SG11201608442TA - Device modified substrate article and methods for making - Google Patents

Device modified substrate article and methods for making

Info

Publication number
SG11201608442TA
SG11201608442TA SG11201608442TA SG11201608442TA SG11201608442TA SG 11201608442T A SG11201608442T A SG 11201608442TA SG 11201608442T A SG11201608442T A SG 11201608442TA SG 11201608442T A SG11201608442T A SG 11201608442TA SG 11201608442T A SG11201608442T A SG 11201608442TA
Authority
SG
Singapore
Prior art keywords
making
methods
modified substrate
device modified
substrate article
Prior art date
Application number
SG11201608442TA
Other languages
English (en)
Inventor
Kaveh Adib
Robert Alan Bellman
Robert George Manley
Prantik Mazumder
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of SG11201608442TA publication Critical patent/SG11201608442TA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0008Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006Delaminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/006Other surface treatment of glass not in the form of fibres or filaments by irradiation by plasma or corona discharge
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/022 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/308Heat stability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546Flexural strength; Flexion stiffness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/702Amorphous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/748Releasability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/75Printability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04Time
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08Dimensions, e.g. volume
    • B32B2309/10Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00Treatment by energy or chemical effects
    • B32B2310/14Corona, ionisation, electrical discharge, plasma treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00Methods for coating glass
    • C03C2218/10Deposition methods
    • C03C2218/15Deposition methods from the vapour phase
    • C03C2218/152Deposition methods from the vapour phase by cvd
    • C03C2218/153Deposition methods from the vapour phase by cvd by plasma-enhanced cvd
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00Methods for coating glass
    • C03C2218/30Aspects of methods for coating glass not covered above
    • C03C2218/355Temporary coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02079Cleaning for reclaiming

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Surface Treatment Of Glass (AREA)
  • Recrystallisation Techniques (AREA)
SG11201608442TA 2014-04-09 2015-04-07 Device modified substrate article and methods for making SG11201608442TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461977364P 2014-04-09 2014-04-09
PCT/US2015/024600 WO2015157202A1 (en) 2014-04-09 2015-04-07 Device modified substrate article and methods for making

Publications (1)

Publication Number Publication Date
SG11201608442TA true SG11201608442TA (en) 2016-11-29

Family

ID=52988479

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608442TA SG11201608442TA (en) 2014-04-09 2015-04-07 Device modified substrate article and methods for making

Country Status (8)

Country Link
US (1) US11192340B2 (zh)
EP (1) EP3129221A1 (zh)
JP (1) JP2017518954A (zh)
KR (1) KR20160145062A (zh)
CN (1) CN106457758B (zh)
SG (1) SG11201608442TA (zh)
TW (1) TW201601211A (zh)
WO (1) WO2015157202A1 (zh)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
JP6770432B2 (ja) 2014-01-27 2020-10-14 コーニング インコーポレイテッド 薄いシートの担体との制御された結合のための物品および方法
SG11201608442TA (en) 2014-04-09 2016-11-29 Corning Inc Device modified substrate article and methods for making
WO2016073658A1 (en) 2014-11-05 2016-05-12 Corning Incorporated Bottom-up electrolytic via plating method
WO2016187186A1 (en) 2015-05-19 2016-11-24 Corning Incorporated Articles and methods for bonding sheets with carriers
CN117534339A (zh) 2015-06-26 2024-02-09 康宁股份有限公司 包含板材和载体的方法和制品
TWI757257B (zh) * 2015-11-19 2022-03-11 美商康寧公司 玻璃物件以及黏合玻璃片與載體之方法
TW201737766A (zh) 2016-01-21 2017-10-16 康寧公司 處理基板的方法
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10134657B2 (en) * 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
TW201838024A (zh) * 2017-03-21 2018-10-16 美商康寧公司 載具設備及處理載具設備之方法
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP7431160B2 (ja) 2017-12-15 2024-02-14 コーニング インコーポレイテッド 基板を処理するための方法および結合されたシートを含む物品を製造するための方法
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11152294B2 (en) 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
DE102018214475A1 (de) * 2018-08-27 2020-02-27 Robert Bosch Gmbh ESD-Schutzvorrichtung für ein MEMS-Element
US20210396987A1 (en) * 2018-10-30 2021-12-23 Magic Leap, Inc. Polymer eyepiece assemblies for augmented and mixed reality systems
WO2020171940A1 (en) 2019-02-21 2020-08-27 Corning Incorporated Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
WO2020210079A1 (en) * 2019-04-11 2020-10-15 Corning Incorporated Anti-reflective transparent oleophobic surfaces and methods of manufacturing thereof
CN110783172B (zh) * 2019-09-09 2022-06-14 长江存储科技有限责任公司 用于分离堆叠封装结构中多个裸片的混合溶剂和方法
WO2021102106A1 (en) * 2019-11-21 2021-05-27 Corning Incorporated Recycled glass and glass-ceramic carrier sustrates

