TWD217375S - 基板處理裝置用基板載置盤 - Google Patents

基板處理裝置用基板載置盤 Download PDF

Info

Publication number
TWD217375S
TWD217375S TW110304382F TW110304382F TWD217375S TW D217375 S TWD217375 S TW D217375S TW 110304382 F TW110304382 F TW 110304382F TW 110304382 F TW110304382 F TW 110304382F TW D217375 S TWD217375 S TW D217375S
Authority
TW
Taiwan
Prior art keywords
substrate
processing apparatus
mounting plate
substrate processing
article
Prior art date
Application number
TW110304382F
Other languages
English (en)
Inventor
稲田哲明
保井毅
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD217375S publication Critical patent/TWD217375S/zh

Links

Images

Abstract

【物品用途】;本設計的物品是基板處理裝置用基板載置盤，係在基板處理裝置中，設置在下部加熱器之上使用，用以將來自下部加熱器的熱能均勻地傳導到被載置在本物品上的基板。;【設計說明】;(無)

Description

基板處理裝置用基板載置盤
本設計的物品是基板處理裝置用基板載置盤，係在基板處理裝置中，設置在下部加熱器之上使用，用以將來自下部加熱器的熱能均勻地傳導到被載置在本物品上的基板。
(無)
TW110304382F 2021-03-04 2021-08-20 基板處理裝置用基板載置盤 TWD217375S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-004536 2021-03-04
JPD2021-4536F JP1700776S (zh) 2021-03-04 2021-03-04

Publications (1)

Publication Number Publication Date
TWD217375S true TWD217375S (zh) 2022-02-21

Family

ID=78766342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110304382F TWD217375S (zh) 2021-03-04 2021-08-20 基板處理裝置用基板載置盤

Country Status (3)

Country Link
US (1) USD981970S1 (zh)
JP (1) JP1700776S (zh)
TW (1) TWD217375S (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD945606S1 (en) * 2020-02-21 2022-03-08 American Sterilizer Company Mounting plate
USD1002336S1 (en) * 2022-02-07 2023-10-24 Christopher L. Moore Anode mounting plate
USD1022667S1 (en) * 2023-12-21 2024-04-16 Guangdong Yupin Industrial Co., Ltd Cover plate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD583394S1 (en) * 2006-12-15 2008-12-23 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US8133368B2 (en) * 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD178699S (zh) * 2016-01-08 2016-10-01 Asm Ip Holding Bv 用於半導體製造設備的氣體分散板
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Also Published As

Publication number Publication date
JP1700776S (zh) 2021-11-29
USD981970S1 (en) 2023-03-28

Similar Documents

Publication Publication Date Title
TWD217375S (zh) 基板處理裝置用基板載置盤
TWD212933S (zh) 用於處理腔室基板支撐件的基底板
TWD204733S (zh) 皮膚治療儀的遙控器
TWD224469S (zh) 基板支撐件的基底板
TWD206653S (zh) 基板處理裝置用吸頂式加熱器的保持板
TWD206115S (zh) 用於支撐電子裝置之配接器
TWD217779S (zh) 基板處理裝置用置頂式加熱器
TWD207362S (zh) 半導體製造用之晶圓用的支撐器具
EP1944793A3 (en) Temperature measurement and control of wafer support in thermal processing chamber
TW201012306A (en) Temperature controlled hot edge ring assembly
TWD217778S (zh) 基板處理裝置用置頂式加熱器
TWD197827S (zh) 半導體晶圓研磨用彈性膜
TWD210557S (zh) 熱製程用承載盤
WO2002093623A3 (en) Assembly comprising heat distributing plate and edge support
TWD192485S (zh) Rotator for substrate processing apparatus
TWD217060S (zh) 基板處理裝置的外殼系統擱板
TWD218313S (zh) 電子設備支架
TWD215922S (zh) 基板處理裝置用氣體導入管
TWD225036S (zh) 基板處理裝置用隔熱板
TW200735260A (en) Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewith
TWD228269S (zh) 基板處理裝置用基板保持具
JPS5750423A (en) Vapor phase growth device
TWD212772S (zh) 基板處理裝置用吸頂式加熱器的保持板
TW202124629A (zh) 用於ｌｅｄ晶圓級封裝之複合膜
US6753180B1 (en) Clonal replication system