USD877101S1 - Target profile for a physical vapor deposition chamber target - Google Patents
Target profile for a physical vapor deposition chamber target Download PDFInfo
- Publication number
- USD877101S1 USD877101S1 US29/639,953 US201829639953F USD877101S US D877101 S1 USD877101 S1 US D877101S1 US 201829639953 F US201829639953 F US 201829639953F US D877101 S USD877101 S US D877101S
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- US
- United States
- Prior art keywords
- target
- vapor deposition
- physical vapor
- deposition chamber
- profile
- Prior art date
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Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/639,953 USD877101S1 (en) | 2018-03-09 | 2018-03-09 | Target profile for a physical vapor deposition chamber target |
JPD2019-5062F JP1651699S (zh) | 2018-03-09 | 2018-09-07 | |
JPD2018-19579F JP1640252S (zh) | 2018-03-09 | 2018-09-07 | |
TW108303594F TWD203691S (zh) | 2018-03-09 | 2018-09-10 | 用於物理氣相沉積腔室靶材的靶材輪廓 |
TW107305358F TWD202101S (zh) | 2018-03-09 | 2018-09-10 | 用於物理氣相沉積腔室靶材的靶材輪廓 |
US29/726,094 USD902165S1 (en) | 2018-03-09 | 2020-02-28 | Target profile for a physical vapor deposition chamber target |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/639,953 USD877101S1 (en) | 2018-03-09 | 2018-03-09 | Target profile for a physical vapor deposition chamber target |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/726,094 Division USD902165S1 (en) | 2018-03-09 | 2020-02-28 | Target profile for a physical vapor deposition chamber target |
Publications (1)
Publication Number | Publication Date |
---|---|
USD877101S1 true USD877101S1 (en) | 2020-03-03 |
Family
ID=67769548
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/639,953 Active USD877101S1 (en) | 2018-03-09 | 2018-03-09 | Target profile for a physical vapor deposition chamber target |
US29/726,094 Active USD902165S1 (en) | 2018-03-09 | 2020-02-28 | Target profile for a physical vapor deposition chamber target |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/726,094 Active USD902165S1 (en) | 2018-03-09 | 2020-02-28 | Target profile for a physical vapor deposition chamber target |
Country Status (3)
Country | Link |
---|---|
US (2) | USD877101S1 (zh) |
JP (2) | JP1651699S (zh) |
TW (2) | TWD203691S (zh) |
Cited By (19)
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USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD904640S1 (en) * | 2019-01-21 | 2020-12-08 | Applied Materials, Inc. | Substrate carrier |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD917003S1 (en) * | 2018-06-06 | 2021-04-20 | JMA Outdoors, Inc. | Simulating target |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US11415396B2 (en) | 2017-11-06 | 2022-08-16 | JMA Outdoors, Inc. | Apparatus for generating a vitals target |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD981970S1 (en) * | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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USD1012873S1 (en) * | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
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USD503729S1 (en) | 2003-10-31 | 2005-04-05 | Nordson Corporation | Nozzle for dispensing adhesives and sealants |
US20050152089A1 (en) | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same |
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US20070076345A1 (en) * | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
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USD614593S1 (en) | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
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USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
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USD669509S1 (en) | 2011-10-19 | 2012-10-23 | Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts | Nozzle for torch |
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US20140261180A1 (en) | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Pvd target for self-centering process shield |
USD716742S1 (en) | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD732094S1 (en) | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
US20150170888A1 (en) | 2013-12-18 | 2015-06-18 | Applied Materials, Inc. | Physical vapor deposition (pvd) target having low friction pads |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
US20160002776A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapor deposition device |
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US20160035547A1 (en) | 2014-07-29 | 2016-02-04 | Applied Materials, Inc. | Magnetron assembly for physical vapor deposition chamber |
USD750728S1 (en) | 2014-12-02 | 2016-03-01 | John K. Kremer | Laser target |
USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
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USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
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-
2018
- 2018-03-09 US US29/639,953 patent/USD877101S1/en active Active
- 2018-09-07 JP JPD2019-5062F patent/JP1651699S/ja active Active
- 2018-09-07 JP JPD2018-19579F patent/JP1640252S/ja active Active
- 2018-09-10 TW TW108303594F patent/TWD203691S/zh unknown
- 2018-09-10 TW TW107305358F patent/TWD202101S/zh unknown
-
2020
- 2020-02-28 US US29/726,094 patent/USD902165S1/en active Active
Patent Citations (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5320728A (en) | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
USD351450S (en) | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
US6114216A (en) | 1996-11-13 | 2000-09-05 | Applied Materials, Inc. | Methods for shallow trench isolation |
US6086725A (en) | 1998-04-02 | 2000-07-11 | Applied Materials, Inc. | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
US6815352B1 (en) | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same |
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US20160002776A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapor deposition device |
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USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD716742S1 (en) | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
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Also Published As
Publication number | Publication date |
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JP1640252S (zh) | 2019-09-02 |
TWD203691S (zh) | 2020-04-01 |
TWD202101S (zh) | 2020-01-11 |
JP1651699S (zh) | 2020-01-27 |
USD902165S1 (en) | 2020-11-17 |
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