Family Cites Families (377)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082116A (en) 1964-09-03 1967-09-06 Owens Illinois Inc Organopolysiloxane resins and their production
US3722181A (en) 1970-05-22 1973-03-27 Du Pont Chromatographic packing with chemically bonded organic stationary phases
FR2110495A5 (zh) 1970-10-19 1972-06-02 Michelin & Cie
IE35508B1 (en) 1971-08-11 1976-03-03 Intercontinental Chem Co Ltd Method of forming adhesive bonds between surfaces
US4096315A (en) 1976-12-15 1978-06-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for producing a well-adhered durable optical coating on an optical plastic substrate
GB1583544A (en) 1977-07-25 1981-01-28 Uop Inc Metal-clad laminates
US4179324A (en) 1977-11-28 1979-12-18 Spire Corporation Process for fabricating thin film and glass sheet laminate
US4397722A (en) 1981-12-31 1983-08-09 International Business Machines Corporation Polymers from aromatic silanes and process for their preparation
US4599243A (en) 1982-12-23 1986-07-08 International Business Machines Corporation Use of plasma polymerized organosilicon films in fabrication of lift-off masks
US4849284A (en) 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
US4822466A (en) 1987-06-25 1989-04-18 University Of Houston - University Park Chemically bonded diamond films and method for producing same
US4810326A (en) 1987-08-31 1989-03-07 International Business Machines Corporation Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US5141800A (en) 1989-02-02 1992-08-25 Chemical Fabrics Corporation Method of making laminated PTFE-containing composites and products thereof
US5357726A (en) 1989-02-02 1994-10-25 Chemfab Corporation Composite materials for structural end uses
US4990462A (en) 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US5073181A (en) 1990-08-09 1991-12-17 Corning Incorporated Method of protecting glass surfaces using submicron refractory particles
CA2065918A1 (en) 1991-04-22 1992-10-23 Bradley W. Reed Liquid membrane modules with minimal effective membrane thickness and methods of making the same
CA2069038C (en) 1991-05-22 1997-08-12 Kiyofumi Sakaguchi Method for preparing semiconductor member
US5462781A (en) 1991-06-14 1995-10-31 W. L. Gore & Associates, Inc. Surface modified porous expanded polytetrafluoroethylene and process for making
JPH07500122A (ja) 1991-06-14 1995-01-05 ダブリュ.エル.ゴア アンド アソシエーツ,インコーポレイティド 表面改質多孔質膨張延伸ポリテトラフルオロエチレンとその製造方法
US5222494A (en) 1991-07-31 1993-06-29 Cyberonics, Inc. Implantable tissue stimulator output stabilization system
JP3039070B2 (ja) 1991-10-09 2000-05-08 住友電気工業株式会社 弗素樹脂被覆物
FR2690279B1 (fr) 1992-04-15 1997-10-03 Picogiga Sa Composant photovoltauique multispectral.
US5491571A (en) 1993-01-19 1996-02-13 Hughes Aircraft Company Liquid crystal display including electrodes and driver devices integrally formed in monocrystalline semiconductor layer
US5482896A (en) 1993-11-18 1996-01-09 Eastman Kodak Company Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
US5616179A (en) 1993-12-21 1997-04-01 Commonwealth Scientific Corporation Process for deposition of diamondlike, electrically conductive and electron-emissive carbon-based films
US5554680A (en) 1994-02-16 1996-09-10 E. I. Du Pont De Nemours And Company Heat-resistant perfluoroelastomer composition
JP3081122B2 (ja) 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
US5760100B1 (en) 1994-09-06 2000-11-14 Ciba Vision Corp Extended wear ophthalmic lens
US5413940A (en) 1994-10-11 1995-05-09 Taiwan Semiconductor Manufacturing Company Process of treating SOG layer using end-point detector for outgassing
DE69606942T2 (de) 1995-09-25 2000-10-05 Dow Corning Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik
CN1074006C (zh) 1995-10-13 2001-10-31 陶氏化学公司 涂覆的塑料基材
US5661618A (en) 1995-12-11 1997-08-26 International Business Machines Corporation Magnetic recording device having a improved slider
JP3930591B2 (ja) 1995-12-22 2007-06-13 東陶機器株式会社 光触媒性親水性コーティング組成物、親水性被膜の形成方法および被覆物品
US5888591A (en) 1996-05-06 1999-03-30 Massachusetts Institute Of Technology Chemical vapor deposition of fluorocarbon polymer thin films
US5989998A (en) 1996-08-29 1999-11-23 Matsushita Electric Industrial Co., Ltd. Method of forming interlayer insulating film
WO2004079826A1 (ja) 1996-10-22 2004-09-16 Mitsutoshi Miyasaka 薄膜トランジスタの製造方法、及び表示装置と電子機器
US5820991A (en) 1997-02-24 1998-10-13 Cabo; Ana M. Fused glass sheets having ceramic paint and metal foil and method of making same
DE19711459A1 (de) 1997-03-19 1998-09-24 Flachglas Automotive Gmbh Verfahren zur Herstellung einer gebogenen Verbundsicherheitsglasscheibe
JP3551702B2 (ja) 1997-05-08 2004-08-11 カシオ計算機株式会社 液晶表示素子とその駆動方法
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
US5972152A (en) 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
JPH1126733A (ja) 1997-07-03 1999-01-29 Seiko Epson Corp 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置,アクティブマトリクス基板、液晶表示装置および電子機器
EP1018153A1 (en) 1997-08-29 2000-07-12 Sharon N. Farrens In situ plasma wafer bonding method
US5966622A (en) 1997-10-08 1999-10-12 Lucent Technologies Inc. Process for bonding crystalline substrates with different crystal lattices
US20010045351A1 (en) 1997-11-21 2001-11-29 Korea Institute Of Science And Technology Plasma polymerization on surface of material
US6852650B2 (en) 1998-02-05 2005-02-08 Asm Japan K.K. Insulation film on semiconductor substrate and method for forming same
EP2267720A3 (en) 1998-02-23 2011-03-09 Kabushiki Kaisha Toshiba Information storage medium, information playback method and apparatus and information recording method
US6159385A (en) 1998-05-08 2000-12-12 Rockwell Technologies, Llc Process for manufacture of micro electromechanical devices having high electrical isolation
EP1048628A1 (de) 1999-04-30 2000-11-02 Schott Glas Polymerbeschichtete Dünnglasfoliensubstrate
US6379746B1 (en) 1999-02-02 2002-04-30 Corning Incorporated Method for temporarily protecting glass articles
JP3202718B2 (ja) 1999-02-23 2001-08-27 鹿児島日本電気株式会社 表示装置製造用治具及びそれを用いた表示装置の製造方法
US6387736B1 (en) 1999-04-26 2002-05-14 Agilent Technologies, Inc. Method and structure for bonding layers in a semiconductor device
US6338901B1 (en) 1999-05-03 2002-01-15 Guardian Industries Corporation Hydrophobic coating including DLC on substrate
US6602606B1 (en) 1999-05-18 2003-08-05 Nippon Sheet Glass Co., Ltd. Glass sheet with conductive film, method of manufacturing the same, and photoelectric conversion device using the same
