TWD202101S - 用於物理氣相沉積腔室靶材的靶材輪廓 - Google Patents

用於物理氣相沉積腔室靶材的靶材輪廓 Download PDF

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Publication number
TWD202101S
TWD202101S TW107305358F TW107305358F TWD202101S TW D202101 S TWD202101 S TW D202101S TW 107305358 F TW107305358 F TW 107305358F TW 107305358 F TW107305358 F TW 107305358F TW D202101 S TWD202101 S TW D202101S
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Taiwan
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target
vapor deposition
physical vapor
deposition chamber
profile
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TW107305358F
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English (en)
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威廉R 喬韓森
基倫古莫妮拉珊卓拉 沙芬戴亞
布拉尚普拉巴卡 卜拉布
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美商應用材料股份有限公司
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Publication of TWD202101S publication Critical patent/TWD202101S/zh

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Abstract

【物品用途】;本設計所請求為用於物理氣相沉積腔室的靶材。;【設計說明】;9-9剖面圖為仰視圖中之9-9剖面示意圖。

Description

用於物理氣相沉積腔室靶材的靶材輪廓
本設計所請求為用於物理氣相沉積腔室的靶材。
9-9剖面圖為仰視圖中之9-9剖面示意圖。
TW107305358F 2018-03-09 2018-09-10 用於物理氣相沉積腔室靶材的靶材輪廓 TWD202101S (zh)

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US29/639,953 2018-03-09
US29/639,953 USD877101S1 (en) 2018-03-09 2018-03-09 Target profile for a physical vapor deposition chamber target

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TWD202101S true TWD202101S (zh) 2020-01-11

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TW107305358F TWD202101S (zh) 2018-03-09 2018-09-10 用於物理氣相沉積腔室靶材的靶材輪廓
TW108303594F TWD203691S (zh) 2018-03-09 2018-09-10 用於物理氣相沉積腔室靶材的靶材輪廓

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
TWD226530S (zh) 2021-05-07 2023-07-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的靶材

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10746511B2 (en) 2017-11-06 2020-08-18 JMA Outdoors, Inc. Apparatus for generating a vitals target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD917003S1 (en) * 2018-06-06 2021-04-20 JMA Outdoors, Inc. Simulating target
JP1646505S (zh) * 2018-12-07 2019-11-25
USD904640S1 (en) * 2019-01-21 2020-12-08 Applied Materials, Inc. Substrate carrier
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
JP1655453S (zh) * 2019-06-17 2020-03-23
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD1012873S1 (en) * 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
JP1700776S (zh) * 2021-03-04 2021-11-29

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200420193A (en) 2002-12-16 2004-10-01 Ifire Technology Inc Composite sputter target and phosphor deposition method
TW201525172A (zh) 2013-12-18 2015-07-01 Applied Materials Inc 具有低摩擦墊之物理氣相沉積標靶
TWD188898S (zh) 2016-09-30 2018-03-01 應用材料股份有限公司 物理氣相沉積室靶

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) * 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD411516S (en) 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (ja) 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (ja) 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
KR101112029B1 (ko) 2004-02-13 2012-03-21 에이에스엠 아메리카, 인코포레이티드 자동 도핑 및 후면 증착의 감소를 위한 기판 지지 시스템
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD571833S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
USD571831S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD572733S1 (en) 2005-07-29 2008-07-08 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571383S1 (en) 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) * 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD545851S1 (en) 2006-03-30 2007-07-03 Dave Hawley Plasma gun nozzle holder
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
USD582949S1 (en) 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20090260982A1 (en) 2008-04-16 2009-10-22 Applied Materials, Inc. Wafer processing deposition shielding components
US8398833B2 (en) 2008-04-21 2013-03-19 Honeywell International Inc. Use of DC magnetron sputtering systems
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) * 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (zh) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
WO2012019017A2 (en) 2010-08-06 2012-02-09 Applied Materials, Inc. Electrostatic chuck and methods of use thereof
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (zh) 2011-09-20 2015-04-06
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
KR20130131120A (ko) 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
JP5875950B2 (ja) * 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
WO2014107558A1 (en) 2013-01-04 2014-07-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
FR3002242B1 (fr) 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
FR3002241B1 (fr) 2013-02-21 2015-11-20 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (zh) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD732145S1 (en) 2014-02-04 2015-06-16 Asm Ip Holding B.V. Shower plate
USD724701S1 (en) 2014-02-04 2015-03-17 ASM IP Holding, B.V. Shower plate
USD741921S1 (en) * 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
US9991101B2 (en) 2014-07-29 2018-06-05 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (zh) 2015-06-10 2016-03-07
JP1546800S (zh) 2015-06-12 2016-03-28
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1549882S (zh) 2015-08-18 2016-05-23
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178424S (zh) 2016-01-08 2016-09-21 ASM知識產權私人控股有&#x9 用於半導體製造設備的氣流控制板
TWD178699S (zh) 2016-01-08 2016-10-01 ASM知識產權私人控股有&#x9 用於半導體製造設備的氣體分散板
TWD178425S (zh) * 2016-01-08 2016-09-21 ASM知識產權私人控股有&#x9 用於半導體製造設備的電極板
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (zh) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 低损耗光纤
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD860747S1 (en) * 2017-10-16 2019-09-24 William P. Russo Tapered segment diamond blade
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200420193A (en) 2002-12-16 2004-10-01 Ifire Technology Inc Composite sputter target and phosphor deposition method
TW201525172A (zh) 2013-12-18 2015-07-01 Applied Materials Inc 具有低摩擦墊之物理氣相沉積標靶
TWD188898S (zh) 2016-09-30 2018-03-01 應用材料股份有限公司 物理氣相沉積室靶
TWD191626S (zh) 2016-09-30 2018-07-11 應用材料股份有限公司 物理氣相沉積室靶

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD226530S (zh) 2021-05-07 2023-07-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的靶材
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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Publication number Publication date
TWD203691S (zh) 2020-04-01
USD877101S1 (en) 2020-03-03
JP1640252S (zh) 2019-09-02
JP1651699S (zh) 2020-01-27
USD902165S1 (en) 2020-11-17

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