JP1700776S - - Google Patents
Info
- Publication number
- JP1700776S JP1700776S JPD2021-4536F JP2021004536F JP1700776S JP 1700776 S JP1700776 S JP 1700776S JP 2021004536 F JP2021004536 F JP 2021004536F JP 1700776 S JP1700776 S JP 1700776S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-4536F JP1700776S (zh) | 2021-03-04 | 2021-03-04 | |
| TW110304382F TWD217375S (zh) | 2021-03-04 | 2021-08-20 | 基板處理裝置用基板載置盤 |
| US29/806,527 USD981970S1 (en) | 2021-03-04 | 2021-09-03 | Substrate mounting plate for substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-4536F JP1700776S (zh) | 2021-03-04 | 2021-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1700776S true JP1700776S (zh) | 2021-11-29 |
Family
ID=78766342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2021-4536F Active JP1700776S (zh) | 2021-03-04 | 2021-03-04 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD981970S1 (zh) |
| JP (1) | JP1700776S (zh) |
| TW (1) | TWD217375S (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1002336S1 (en) * | 2022-02-07 | 2023-10-24 | Christopher L. Moore | Anode mounting plate |
| USD1022667S1 (en) * | 2023-12-21 | 2024-04-16 | Guangdong Yupin Industrial Co., Ltd | Cover plate |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| US8133368B2 (en) * | 2008-10-31 | 2012-03-13 | Applied Materials, Inc. | Encapsulated sputtering target |
| USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| TWD178699S (zh) * | 2016-01-08 | 2016-10-01 | ＡＳＭ知識產權私人控股有	 | 用於半導體製造設備的氣體分散板 |
| USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
-
2021
- 2021-03-04 JP JPD2021-4536F patent/JP1700776S/ja active Active
- 2021-08-20 TW TW110304382F patent/TWD217375S/zh unknown
- 2021-09-03 US US29/806,527 patent/USD981970S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD981970S1 (en) | 2023-03-28 |
| TWD217375S (zh) | 2022-02-21 |