TWD207362S - 半導體製造用之晶圓用的支撐器具 - Google Patents

半導體製造用之晶圓用的支撐器具 Download PDF

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Publication number
TWD207362S
TWD207362S TW108306786F TW108306786F TWD207362S TW D207362 S TWD207362 S TW D207362S TW 108306786 F TW108306786 F TW 108306786F TW 108306786 F TW108306786 F TW 108306786F TW D207362 S TWD207362 S TW D207362S
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Taiwan
Prior art keywords
semiconductor manufacturing
support tool
semiconductor
wafer
design
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TW108306786F
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English (en)
Inventor
岡部晃
竹永幸生
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日商愛必克股份有限公司
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Publication of TWD207362S publication Critical patent/TWD207362S/zh

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Abstract

【物品用途】;根據本設計之物品係一種半導體製造用之晶圓用的支撐器具，其用於半導體製造裝置之中的薄膜晶體生長技術之磊晶生長裝置的反應腔之中。此半導體製造用之晶圓用的支撐器具係支撐供承載半導體晶圓的承載盤。以承載盤的頂面承載半導體晶圓，並且對半導體晶圓加熱而使半導體晶圓的薄膜生長。;【設計說明】;本案之「半導體製造用之晶圓用的支撐器具」設計如附圖所示。

Description

半導體製造用之晶圓用的支撐器具
根據本設計之物品係一種半導體製造用之晶圓用的支撐器具，其用於半導體製造裝置之中的薄膜晶體生長技術之磊晶生長裝置的反應腔之中。此半導體製造用之晶圓用的支撐器具係支撐供承載半導體晶圓的承載盤。以承載盤的頂面承載半導體晶圓，並且對半導體晶圓加熱而使半導體晶圓的薄膜生長。
本案之「半導體製造用之晶圓用的支撐器具」設計如附圖所示。
TW108306786F 2019-07-29 2019-11-04 半導體製造用之晶圓用的支撐器具 TWD207362S (zh)

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JPD2019-16842F JP1651258S (zh) 2019-07-29 2019-07-29
JP2019-016842 2019-07-29

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TWD207362S true TWD207362S (zh) 2020-09-21

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD975665S1 (en) * 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD947913S1 (en) * 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD965044S1 (en) * 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD953309S1 (en) * 2020-03-11 2022-05-31 Zhicheng Zhou TV antenna
JP1706322S (zh) * 2021-08-27 2022-01-31

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US6572814B2 (en) * 1998-09-08 2003-06-03 Applied Materials Inc. Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
US7204887B2 (en) * 2000-10-16 2007-04-17 Nippon Steel Corporation Wafer holding, wafer support member, wafer boat and heat treatment furnace
JP2004207606A (ja) * 2002-12-26 2004-07-22 Disco Abrasive Syst Ltd ウェーハサポートプレート
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
US10854498B2 (en) * 2011-07-15 2020-12-01 Asm Ip Holding B.V. Wafer-supporting device and method for producing same
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USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD864134S1 (en) * 2018-10-24 2019-10-22 Asm Ip Holding B.V. Susceptor

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JP1651258S (zh) 2020-01-27
USD926715S1 (en) 2021-08-03

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