US8853696B1 (en) 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
US6824879B2 (en) 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
SG93210A1 (en) 1999-06-29 2002-12-17 Univ Singapore Method for lamination of fluoropolymer to metal and printed circuit board (pcb) substrate
TW487959B (en) 1999-08-13 2002-05-21 Semiconductor Energy Lab Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device
US6674140B2 (en) 2000-02-01 2004-01-06 Analog Devices, Inc. Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
US6528145B1 (en) 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
DE10034737C2 (de) 2000-07-17 2002-07-11 Fraunhofer Ges Forschung Verfahren zur Herstellung einer permanenten Entformungsschicht durch Plasmapolymerisation auf der Oberfläche eines Formteilwerkzeugs, ein nach dem Verfahren herstellbares Formteilwerkzeug und dessen Verwendung
US6649540B2 (en) 2000-11-09 2003-11-18 The Boc Group, Inc. Organosilane CVD precursors and their use for making organosilane polymer low-k dielectric film
FR2823599B1 (fr) 2001-04-13 2004-12-17 Commissariat Energie Atomique Substrat demomtable a tenue mecanique controlee et procede de realisation
FR2823596B1 (fr) 2001-04-13 2004-08-20 Commissariat Energie Atomique Substrat ou structure demontable et procede de realisation
FR2824821B1 (fr) 2001-05-17 2003-08-29 Essilor Int Procede de preparation d'un verre apte au debordage, verre ainsi obtenu et procede de debordage d'un tel verre
US6956268B2 (en) 2001-05-18 2005-10-18 Reveo, Inc. MEMS and method of manufacturing MEMS
US7045878B2 (en) 2001-05-18 2006-05-16 Reveo, Inc. Selectively bonded thin film layer and substrate layer for processing of useful devices
JP5415658B2 (ja) 2001-05-28 2014-02-12 三菱樹脂株式会社 中間膜用粘着シート及び透明積層体
JP4036018B2 (ja) 2001-06-20 2008-01-23 昭和電工株式会社 有機発光素子および発光材料
CN100440568C (zh) 2001-06-20 2008-12-03 昭和电工株式会社 发光材料和有机发光装置
EP1275624B1 (en) 2001-06-29 2007-08-15 Crystal Systems Inc. Antifogging product, inorganic hydrophilic hard layer forming material and process for producing antifogging lens
US6735982B2 (en) 2001-07-12 2004-05-18 Intel Corporation Processing relatively thin glass sheets
US6649212B2 (en) 2001-07-30 2003-11-18 Guardian Industries Corporation Modified silicon-based UV absorbers useful in crosslinkable polysiloxane coatings via sol-gel polymerization
TW558743B (en) 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
JP2003077187A (ja) 2001-08-30 2003-03-14 Toshiba Corp 光ディスクの製造方法
JP2003071937A (ja) 2001-09-05 2003-03-12 Toppan Printing Co Ltd 積層体及びその製造方法、並びに多層回路基板
US7033910B2 (en) 2001-09-12 2006-04-25 Reveo, Inc. Method of fabricating multi layer MEMS and microfluidic devices
US6528351B1 (en) 2001-09-24 2003-03-04 Jigsaw Tek, Inc. Integrated package and methods for making same
US6814833B2 (en) 2001-10-26 2004-11-09 Corning Incorporated Direct bonding of articles containing silicon
US6521857B1 (en) 2001-11-19 2003-02-18 Geomat Insights, Llc Plasma enhanced bonding method and device
DE10162435A1 (de) 2001-12-19 2003-07-17 Joerg Lahann Verfahren zur Erzeugung von Oberflächenbeschichtungen, die die Adsorption von Proteinen bzw. die Adhäsion von Bakterien und/oder Zellen vermindern
US6824872B2 (en) 2002-04-23 2004-11-30 Laurel Products Llc Surface-treating fluoropolymer powders using atmospheric plasma
US6699798B2 (en) 2002-04-24 2004-03-02 Intel Corporation Promoting adhesion of fluoropolymer films to semiconductor substrates
FR2874455B1 (fr) 2004-08-19 2008-02-08 Soitec Silicon On Insulator Traitement thermique avant collage de deux plaquettes
JP3639978B2 (ja) 2002-05-10 2005-04-20 日本航空電子工業株式会社 光スイッチ
EP1363319B1 (en) 2002-05-17 2009-01-07 Semiconductor Energy Laboratory Co., Ltd. Method of transferring an object and method of manufacturing a semiconductor device
KR101005989B1 (ko) 2002-06-11 2011-01-05 코니카 미놀타 홀딩스 가부시키가이샤 표면 처리 방법 및 광학 부품
US7101947B2 (en) 2002-06-14 2006-09-05 Florida State University Research Foundation, Inc. Polyelectrolyte complex films for analytical and membrane separation of chiral compounds
WO2004014644A1 (ja) 2002-08-07 2004-02-19 Kabushiki Kaisha Toyota Chuo Kenkyusho 密着層を備える積層体及び保護膜を備える積層体
JP3941627B2 (ja) 2002-08-07 2007-07-04 株式会社豊田中央研究所 密着層を備える積層体
JP2006516302A (ja) 2002-09-18 2006-06-29 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド アルキル−水素シロキサンの分解を防止する添加剤
DE20215401U1 (de) 2002-10-07 2004-02-19 Schott Glas Verbund aus einem Dünnstsubsrat und einem Trägersubstrat mit lösbarem Verbindungsmittel
TW578439B (en) 2002-10-25 2004-03-01 Ritdisplay Corp Organic light emitting diode and material applied in the organic light emitting diode
TW200421497A (en) 2002-11-20 2004-10-16 Reveo Inc Method and system for increasing yield of vertically integrated devices
JP2004178891A (ja) 2002-11-26 2004-06-24 Mitsubishi Electric Corp 電子放出型発光素子の製造方法
DE10353530A1 (de) 2003-11-14 2005-06-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wafer mit Deckschicht und Trennschicht, Verfahren zur Herstellung eines solchen Wafers sowie Verfahren zum Dünnen bzw. Rückseitenmetallisieren eines Wafers
PT1568071T (pt) 2002-11-29 2019-06-17 Fraunhofer Ges Forschung Pastilha com camada de separação e camada de suporte e seu processo de fabrico
US20060165975A1 (en) 2002-12-17 2006-07-27 Moser Eva M Substrate comprising a polar plasma-polymerised coating
US6762074B1 (en) 2003-01-21 2004-07-13 Micron Technology, Inc. Method and apparatus for forming thin microelectronic dies
US7089635B2 (en) 2003-02-25 2006-08-15 Palo Alto Research Center, Incorporated Methods to make piezoelectric ceramic thick film arrays and elements
US6964201B2 (en) 2003-02-25 2005-11-15 Palo Alto Research Center Incorporated Large dimension, flexible piezoelectric ceramic tapes
TWI361814B (en) 2003-03-07 2012-04-11 Kuraray Co Plastic bonding method
US7220656B2 (en) 2003-04-29 2007-05-22 Micron Technology, Inc. Strained semiconductor by wafer bonding with misorientation
US6969166B2 (en) 2003-05-29 2005-11-29 3M Innovative Properties Company Method for modifying the surface of a substrate
JP2005014599A (ja) 2003-05-30 2005-01-20 Toyota Central Res & Dev Lab Inc 樹脂シート及びエレクトロルミネッセンス表示装置
FR2855909B1 (fr) 2003-06-06 2005-08-26 Soitec Silicon On Insulator Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat
US20040258850A1 (en) 2003-06-18 2004-12-23 Ann Straccia Environmentally friendly reactive fixture to allow localized surface engineering for improved adhesion to coated and non-coated substrates
