TWD188898S - 物理氣相沉積室靶 - Google Patents

物理氣相沉積室靶

Info

Publication number
TWD188898S
TWD188898S TW106301373F TW106301373F TWD188898S TW D188898 S TWD188898 S TW D188898S TW 106301373 F TW106301373 F TW 106301373F TW 106301373 F TW106301373 F TW 106301373F TW D188898 S TWD188898 S TW D188898S
Authority
TW
Taiwan
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
design
Prior art date
Application number
TW106301373F
Other languages
English (en)
Inventor
馬丁李 萊克
張富宏
王曉東
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TWD188898S publication Critical patent/TWD188898S/zh

Links

Abstract

【物品用途】;本設計係應用於物理氣相沉積室靶。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式第8頁，係圖示出沿著第2頁俯視圖中的8-8線的剖面圖。

Description

物理氣相沉積室靶
本設計係應用於物理氣相沉積室靶。
圖式所揭露之虛線部分，為本案不主張設計之部分。
圖式第8頁，係圖示出沿著第2頁俯視圖中的8-8線的剖面圖。
TW106301373F 2016-09-30 2017-03-17 物理氣相沉積室靶 TWD188898S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/579,470 2016-09-30
US29/579,470 USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
TWD188898S true TWD188898S (zh) 2018-03-01

Family

ID=61066246

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106301373D01F TWD191626S (zh) 2016-09-30 2017-03-17 物理氣相沉積室靶
TW106301373F TWD188898S (zh) 2016-09-30 2017-03-17 物理氣相沉積室靶

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW106301373D01F TWD191626S (zh) 2016-09-30 2017-03-17 物理氣相沉積室靶

Country Status (3)

Country Link
US (2) USD836572S1 (zh)
JP (2) JP1599074S (zh)
TW (2) TWD191626S (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202101S (zh) 2018-03-09 2020-01-11 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD212866S (zh) 2020-05-20 2021-07-21 美商應用材料股份有限公司 可替換基板載具接面膜
TWD214766S (zh) 2019-08-26 2021-10-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的濺射靶
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862539S1 (en) * 2017-12-04 2019-10-08 Liqua-Tech Corporation Register gear adapter plate
USD851144S1 (en) * 2017-12-04 2019-06-11 Liqua-Tech Corporation Register gear adapter plate
USD851693S1 (en) * 2017-12-04 2019-06-18 Liqua-Tech Corporation Register gear adapter plate
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1638282S (zh) * 2018-09-20 2019-08-05
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
JP1655453S (zh) * 2019-06-17 2020-03-23
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber
JP1700776S (zh) * 2021-03-04 2021-11-29
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (ja) * 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
DE60308550T2 (de) 2002-12-16 2007-06-06 Ifire Technology Corp., Fort Saskatchewan Zusammengesetztes zerstäubungs-target und phosphor-abscheidungsmethode
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (ja) * 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
WO2005081283A2 (en) * 2004-02-13 2005-09-01 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
WO2009154853A2 (en) 2008-04-16 2009-12-23 Applied Materials, Inc. Wafer processing deposition shielding components
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (zh) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
JP6195519B2 (ja) 2010-08-06 2017-09-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック及びその使用方法
TWD146490S (zh) 2011-01-12 2012-04-21 荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) * 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
KR20130131120A (ko) * 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
FR3002242B1 (fr) 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
FR3002241B1 (fr) 2013-02-21 2015-11-20 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (zh) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
WO2016018505A1 (en) 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (zh) 2015-06-10 2016-03-07
JP1546800S (zh) * 2015-06-12 2016-03-28
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1549882S (zh) 2015-08-18 2016-05-23
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD830434S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178424S (zh) 2016-01-08 2016-09-21 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備的氣流控制板
TWD178699S (zh) 2016-01-08 2016-10-01 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備的氣體分散板
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (zh) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 低损耗光纤
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202101S (zh) 2018-03-09 2020-01-11 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
TWD203691S (zh) 2018-03-09 2020-04-01 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD207532S (zh) 2018-12-17 2020-10-01 美商應用材料股份有限公司 Pvd腔的沉積環
TWD209650S (zh) 2018-12-17 2021-02-01 美商應用材料股份有限公司 Pvd腔的沉積環
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
TWD214766S (zh) 2019-08-26 2021-10-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的濺射靶
TWD212866S (zh) 2020-05-20 2021-07-21 美商應用材料股份有限公司 可替換基板載具接面膜

Also Published As

Publication number Publication date
USD836572S1 (en) 2018-12-25
JP1596742S (zh) 2018-02-05
USD869409S1 (en) 2019-12-10
TWD191626S (zh) 2018-07-11
JP1599074S (zh) 2018-03-05

Similar Documents

Publication Publication Date Title
TWD188898S (zh) 物理氣相沉積室靶
TWD197322S (zh) 物理氣相沉積室靶
TWD180764S (zh) 物理氣相沈積室靶之部分
TWD190586S (zh) 手槍
TWD203691S (zh) 用於物理氣相沉積腔室靶材的靶材輪廓
TWD192046S (zh) 手槍
TWD187539S (zh) 鞋之部分
TWD192290S (zh) 鞋墊
TWD187540S (zh) 鞋之部分
TWD191714S (zh) 鞋之部分
TWD192252S (zh) 控制器
TWD187845S (zh) 控制器
TWD188324S (zh) 控制器
TWD192667S (zh) 電腦
TWD173627S (zh) 鎖具飾蓋之部分
TWD192668S (zh) 電腦
TWD192666S (zh) 電腦
TWD175696S (zh) 鎖具飾蓋之部分
TWD190637S (zh) 鞋面
TWD190390S (zh) 手槍
TWD192902S (zh) 鞋之部分
TWD192846S (zh) 電腦
TWD190433S (zh) 鼻管組件之部分
TWD171640S (zh) 鎖具飾蓋之部分
TWD191357S (zh) 把手之部分