputtering of cobalt
US20030029715A1 (en) 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
JP2005504885A (ja) 2001-07-25 2005-02-17 アプライド マテリアルズ インコーポレイテッド 新規なスパッタ堆積方法を使用したバリア形成
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
KR20050092703A (ko) 2002-12-16 2005-09-22 이화이어 테크놀로지 코포레이션 복합구조 스퍼터링 타겟 및 형광체 증착방법
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (ja) 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
EP1719167B1 (en) 2004-02-13 2011-10-26 ASM America, Inc. Substrate support system for reduced autodoping and backside deposition
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
EP1710324B1 (en) 2005-04-08 2008-12-03 STMicroelectronics S.r.l. PVD process and chamber for the pulsed deposition of a chalcogenide material layer of a phase change memory device
USD572733S1 (en) 2005-07-29 2008-07-08 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
USD571831S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571383S1 (en) 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
US7355192B2 (en) 2006-03-30 2008-04-08 Intel Corporation Adjustable suspension assembly for a collimating lattice
USD545853S1 (en) 2006-03-30 2007-07-03 Dave Hawley Plasma gun nozzle retention ring
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US20080121620A1 (en) 2006-11-24 2008-05-29 Guo G X Processing chamber
USD582949S1 (en) 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
TWM346018U (en) 2008-03-14 2008-12-01 Everlight Electronics Co Ltd Alterable gear collimator
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
KR20200067957A (ko) 2008-04-16 2020-06-12 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 프로세싱 증착 차폐 컴포넌트들
JP5676429B2 (ja) 2008-04-21 2015-02-25 ハネウェル・インターナショナル・インコーポレーテッド Dcマグネトロンスパッタリングシステムの設計および使用
US20090308739A1 (en) 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
WO2009155208A2 (en) 2008-06-17 2009-12-23 Applied Materials, Inc. Apparatus and method for uniform deposition
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
USD598717S1 (en) 2008-09-19 2009-08-25 Dart Industries Inc. Can strainer
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (zh) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
JP6195519B2 (ja) 2010-08-06 2017-09-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 静電チャック及びその使用方法
CA140095S (en) 2010-10-29 2011-11-21 Unilever Plc Tea capsule
TWD146490S (zh) 2011-01-12 2012-04-21 荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (zh) 2011-09-20 2015-04-06
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD665071S1 (en) 2012-01-25 2012-08-07 Applied Materials, Inc. Deposition chamber liner
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
EP2841619A4 (en) 2012-04-26 2015-06-03 Intevac Inc ENGINE SOURCE FOR PROCESSING PHYSICAL STEAM SEPARATION
KR20130131120A (ko) 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
TWD159675S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD159676S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD159673S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
TWD159674S (zh) 2012-11-30 2014-04-01 日立國際電氣股份有限公司 基板處理裝置用廻轉器
CN105008582A (zh) * 2013-01-04 2015-10-28 东曹Smd有限公司 具有增强的表面轮廓和改善的性能的硅溅射靶及其制造方法
TWD166552S (zh) 2013-01-25 2015-03-11 日立國際電氣股份有限公司 基板處理裝置用氣化器
FR3002241B1 (fr) 2013-02-21 2015-11-20 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
FR3002242B1 (fr) 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (zh) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD759603S1 (en) 2013-07-17 2016-06-21 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
TWD165428S (zh) 2013-07-17 2015-01-11 紐富來科技股份有限公司 帶電粒子束描繪裝置用腔室
USD754468S1 (en) * 2013-07-23 2016-04-26 Michael F. Nason Disposable splatter shield
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9831074B2 (en) 2013-10-24 2017-11-28 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
USD732145S1 (en) 2014-02-04 2015-06-16 Asm Ip Holding B.V. Shower plate
USD724701S1 (en) 2014-02-04 2015-03-17 ASM IP Holding, B.V. Shower plate
USD746647S1 (en) 2014-03-13 2016-01-05 Vienar Roaks Strainer
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
WO2016018505A1 (en) 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
US9543126B2 (en) 2014-11-26 2017-01-10 Applied Materials, Inc. Collimator for use in substrate processing chambers
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
JP1534914S (zh) 2014-12-22 2015-10-13
JP1535123S (zh) 2014-12-22 2015-10-13
JP1534915S (zh) 2014-12-22 2015-10-13
USD753449S1 (en) 2015-01-06 2016-04-12 WineStor, LLC Strainer for beverage shaker
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (zh) 2015-06-10 2016-03-07
JP1551512S (zh) 2015-06-12 2016-06-13
JP1546801S (zh) 2015-06-12 2016-03-28
JP1546799S (zh) 2015-06-12 2016-03-28
JP1546800S (zh) 2015-06-12 2016-03-28
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1549882S (zh) 2015-08-18 2016-05-23
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
KR20240127488A (ko) 2015-10-27 2024-08-22 어플라이드 머티어리얼스, 인코포레이티드 Pvd 스퍼터 챔버를 위한 바이어스가능 플럭스 최적화기/콜리메이터
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178699S (zh) * 2016-01-08 2016-10-01 Asm Ip Holding Bv 用於半導體製造設備的氣體分散板
TWD178424S (zh) 2016-01-08 2016-09-21 Asm Ip Holding Bv 用於半導體製造設備的氣流控制板
TWD178698S (zh) 2016-01-08 2016-10-01 Asm Ip Holding Bv 用於半導體製造設備的反應器外壁
JP1564934S (zh) 2016-02-26 2016-12-05
USD790039S1 (en) 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD794753S1 (en) 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD805700S1 (en) 2016-06-06 2017-12-19 Joe J. Owens, III Pet food bowl
USD804230S1 (en) * 2016-06-23 2017-12-05 Cbd Consolidated Llc Bench top gripping device
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD821140S1 (en) 2016-12-27 2018-06-26 Tristar Products, Inc. Steamer plate
CN206573738U (zh) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 低损耗光纤
US10662520B2 (en) 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10811232B2 (en) 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD197827S (zh) 2017-12-19 2019-06-01 日商荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Also Published As