US20050001201A1 (en) 2003-07-03 2005-01-06 Bocko Peter L. Glass product for use in ultra-thin glass display applications
FR2859312B1 (fr) 2003-09-02 2006-02-17 Soitec Silicon On Insulator Scellement metallique multifonction
US7242041B2 (en) 2003-09-22 2007-07-10 Lucent Technologies Inc. Field-effect transistors with weakly coupled layered inorganic semiconductors
US20050069713A1 (en) 2003-09-30 2005-03-31 Rahul Gupta Capillary coating method
US6992371B2 (en) 2003-10-09 2006-01-31 Freescale Semiconductor, Inc. Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication
US20050242341A1 (en) 2003-10-09 2005-11-03 Knudson Christopher T Apparatus and method for supporting a flexible substrate during processing
US20050081993A1 (en) 2003-10-16 2005-04-21 Ilkka Steven J. Method of bonding glass
GB0326537D0 (en) 2003-11-14 2003-12-17 Koninkl Philips Electronics Nv Flexible devices
US20050118742A1 (en) 2003-11-17 2005-06-02 Frank Henning Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
KR101002936B1 (ko) 2003-12-17 2010-12-21 삼성전자주식회사 캐리어 기판, 이를 이용한 플라스틱 기판의 적층 방법 및유연한 디스플레이 장치의 제조 방법
US7220497B2 (en) 2003-12-18 2007-05-22 Lam Research Corporation Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components
KR101073032B1 (ko) 2003-12-19 2011-10-12 삼성전자주식회사 플라스틱 기판의 적층 방법 및 이를 이용한 유연한디스플레이 장치의 제조방법
US7041608B2 (en) 2004-02-06 2006-05-09 Eastman Kodak Company Providing fluorocarbon layers on conductive electrodes in making electronic devices such as OLED devices
US7147891B2 (en) 2004-02-11 2006-12-12 Dionex Corporation Polymer substrate coated with weak cationic-exchange functional layer
EP2246894B2 (en) 2004-03-12 2018-10-10 Japan Science and Technology Agency Method for fabricating a thin film transistor having an amorphous oxide as a channel layer
US7087134B2 (en) 2004-03-31 2006-08-08 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
JP2005300972A (ja) 2004-04-13 2005-10-27 Seiko Epson Corp 表示装置の製造方法及び基板貼り合わせ装置
JP2006003684A (ja) 2004-06-18 2006-01-05 Nikon Corp 基板レスフィルタの製造方法
ITMI20041252A1 (it) 2004-06-22 2004-09-22 Solvay Solexis Spa Composizioni perfluoroelastomeriche
US7261793B2 (en) 2004-08-13 2007-08-28 Hewlett-Packard Development Company, L.P. System and method for low temperature plasma-enhanced bonding
US7226869B2 (en) 2004-10-29 2007-06-05 Lam Research Corporation Methods for protecting silicon or silicon carbide electrode surfaces from morphological modification during plasma etch processing
US20060134362A1 (en) 2004-12-17 2006-06-22 3M Innovative Properties Company Optically clear pressure sensitive adhesive
EP1854136A1 (en) 2005-03-01 2007-11-14 Dow Corning Corporation Temporary wafer bonding method for semiconductor processing
WO2006112523A1 (ja) 2005-04-19 2006-10-26 Ube Industries, Ltd. ポリイミドフィルム積層体
US20060246218A1 (en) 2005-04-29 2006-11-02 Guardian Industries Corp. Hydrophilic DLC on substrate with barrier discharge pyrolysis treatment
TWI402935B (zh) 2005-05-17 2013-07-21 Koninkl Philips Electronics Nv 彩色主動矩陣顯示器
US7462552B2 (en) * 2005-05-23 2008-12-09 Ziptronix, Inc. Method of detachable direct bonding at low temperatures
US20070020451A1 (en) 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
US7166520B1 (en) 2005-08-08 2007-01-23 Silicon Genesis Corporation Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process
CN101242951B (zh) 2005-08-09 2012-10-31 旭硝子株式会社 薄板玻璃层压体以及利用薄板玻璃层压体的显示装置的制造方法
US20070048530A1 (en) 2005-08-29 2007-03-01 Wen-Kuang Tsao Anti-static substrate
TWI288493B (en) 2005-09-13 2007-10-11 Ind Tech Res Inst Method for fabricating a device with flexible substrate and method for stripping flexible-substrate
US7462551B2 (en) 2005-09-30 2008-12-09 Intel Corporation Adhesive system for supporting thin silicon wafer
US8039049B2 (en) 2005-09-30 2011-10-18 Tokyo Electron Limited Treatment of low dielectric constant films using a batch processing system
US7901743B2 (en) 2005-09-30 2011-03-08 Tokyo Electron Limited Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system
JP2007138144A (ja) 2005-10-18 2007-06-07 Hitachi Chem Co Ltd シリカ系被膜形成用組成物
KR20070047114A (ko) 2005-11-01 2007-05-04 주식회사 엘지화학 플렉서블 기판을 구비한 소자의 제조방법 및 이에 의해제조된 플렉서블 기판을 구비한 소자
CN101305315B (zh) 2005-11-11 2010-05-19 株式会社半导体能源研究所 形成具有功能性的层的方法及半导体器件的制造方法
FR2893750B1 (fr) * 2005-11-22 2008-03-14 Commissariat Energie Atomique Procede de fabrication d'un dispositif electronique flexible du type ecran comportant une pluralite de composants en couches minces.
US20070134784A1 (en) 2005-12-09 2007-06-14 Halverson Kurt J Microreplicated microarrays
DE602007013478D1 (de) 2006-02-08 2011-05-12 Semiconductor Energy Lab RFID-Vorrichtung
KR100831562B1 (ko) 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
US7909928B2 (en) 2006-03-24 2011-03-22 The Regents Of The University Of Michigan Reactive coatings for regioselective surface modification
US7737035B1 (en) 2006-03-31 2010-06-15 Novellus Systems, Inc. Dual seal deposition process chamber and process
US20070248809A1 (en) 2006-04-19 2007-10-25 Steven Vincent Haldeman Interlayers Comprising Stable Infrared Absorbing Agents
WO2007121524A1 (en) 2006-04-20 2007-11-01 Epitactix Pty Ltd. Method of manufacture and resulting structures for semiconductor devices
CN101437772B (zh) * 2006-05-08 2011-09-07 旭硝子株式会社 薄板玻璃叠层体、使用了薄板玻璃叠层体的显示装置的制造方法及支持用玻璃基板
KR101358255B1 (ko) 2006-06-27 2014-02-05 엘지디스플레이 주식회사 광경화 타입 소수성 몰드 및 그 제조방법
JPWO2008007622A1 (ja) 2006-07-12 2009-12-10 旭硝子株式会社 保護ガラス付ガラス基板、保護ガラス付ガラス基板を用いた表示装置の製造方法及び剥離紙用シリコーン
US20080044588A1 (en) 2006-08-15 2008-02-21 Sakhrani Vinay G Method for Treating a Hydrophilic Surface
US8084103B2 (en) 2006-08-15 2011-12-27 Sakhrani Vinay G Method for treating a hydrophilic surface
JP2008072087A (ja) 2006-08-16 2008-03-27 Kyoto Univ 半導体装置および半導体装置の製造方法、ならびに表示装置
WO2008044884A1 (en) 2006-10-13 2008-04-17 Sunwoo Amc Co., Ltd. Laminating film of plastic/teflon-silicon and method for preparing the same
GB0620955D0 (en) 2006-10-20 2006-11-29 Speakman Stuart P Methods and apparatus for the manufacture of microstructures
US7903083B2 (en) 2006-11-13 2011-03-08 Motorola Mobility, Inc. Mixed-mode encapsulated electrophoretic display for electronic device
JP5008381B2 (ja) 2006-11-15 2012-08-22 富士フイルム株式会社 可撓性基板を用いた有機エレクトロルミネッセンス発光パネルの製造方法、それにより製造された有機エレクトロルミネッセンス発光パネル、及びその製造に使用する支持基板
US8069229B2 (en) 2006-12-28 2011-11-29 Computer Associates Think, Inc. Topology static zones
KR100890250B1 (ko) 2007-01-08 2009-03-24 포항공과대학교 산학협력단 플렉서블 소자의 제조 방법 및 플렉서블 표시 장치의 제조방법
