USD868124S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target Download PDF

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Publication number
USD868124S1
USD868124S1 US29/629,062 US201729629062F USD868124S US D868124 S1 USD868124 S1 US D868124S1 US 201729629062 F US201729629062 F US 201729629062F US D868124 S USD868124 S US D868124S
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target
vapor deposition
physical vapor
deposition chamber
profile
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Martin Lee Riker
Fuhong Zhang
Zheng Wang
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Applied Materials Inc
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Applied Materials Inc
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Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RIKER, MARTIN LEE, WANG, ZHENG, ZHANG, FUHONG
Priority to TW107303087F priority patent/TWD197322S/zh
Priority to TW107303086F priority patent/TWD197321S/zh
Priority to JPD2019-5061F priority patent/JP1651698S/ja
Priority to JPD2018-12609F priority patent/JP1637543S/ja
Priority to US29/714,564 priority patent/USD946638S1/en
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US29/629,062 2017-12-11 2017-12-11 Target profile for a physical vapor deposition chamber target Active USD868124S1 (en)

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US29/629,062 USD868124S1 (en) 2017-12-11 2017-12-11 Target profile for a physical vapor deposition chamber target
TW107303087F TWD197322S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶
TW107303086F TWD197321S (zh) 2017-12-11 2018-06-01 物理氣相沉積室靶
JPD2019-5061F JP1651698S (zh) 2017-12-11 2018-06-08
JPD2018-12609F JP1637543S (zh) 2017-12-11 2018-06-08
US29/714,564 USD946638S1 (en) 2017-12-11 2019-11-25 Target profile for a physical vapor deposition chamber target

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USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD926942S1 (en) * 2020-01-28 2021-08-03 Universal Flow Monitors, Inc. Flow control plate
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device

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USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
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USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

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