Publication number Publication date
USD937329S1 (en) 2021-11-30
TWD215707S (zh) 2021-12-01
USD970566S1 (en) 2022-11-22
JP1702035S (zh) 2021-12-13
JP1685527S (zh) 2021-05-17

Similar Documents

Publication Publication Date Title
TWD227747S (zh) 物理氣相沉積腔室的濺射靶材
TWD217597S (zh) 用於物理氣相沉積腔室的濺射靶
TWD232372S (zh) 用於物理氣相沉積腔室的靶材
TWD203691S (zh) 用於物理氣相沉積腔室靶材的靶材輪廓
TWD211969S (zh) 用於物理氣相沉積(pvd)腔室中的準直器
TWD202102S (zh) 用於物理氣相沉積(pvd)腔室中的準直器
TWD207742S (zh) 用於基材處理室的處理遮罩件
TWD209650S (zh) Pvd腔的沉積環
TWD215403S (zh) 用於基板處理腔室的沉積環
TWD197321S (zh) 物理氣相沉積室靶
TWD210245S (zh) 戰術霰彈槍
MY171465A (en) Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates
WO2006052931A3 (en) Physical vapor deposition chamber having a rotatable substrate pedestal
TWD226530S (zh) 用於物理氣相沉積腔室的靶材
TWD217076S (zh) 光學反射式瞄準器之部分
TWD227585S (zh) 用於物理氣相沉積(pvd)腔室的準直器
TWD211584S (zh) 用於基板處理腔室的下屏蔽件
TWD206011S (zh) 包裝用膜
TWD232857S (zh) 物理汽相沉積腔室靶材
TWD232373S (zh) 用於物理氣相沉積腔室的靶材
TWD224062S (zh) 噴槍
TWD227252S (zh) 基板處理腔室用的基板支撐件
TWD231100S (zh) 長槍盒
TWD230594S (zh) 處理腔室淨洗板
TWD226869S (zh) 多門收納箱