US8110906B2 (en) 2007-01-23 2012-02-07 Infineon Technologies Ag Semiconductor device including isolation layer
JP5532918B2 (ja) 2007-03-12 2014-06-25 旭硝子株式会社 保護ガラス付ガラス基板を用いた表示装置の製造方法
JP5277552B2 (ja) 2007-03-19 2013-08-28 富士通セミコンダクター株式会社 半導体装置の製造方法
US8399047B2 (en) 2007-03-22 2013-03-19 The Regents Of The Univeristy Of Michigan Multifunctional CVD coatings
WO2008132085A1 (de) 2007-04-26 2008-11-06 Basf Se Silane enthaltend phenothiazin-s-oxid oder phenothiazin-s,s-dioxid-gruppen und deren verwendung in oleds
KR101436115B1 (ko) 2007-04-27 2014-09-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기판의 제조방법, 및 반도체장치의 제조방법
US7960916B2 (en) 2007-05-16 2011-06-14 Advanced Lcd Technologies Development Center Co., Ltd. Display device and electronic device using thin-film transistors formed on semiconductor thin films which are crystallized on insulating substrates
CN101679109B (zh) * 2007-06-20 2011-11-09 旭硝子株式会社 采用氟化剂的氧化物玻璃的表面处理方法
KR20080113576A (ko) 2007-06-25 2008-12-31 엘지디스플레이 주식회사 액정표시장치 및 그 제조방법
US7935780B2 (en) 2007-06-25 2011-05-03 Brewer Science Inc. High-temperature spin-on temporary bonding compositions
TW200907003A (en) 2007-07-03 2009-02-16 Hitachi Chemical Co Ltd Adhesive composition and method of manufacturing thereof, adhesive member using the adhesive composition and method of manufacturing thereof, supporting member for mounting semiconductor and method of manufacturing thereof, and semiconductor apparatus an
JP2009035720A (ja) 2007-07-11 2009-02-19 Seiko Epson Corp 接合膜付き基材、接合方法および接合体
JP2009028922A (ja) 2007-07-24 2009-02-12 Seiko Epson Corp 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置
JP2009028923A (ja) 2007-07-24 2009-02-12 Seiko Epson Corp 接合方法、接合体および配線基板
JP2009074002A (ja) 2007-09-21 2009-04-09 Seiko Epson Corp 接着シート、接合方法および接合体
US20090091025A1 (en) 2007-10-04 2009-04-09 Agency For Science, Technology And Research Method for forming and releasing interconnects
US9056951B2 (en) 2007-10-05 2015-06-16 The Regents Of The University Of Michigan Ultrastrong and stiff layered polymer nanocomposites and hierarchical laminate materials thereof
JP4710897B2 (ja) 2007-11-28 2011-06-29 セイコーエプソン株式会社 接合体の剥離方法
KR101445734B1 (ko) 2007-12-07 2014-10-01 삼성전자 주식회사 액정표시장치
KR101096142B1 (ko) 2008-01-24 2011-12-19 브레우어 사이언스 인코포레이션 캐리어 기판에 디바이스 웨이퍼를 가역적으로 장착하는 방법
JP5024087B2 (ja) 2008-02-05 2012-09-12 旭硝子株式会社 ガラス積層体、支持体付き表示装置用パネル、およびそれらの製造方法
EP2244878B1 (en) 2008-02-05 2018-11-07 Saint-Gobain Performance Plastics Corporation Multi-layer article
GB0802912D0 (en) 2008-02-15 2008-03-26 Carben Semicon Ltd Thin-film transistor, carbon-based layer and method of production thereof
KR20090095026A (ko) 2008-03-04 2009-09-09 삼성전자주식회사 표시 장치 제조 방법
EP2274162A1 (en) 2008-04-08 2011-01-19 The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
JPWO2009128359A1 (ja) 2008-04-17 2011-08-04 旭硝子株式会社 ガラス積層体、支持体付き表示装置用パネルおよびこれらの製造方法
KR101500684B1 (ko) 2008-04-17 2015-03-10 삼성디스플레이 주식회사 캐리어 기판 및 이를 이용한 가요성 표시 장치의 제조 방법
US7842548B2 (en) 2008-04-22 2010-11-30 Taiwan Semconductor Manufacturing Co., Ltd. Fixture for P-through silicon via assembly
KR101458901B1 (ko) 2008-04-29 2014-11-10 삼성디스플레이 주식회사 가요성 표시 장치의 제조 방법
US7960840B2 (en) 2008-05-12 2011-06-14 Texas Instruments Incorporated Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level
JP2009283155A (ja) 2008-05-19 2009-12-03 Seiko Epson Corp 表示装置の製造方法、表示装置および電子機器
JP5029523B2 (ja) 2008-07-14 2012-09-19 旭硝子株式会社 ガラス積層体、支持体付き表示装置用パネル、表示装置用パネル、表示装置およびこれらの製造方法
US7690344B2 (en) 2008-07-24 2010-04-06 Gm Global Technology Operations, Inc. Method and apparatus for supporting stop-and-go engine functionality
GB2462615A (en) 2008-08-12 2010-02-17 Nec Corp Optional Access Stratum security activation depending on purpose of request or message parameter in an evolved UTRAN communication network.
DE102008045370B4 (de) 2008-09-02 2010-07-08 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zum Transport großflächiger, dünner Glasplatten
WO2010051106A2 (en) 2008-09-12 2010-05-06 Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University Methods for attaching flexible substrates to rigid carriers and resulting devices
TWI354854B (en) 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
JP2010107597A (ja) 2008-10-28 2010-05-13 Seiko Epson Corp 光学素子および光学素子の製造方法
KR101555551B1 (ko) 2008-11-07 2015-09-24 엘지디스플레이 주식회사 플렉시블 표시장치 제조방법
US8840999B2 (en) 2008-11-19 2014-09-23 Dow Corning Toray Company, Ltd. Silicone composition and a method for preparing the same
US8211270B2 (en) 2008-11-21 2012-07-03 Nitto Denko Corporation Method of detaching attached boards from each other
DE102009022628A1 (de) 2008-12-05 2010-06-10 Evonik Goldschmidt Gmbh Verfahren zur Modifizierung von Oberflächen
EP2374149B1 (en) 2008-12-05 2018-06-13 Hydis Technologies Co., Ltd Method of forming electronic devices having plastic substrates
US9063605B2 (en) 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
TW201033000A (en) 2009-01-09 2010-09-16 Asahi Glass Co Ltd Glass laminate and manufacturing method therefor
JP5207306B2 (ja) 2009-01-26 2013-06-12 武井電機工業株式会社 薄膜積層ガラス基板の薄膜除去方法及び装置
EP2401148B1 (en) 2009-02-27 2013-01-23 ExxonMobil Oil Corporation Plasma treated evoh multilayer film
TWI410329B (zh) 2009-03-09 2013-10-01 Ind Tech Res Inst 可撓式裝置的取下設備及其取下方法
JP5402184B2 (ja) 2009-04-13 2014-01-29 日本電気硝子株式会社 ガラスフィルムおよびその製造方法
CN101873532B (zh) 2009-04-22 2013-01-02 电信科学技术研究院 广播多播系统中发送和获取控制信息的方法、基站和ue
US8697228B2 (en) 2009-05-06 2014-04-15 Corning Incorporated Carrier for glass substrates
WO2010128611A1 (ja) 2009-05-08 2010-11-11 日立化成工業株式会社 半導体封止用フィルム状接着剤、半導体装置及びその製造方法
GB0908193D0 (en) 2009-05-13 2009-06-24 Albright Patents Treatment of disease state
KR101360876B1 (ko) 2009-06-03 2014-02-11 어플라이드 머티어리얼스, 인코포레이티드 식각을 위한 방법 및 장치
CN101924067B (zh) 2009-06-09 2013-05-08 财团法人工业技术研究院 挠性膜自载板上脱离的方法及可挠式电子装置的制造方法
JP2010284869A (ja) 2009-06-11 2010-12-24 Shin-Etsu Chemical Co Ltd 接合部材
JP5594522B2 (ja) 2009-07-03 2014-09-24 日本電気硝子株式会社 電子デバイス製造用ガラスフィルム積層体
US8568184B2 (en) 2009-07-15 2013-10-29 Apple Inc. Display modules
US7987566B2 (en) 2009-07-15 2011-08-02 Sturzebecher Richard J Capacitor forming method
CN101989469A (zh) 2009-07-31 2011-03-23 群康科技(深圳)有限公司 导电板
US8048794B2 (en) 2009-08-18 2011-11-01 International Business Machines Corporation 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport
DE102009028640A1 (de) 2009-08-19 2011-02-24 Evonik Goldschmidt Gmbh Härtbare Masse enthaltend Urethangruppen aufweisende silylierte Polymere und deren Verwendung in Dicht- und Klebstoffen, Binde- und/oder Oberflächenmodifizierungsmitteln
