TWD197321S - 物理氣相沉積室靶 - Google Patents

物理氣相沉積室靶

Info

Publication number
TWD197321S
TWD197321S TW107303086F TW107303086F TWD197321S TW D197321 S TWD197321 S TW D197321S TW 107303086 F TW107303086 F TW 107303086F TW 107303086 F TW107303086 F TW 107303086F TW D197321 S TWD197321 S TW D197321S
Authority
TW
Taiwan
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
Prior art date
Application number
TW107303086F
Other languages
English (en)
Inventor
Martin Lee Riker
Fuhong Zhang
Zheng Wang
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD197321S publication Critical patent/TWD197321S/zh

Links

Abstract

【物品用途】;本設計係應用於物理氣相沉積室靶。;【設計說明】;圖式第8頁,係圖示出沿著第2頁俯視圖中的8-8線的剖面圖。
TW107303086F 2017-12-11 2018-06-01 物理氣相沉積室靶 TWD197321S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/629,062 USD868124S1 (en) 2017-12-11 2017-12-11 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
TWD197321S true TWD197321S (zh) 2019-05-01

Family

ID=67390873

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107303086F TWD197321S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶
TW107303087F TWD197322S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107303087F TWD197322S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶

Country Status (3)

Country Link
US (2) USD868124S1 (zh)
JP (2) JP1651698S (zh)
TW (2) TWD197321S (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
JP1655453S (zh) * 2019-06-17 2020-03-23
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD926942S1 (en) * 2020-01-28 2021-08-03 Universal Flow Monitors, Inc. Flow control plate
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
JP1684468S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
JP1700776S (zh) * 2021-03-04 2021-11-29
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) * 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) * 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
AU129071S (en) * 1996-06-07 1997-01-14 Riteflite Pty Ltd Target
US6114216A (en) * 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) * 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) * 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (ja) 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD446231S1 (en) * 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
US6638402B2 (en) * 2001-06-05 2003-10-28 Praxair S.T. Technology, Inc. Ring-type sputtering target
USD487254S1 (en) * 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
DE60308550T2 (de) 2002-12-16 2007-06-06 Ifire Technology Corp., Fort Saskatchewan Zusammengesetztes zerstäubungs-target und phosphor-abscheidungsmethode
USD496951S1 (en) * 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) * 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (ja) 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
WO2005081283A2 (en) 2004-02-13 2005-09-01 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD571833S1 (en) * 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
USD571383S1 (en) * 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571831S1 (en) * 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD572733S1 (en) * 2005-07-29 2008-07-08 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD545851S1 (en) * 2006-03-30 2007-07-03 Dave Hawley Plasma gun nozzle holder
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
USD582949S1 (en) * 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
WO2009154853A2 (en) * 2008-04-16 2009-12-23 Applied Materials, Inc. Wafer processing deposition shielding components
WO2009151767A2 (en) * 2008-04-21 2009-12-17 Honeywell International Inc. Design and use of dc magnetron sputtering systems
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8070925B2 (en) * 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) * 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (zh) * 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9181619B2 (en) * 2010-02-26 2015-11-10 Fujifilm Corporation Physical vapor deposition with heat diffuser
JP6195519B2 (ja) * 2010-08-06 2017-09-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 静電チャック及びその使用方法
TWD146490S (zh) 2011-01-12 2012-04-21 荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (zh) * 2011-09-20 2015-04-06
USD669509S1 (en) * 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) * 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
KR20130131120A (ko) 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
KR20150101470A (ko) * 2013-01-04 2015-09-03 토소우 에스엠디, 인크 보강된 표면 프로파일 및 개선된 성능을 갖는 실리콘 스퍼터링 타겟 및 그 제조 방법
FR3002242B1 (fr) 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
FR3002241B1 (fr) 2013-02-21 2015-11-20 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
US9534286B2 (en) * 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD808349S1 (en) * 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (zh) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD754468S1 (en) * 2013-07-23 2016-04-26 Michael F. Nason Disposable splatter shield
US9779920B2 (en) * 2013-08-14 2017-10-03 Applied Materials, Inc. Sputtering target with backside cooling grooves
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
WO2016018505A1 (en) * 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) * 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (zh) * 2015-06-10 2016-03-07
JP1546800S (zh) 2015-06-12 2016-03-28
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1549882S (zh) 2015-08-18 2016-05-23
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178699S (zh) * 2016-01-08 2016-10-01 Asm知識產權私人控股有限公司 用於半導體製造設備的氣體分散板
TWD178424S (zh) * 2016-01-08 2016-09-21 Asm知識產權私人控股有限公司 用於半導體製造設備的氣流控制板
USD790039S1 (en) 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD794753S1 (en) 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD804230S1 (en) * 2016-06-23 2017-12-05 Cbd Consolidated Llc Bench top gripping device
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (zh) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 低损耗光纤
US10662520B2 (en) 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10811232B2 (en) 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD197827S (zh) 2017-12-19 2019-06-01 日商荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
JP1716516S (ja) 2021-11-25 2022-06-02 包装用袋

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Also Published As

Publication number Publication date
TWD197322S (zh) 2019-05-01
JP1651698S (zh) 2020-01-27
USD946638S1 (en) 2022-03-22
JP1637543S (zh) 2019-07-29
USD868124S1 (en) 2019-11-26

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