JP2011048979A (ja) 2009-08-26 2011-03-10 Canon Inc 画像表示装置
WO2011024690A1 (ja) 2009-08-27 2011-03-03 旭硝子株式会社 フレキシブル基材-支持体の積層構造体、支持体付き電子デバイス用パネル、および電子デバイス用パネルの製造方法
US9847243B2 (en) 2009-08-27 2017-12-19 Corning Incorporated Debonding a glass substrate from carrier using ultrasonic wave
JP5562597B2 (ja) * 2009-08-28 2014-07-30 荒川化学工業株式会社 支持体、ガラス基板積層体、支持体付き表示装置用パネル、および表示装置用パネルの製造方法
JP5723776B2 (ja) 2009-09-08 2015-05-27 旭硝子株式会社 ガラス/樹脂積層体の製造方法
JP2011058579A (ja) 2009-09-10 2011-03-24 Tokyo Institute Of Technology エネルギ吸収構造体
ES2660203T3 (es) 2009-09-11 2018-03-21 Henkel IP & Holding GmbH Composiciones para la unión de polímeros
KR101730901B1 (ko) 2009-09-18 2017-04-27 니폰 덴키 가라스 가부시키가이샤 유리 필름의 제조 방법, 유리 필름의 처리 방법 및 유리 필름 적층체
KR20120098640A (ko) 2009-10-20 2012-09-05 아사히 가라스 가부시키가이샤 유리 적층체 및 그의 제조 방법, 및 표시 패널의 제조 방법 및 그 제조 방법에 의해 얻어지는 표시 패널
CN102574371B (zh) 2009-10-20 2015-10-07 旭硝子株式会社 玻璃层叠体、带支承体的显示装置用面板、显示装置用面板、显示装置及它们的制造方法
KR101617280B1 (ko) 2009-10-21 2016-05-03 엘지디스플레이 주식회사 플라스틱 기판을 이용한 표시장치 제조 방법
KR20110043376A (ko) 2009-10-21 2011-04-27 엘지디스플레이 주식회사 전기영동 표시장치 및 그 제조 방법
KR20110045136A (ko) 2009-10-26 2011-05-04 주식회사 삼영테크놀로지 윈도우와 디스플레이 패널을 분리하기 위한 코팅방법
US9019211B2 (en) 2009-10-30 2015-04-28 Corning Incorporated Methods and apparatus for providing touch sensitive displays
KR101635914B1 (ko) 2009-12-16 2016-07-05 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
KR20120105030A (ko) 2009-12-17 2012-09-24 세람테크 게엠베하 골 시멘트 부착을 향상시키기 위한 세라믹 기재에 대한 표면 컨디셔닝
US9156230B2 (en) * 2010-01-12 2015-10-13 Nippon Electric Glass Co., Ltd. Glass film laminate without adhesive
JP2011159697A (ja) 2010-01-29 2011-08-18 Dainippon Printing Co Ltd 薄膜トランジスタ搭載基板、その製造方法及び画像表示装置
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201003067D0 (en) 2010-02-23 2010-04-07 Semblant Ltd Plasma-polymerized polymer coating
JP2011201976A (ja) 2010-03-24 2011-10-13 Seiko Epson Corp 接合方法
JP2011201977A (ja) 2010-03-24 2011-10-13 Seiko Epson Corp 接合方法
US8349727B2 (en) 2010-04-08 2013-01-08 Liang Guo Integrated method for high-density interconnection of electronic components through stretchable interconnects
US20110256385A1 (en) 2010-04-15 2011-10-20 Seiko Epson Corporation Bonding film-attached substrate and bonding film-attached substrate manufacturing method
JP5625470B2 (ja) 2010-05-10 2014-11-19 セイコーエプソン株式会社 接合方法
JP2011235556A (ja) 2010-05-11 2011-11-24 Seiko Epson Corp 励起エネルギー特定方法、励起エネルギー特定装置、接合方法および接合装置
JP5835214B2 (ja) 2010-05-11 2015-12-24 旭硝子株式会社 積層体の製造方法、および積層体
JP5516046B2 (ja) 2010-05-11 2014-06-11 セイコーエプソン株式会社 接合膜転写シートおよび接合方法
JP2011248011A (ja) 2010-05-25 2011-12-08 Bridgestone Corp 表示媒体用粒子およびこれを用いた情報表示用パネル
GB2481187B (en) 2010-06-04 2014-10-29 Plastic Logic Ltd Processing substrates
KR101721414B1 (ko) 2010-06-09 2017-03-31 삼성디스플레이 주식회사 백라이트 어셈블리 및 이를 포함하는 액정표시장치
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
TWI432835B (zh) 2010-06-24 2014-04-01 Au Optronics Corp 可撓性顯示面板及其製造方法
DE102010025967B4 (de) 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
CN101916022B (zh) 2010-07-06 2012-10-10 友达光电股份有限公司 可挠性显示面板及其制造方法
US9333724B2 (en) 2010-07-28 2016-05-10 Nippon Electric Glass Co., Ltd. Glass film laminate
JP5602529B2 (ja) 2010-07-29 2014-10-08 日本合成化学工業株式会社 積層体の製法、ガラス基板付き偏光板の製法、およびそれにより得られたガラス基板付き偏光板
US20120035309A1 (en) 2010-08-06 2012-02-09 Baker Hughes Incorporated Method to disperse nanoparticles into elastomer and articles produced therefrom
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
JP5462107B2 (ja) 2010-08-09 2014-04-02 株式会社日本製鋼所 中空成形品の製造方法および製造装置
US8846499B2 (en) 2010-08-17 2014-09-30 Taiwan Semiconductor Manufacturing Company, Ltd. Composite carrier structure
TWI446420B (zh) 2010-08-27 2014-07-21 Advanced Semiconductor Eng 用於半導體製程之載體分離方法
US20120063952A1 (en) 2010-09-10 2012-03-15 Hong Keith C Uv resistant clear laminates
KR101164945B1 (ko) 2010-09-13 2012-07-12 한국과학기술원 플렉시블 소자의 제작 방법
KR101779586B1 (ko) 2010-09-27 2017-10-10 엘지디스플레이 주식회사 플라스틱 기판을 이용한 표시장치 제조 방법
WO2012043971A2 (ko) 2010-09-29 2012-04-05 포항공과대학교 산학협력단 롤 형상의 모기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
US8822306B2 (en) 2010-09-30 2014-09-02 Infineon Technologies Ag Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
KR101267529B1 (ko) 2010-10-30 2013-05-24 엘지디스플레이 주식회사 플렉서블한 유기전계 발광소자 제조 방법
US8859103B2 (en) 2010-11-05 2014-10-14 Joseph Eugene Canale Glass wafers for semiconductor fabrication processes and methods of making same
CN102034746B (zh) 2010-11-08 2013-06-05 昆山工研院新型平板显示技术中心有限公司 一种有源矩阵有机发光显示器阵列基板的制造方法
KR101295532B1 (ko) 2010-11-11 2013-08-12 엘지디스플레이 주식회사 플렉시블 평판소자의 제조방법
KR101271838B1 (ko) 2010-11-24 2013-06-07 주식회사 포스코 보강기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
KR101842134B1 (ko) 2010-11-26 2018-03-26 엘지디스플레이 주식회사 전기영동 표시장치 및 그 제조 방법
EP2458620B1 (en) 2010-11-29 2021-12-01 IHP GmbH-Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik Fabrication of graphene electronic devices using step surface contour
TW201238014A (en) 2010-11-30 2012-09-16 Corning Inc Methods of forming a glass wiring board substrate
JP2012119611A (ja) 2010-12-03 2012-06-21 Asahi Glass Co Ltd 貫通電極基板の製造方法
KR101049380B1 (ko) 2010-12-21 2011-07-15 한국기계연구원 전해도금을 이용한 반도체 소자 3차원 패키지용 관통 전극 및 그 제조 방법
CN102070120B (zh) 2010-12-31 2012-09-05 东南大学 用于微电子系统级封装的高密度转接板的制备方法
WO2012104989A1 (ja) * 2011-02-01 2012-08-09 株式会社ミクロ技術研究所 薄板ガラス基板貼合体およびその製造方法
JP2012166999A (ja) 2011-02-16 2012-09-06 Asahi Glass Co Ltd インターポーザ用ガラス基板の製造方法、インターポーザの製造方法、インターポーザ用ガラス基板、およびインターポーザ
KR101918284B1 (ko) 2011-03-03 2019-01-30 엘지디스플레이 주식회사 플렉시블 표시장치의 제조 방법
JP5355618B2 (ja) 2011-03-10 2013-11-27 三星ディスプレイ株式會社 可撓性表示装置及びこの製造方法
JP2012209545A (ja) 2011-03-17 2012-10-25 Sekisui Chem Co Ltd 半導体積層体の製造方法
TWI445626B (zh) 2011-03-18 2014-07-21 Eternal Chemical Co Ltd 製造軟性元件的方法
JP2012227310A (ja) 2011-04-19 2012-11-15 Panasonic Corp セラミックス多層基板とその製造方法
US10155361B2 (en) 2011-11-09 2018-12-18 Corning Incorporated Method of binding nanoparticles to glass
CN103492173B (zh) 2011-04-22 2015-05-20 旭硝子株式会社 层叠体、其制造方法和用途
JP5760696B2 (ja) 2011-05-27 2015-08-12 株式会社デンソー 画像認識装置
JP5862238B2 (ja) 2011-05-27 2016-02-16 東洋紡株式会社 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
JP5862866B2 (ja) 2011-05-30 2016-02-16 東洋紡株式会社 積層体の作成方法および、この積層体を利用したフィルムデバイスの作成方法
JP5883236B2 (ja) 2011-06-10 2016-03-09 日東電工株式会社 薄層基材用キャリア材
KR20130000211A (ko) 2011-06-22 2013-01-02 삼성전자주식회사 기판 가공 방법
KR20130003997A (ko) 2011-07-01 2013-01-09 엘지디스플레이 주식회사 캐리어 기판과 박형 글라스의 탈부착 방법
WO2013006865A2 (en) 2011-07-07 2013-01-10 Brewer Science Inc. Methods of transferring device wafers or layers between carrier substrates and other surfaces
US8617925B2 (en) 2011-08-09 2013-12-31 Soitec Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods
US8383460B1 (en) 2011-09-23 2013-02-26 GlobalFoundries, Inc. Method for fabricating through substrate vias in semiconductor substrate
KR20140069277A (ko) 2011-09-27 2014-06-09 어플라이드 머티어리얼스, 인코포레이티드 얇은 유리 기판들을 위한 캐리어 및 그 이용
JP5790392B2 (ja) 2011-10-12 2015-10-07 旭硝子株式会社 電子デバイスの製造方法
JP5796449B2 (ja) 2011-10-12 2015-10-21 旭硝子株式会社 電子デバイスの製造方法、樹脂層付きキャリア基板の製造方法
CN103889712B (zh) 2011-10-18 2015-07-08 旭硝子株式会社 层叠体、层叠体的制造方法及带有电子器件用构件的玻璃基板的制造方法
KR101820171B1 (ko) 2011-10-24 2018-01-19 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
US8550061B2 (en) 2012-01-26 2013-10-08 Maruzen Company Limited Toy gun
US8696864B2 (en) 2012-01-26 2014-04-15 Promerus, Llc Room temperature debonding composition, method and stack
US8975157B2 (en) 2012-02-08 2015-03-10 Advanced Semiconductor Engineering, Inc. Carrier bonding and detaching processes for a semiconductor wafer
US9725357B2 (en) * 2012-10-12 2017-08-08 Corning Incorporated Glass articles having films with moderate adhesion and retained strength
US10543662B2 (en) * 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
JP2015515431A (ja) * 2012-02-08 2015-05-28 コーニング インコーポレイテッド 担体付のフレキシブルガラスの処理
US8696212B2 (en) 2012-03-01 2014-04-15 Amsted Rail Company, Inc. Roller bearing backing ring assembly
JP2013184346A (ja) 2012-03-07 2013-09-19 Asahi Glass Co Ltd ガラス積層体、電子デバイスの製造方法
JP2013184872A (ja) 2012-03-09 2013-09-19 Nippon Electric Glass Co Ltd ガラス基板の端部処理方法、ガラス基板の端部処理装置及びガラス基板
KR101390212B1 (ko) 2012-03-14 2014-05-14 한양대학교 에리카산학협력단 전기분무건조를 이용한 글리아딘 나노입자의 제조방법
JP2013207084A (ja) 2012-03-28 2013-10-07 Sumitomo Electric Ind Ltd 放熱板付基板モジュールおよび放熱板付基板モジュールの製造方法
JP2013216513A (ja) 2012-04-05 2013-10-24 Nippon Electric Glass Co Ltd ガラスフィルムの切断方法及びガラスフィルム積層体
EP2650938A1 (en) 2012-04-13 2013-10-16 Acreo Swedish ICT AB Organic Field-Effect Transistor Device
JP2013224475A (ja) 2012-04-23 2013-10-31 Shimazu Kogyo Kk 溶射用粒子、溶射皮膜の形成方法及び溶射部材
DE102012207149A1 (de) 2012-04-27 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verbund mit temporärer Schutzfolie
WO2013179881A1 (ja) 2012-05-29 2013-12-05 旭硝子株式会社 ガラス積層体および電子デバイスの製造方法
KR20130095605A (ko) 2012-06-22 2013-08-28 코스텍시스템(주) 디바이스 웨이퍼와 캐리어 웨이퍼의 본딩과 디본딩 장치
CN102815052B (zh) 2012-06-29 2016-08-24 法国圣戈班玻璃公司 超疏水减反基板及其制作方法
US9139469B2 (en) 2012-07-17 2015-09-22 Corning Incorporated Ion exchangeable Li-containing glass compositions for 3-D forming
JP2014019597A (ja) 2012-07-17 2014-02-03 Nippon Electric Glass Co Ltd ガラスフィルムの製造方法及びガラスフィルム積層体
CN102789125B (zh) 2012-07-27 2013-11-13 京东方科技集团股份有限公司 隔垫物制作方法
EP2885253B1 (en) 2012-08-17 2021-06-02 Corning Incorporated Ultra-thin strengthened glasses
CN102820262A (zh) 2012-09-05 2012-12-12 江苏物联网研究发展中心 一种玻璃通孔的制作及互连的方法
JP5913608B2 (ja) * 2012-09-28 2016-04-27 Hoya株式会社 電子機器用カバーガラス及びその製造方法
JP6323957B2 (ja) 2012-10-12 2018-05-16 コーニング インコーポレイテッド 残留強度を有する物品
US20140150244A1 (en) 2012-11-30 2014-06-05 General Electric Company Adhesive-free carrier assemblies for glass substrates
CN103035490A (zh) 2012-12-11 2013-04-10 京东方科技集团股份有限公司 柔性显示器件的制备方法
US10014177B2 (en) * 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
EP2932496A4 (en) 2012-12-13 2016-11-02 Corning Inc GLASS AND METHOD FOR PRODUCING GLASS ARTICLES
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10086584B2 (en) * 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
KR102046534B1 (ko) 2013-01-25 2019-11-19 삼성전자주식회사 기판 가공 방법
WO2014137801A1 (en) 2013-03-03 2014-09-12 John Moore Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
US9790407B2 (en) 2013-03-09 2017-10-17 Moore John Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing
CN105658594B (zh) 2013-03-15 2019-01-04 康宁股份有限公司 玻璃片的整体退火
WO2014142280A1 (ja) 2013-03-15 2014-09-18 日産自動車株式会社 非水電解質二次電池
KR101432575B1 (ko) 2013-03-29 2014-08-21 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
WO2014163035A1 (ja) 2013-04-02 2014-10-09 旭硝子株式会社 被膜付きガラス基板およびその製造方法
KR102070617B1 (ko) 2013-08-21 2020-01-30 엘지이노텍 주식회사 멤스 진폭 변조기 및 이를 포함하는 멤스 자계 센서
KR20150034829A (ko) 2013-08-30 2015-04-06 주식회사 엔씰텍 플렉시블 정보 표시 소자 제조용 지지 기판, 이의 제조 방법, 이를 이용하여 제조된 플렉시블 정보 표시 소자 및 이의 제조방법
KR101580015B1 (ko) 2013-08-30 2015-12-24 주식회사 엔씰텍 임시 점착/탈착층을 사용하는 플렉시블 정보 표시 소자 제조용 지지 기판, 이의 제조 방법, 그를 이용한 플렉시블 정보 표시 소자 및 그의 제조 방법
US20150099110A1 (en) 2013-10-07 2015-04-09 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
JP6176067B2 (ja) 2013-11-11 2017-08-09 旭硝子株式会社 ガラス積層体および電子デバイスの製造方法
JP6119567B2 (ja) 2013-11-11 2017-04-26 旭硝子株式会社 ガラス積層体の製造方法および電子デバイスの製造方法
JP6136909B2 (ja) 2013-12-17 2017-05-31 旭硝子株式会社 樹脂層付き支持基板の製造方法、ガラス積層体の製造方法、電子デバイスの製造方法
WO2015113023A1 (en) 2014-01-27 2015-07-30 Corning Incorporated Treatment of a surface modification layer for controlled bonding of thin sheets with carriers
TWI654088B (zh) 2014-01-27 2019-03-21 美商康寧公司 用於聚合物表面與載具之受控接合之物件及方法
JP6770432B2 (ja) 2014-01-27 2020-10-14 コーニング インコーポレイテッド 薄いシートの担体との制御された結合のための物品および方法
KR101522941B1 (ko) 2014-02-05 2015-05-26 도레이첨단소재 주식회사 실리콘 이형필름 및 그 제조방법
CN105980150B (zh) 2014-02-07 2018-01-30 旭硝子株式会社 玻璃层叠体
US9406746B2 (en) 2014-02-19 2016-08-02 International Business Machines Corporation Work function metal fill for replacement gate fin field effect transistor process
JP2017087417A (ja) 2014-03-26 2017-05-25 旭硝子株式会社 ガラス積層体
SG11201608442TA (en) 2014-04-09 2016-11-29 Corning Inc Device modified substrate article and methods for making
CN106163798B (zh) 2014-04-10 2019-05-10 Agc株式会社 玻璃层叠体及其制造方法、电子器件的制造方法
WO2015163134A1 (ja) 2014-04-25 2015-10-29 旭硝子株式会社 ガラス積層体および電子デバイスの製造方法
JP6322469B2 (ja) 2014-04-25 2018-05-09 ニッタ株式会社 基板加工方法
CN106573443B (zh) 2014-08-01 2018-09-25 Agc株式会社 带无机膜的支撑基板及玻璃层叠体、以及它们的制造方法及电子器件的制造方法
US9790593B2 (en) * 2014-08-01 2017-10-17 Corning Incorporated Scratch-resistant materials and articles including the same
US9576811B2 (en) 2015-01-12 2017-02-21 Lam Research Corporation Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)
WO2016187186A1 (en) 2015-05-19 2016-11-24 Corning Incorporated Articles and methods for bonding sheets with carriers
CN117534339A (zh) 2015-06-26 2024-02-09 康宁股份有限公司 包含板材和载体的方法和制品
JP6123919B2 (ja) 2016-01-07 2017-05-10 住友ベークライト株式会社 化粧板
JP2019524510A (ja) 2016-08-22 2019-09-05 コーニング インコーポレイテッド 制御可能に結合されたシートの物品およびその製造方法
US10079154B1 (en) 2017-03-20 2018-09-18 Lam Research Corporation Atomic layer etching of silicon nitride

Also Published As

Publication number Publication date
CN106457758B (zh) 2018-11-16
US11192340B2 (en) 2021-12-07
CN106457758A (zh) 2017-02-22
KR20160145062A (ko) 2016-12-19
TW201601211A (zh) 2016-01-01
EP3129221A1 (en) 2017-02-15
WO2015157202A1 (en) 2015-10-15
US20200139677A1 (en) 2020-05-07
JP2017518954A (ja) 2017-07-13

Similar Documents

Publication Publication Date Title
ZA201904259B (en) Device and method
SG11201608442TA (en) Device modified substrate article and methods for making
HK1245613A1 (zh) 多重擊發的固定裝置及其使用和製造方法
IL253117A0 (en) Abrasive articles and methods of their production
HK1219327A1 (zh) 種應用喚醒方法及裝置
IL246992B (en) Purge device and purge method
ZA201702900B (en) Device and method
SG10201407721WA (en) Article anti-lost device and method
SG11201606136UA (en) Method and device for bonding substrates
SG10201501564WA (en) Article supporting device
GB201402508D0 (en) Semiconductor modification process and structures
EP3020514C0 (de) Handhabungsvorrichtung und verfahren zur handhabung von artikeln
TWI562334B (en) Semiconductor device and methods for forming the same
PL3233427T3 (pl) Sposób i urządzenie do wytwarzania korpusów kształtowych
SG11201607890SA (en) Imprint apparatus and article manufacturing method
SG11201704557PA (en) Method and device for prefixing substrates
IL240681A0 (en) A system for holding and arranging items
EP3178765A4 (en) Article conveying method and device therefor
PL3240655T3 (pl) Artykuły ścierne i sposoby ich formowania
EP3219297A4 (en) Method and device for manufacturing wearable article
EP3107117A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD FOR SEMICONDUCTOR COMPONENT
GB2525625B (en) Device and method
IL251714B (en) Semiconductor device and method of manufacturing the same
TWI561904B (en) Substrate packaging structure and packaging method thereof
IL235083B (en) Method and device for liquid atomization