RU2009130670A - Печатные платы - Google Patents
Печатные платы Download PDFInfo
- Publication number
- RU2009130670A RU2009130670A RU2009130670/07A RU2009130670A RU2009130670A RU 2009130670 A RU2009130670 A RU 2009130670A RU 2009130670/07 A RU2009130670/07 A RU 2009130670/07A RU 2009130670 A RU2009130670 A RU 2009130670A RU 2009130670 A RU2009130670 A RU 2009130670A
- Authority
- RU
- Russia
- Prior art keywords
- printed circuit
- circuit board
- composition
- solder
- coating
- Prior art date
Links
- 239000000203 mixture Substances 0.000 claims abstract 18
- 229910000679 solder Inorganic materials 0.000 claims abstract 17
- 229920000642 polymer Polymers 0.000 claims abstract 12
- 239000011248 coating agent Substances 0.000 claims abstract 11
- 238000000576 coating method Methods 0.000 claims abstract 11
- 150000008282 halocarbons Chemical class 0.000 claims abstract 11
- 238000000034 method Methods 0.000 claims abstract 8
- 238000000151 deposition Methods 0.000 claims abstract 6
- 230000007613 environmental effect Effects 0.000 claims abstract 5
- 230000008021 deposition Effects 0.000 claims abstract 4
- 238000010521 absorption reaction Methods 0.000 claims abstract 3
- 230000008020 evaporation Effects 0.000 claims abstract 3
- 238000001704 evaporation Methods 0.000 claims abstract 3
- 230000004907 flux Effects 0.000 claims abstract 3
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract 2
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract 2
- 239000008199 coating composition Substances 0.000 claims abstract 2
- 239000006185 dispersion Substances 0.000 claims abstract 2
- 238000009501 film coating Methods 0.000 claims abstract 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 238000005507 spraying Methods 0.000 claims abstract 2
- 238000004544 sputter deposition Methods 0.000 claims abstract 2
- 239000010409 thin film Substances 0.000 claims abstract 2
- 229910001512 metal fluoride Inorganic materials 0.000 claims 3
- 238000005260 corrosion Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract
1. Печатная плата, на которой предусматривается выполнение паяного соединения, при этом на поверхности печатной платы имеется покрытие из композиции, включающей один или несколько галогенуглеводородных полимеров, с толщиной от 1 нм до 10 мкм, в которой отсутствует припой, или в основном отсутствует припой между указанной композицией покрытия и токопроводящими дорожками печатной платы. ! 2. Печатная плата по п.1, содержащая покрытие из композиции, включающей один или несколько галогенуглеводородных полимеров толщиной от 10 нм до 100 нм. ! 3. Печатная плата по любому из предшествующих пунктов, в которой полимер является фторуглеводородом. ! 4. Способ защиты печатной платы, включающий создание печатной платы, имеющей поверхность, подверженную воздействию факторов окружающей среды, и не содержащей припоя, или в основном не содержащей припоя на указанной поверхности, подверженной воздействию факторов окружающей среды, и нанесение на указанную поверхность композиции толщиной от 10 нм до 10 мкм, содержащей галогенуглеводородный полимер, путем напыления тонкопленочных покрытий, такими методами, как плазменное осаждение, химическое осаждение из паровой фазы, молекулярно-пучковая эпитаксия или распыление. ! 5. Способ по п.4, в котором способ осаждения является плазменным осаждением. ! 6. Способ выполнения соединения на печатной плате, имеющей покрытие из композиции, содержащей галогенуглеводородный полимер, при этом способ включает нанесение припоя и флюса на печатную плату при температуре и в течение периода времени таким образом, чтобы обеспечивалось локальное рассеяние и (или) абсорбция, и (или) испарение паяных соедине
Claims (12)
1. Печатная плата, на которой предусматривается выполнение паяного соединения, при этом на поверхности печатной платы имеется покрытие из композиции, включающей один или несколько галогенуглеводородных полимеров, с толщиной от 1 нм до 10 мкм, в которой отсутствует припой, или в основном отсутствует припой между указанной композицией покрытия и токопроводящими дорожками печатной платы.
2. Печатная плата по п.1, содержащая покрытие из композиции, включающей один или несколько галогенуглеводородных полимеров толщиной от 10 нм до 100 нм.
3. Печатная плата по любому из предшествующих пунктов, в которой полимер является фторуглеводородом.
4. Способ защиты печатной платы, включающий создание печатной платы, имеющей поверхность, подверженную воздействию факторов окружающей среды, и не содержащей припоя, или в основном не содержащей припоя на указанной поверхности, подверженной воздействию факторов окружающей среды, и нанесение на указанную поверхность композиции толщиной от 10 нм до 10 мкм, содержащей галогенуглеводородный полимер, путем напыления тонкопленочных покрытий, такими методами, как плазменное осаждение, химическое осаждение из паровой фазы, молекулярно-пучковая эпитаксия или распыление.
5. Способ по п.4, в котором способ осаждения является плазменным осаждением.
6. Способ выполнения соединения на печатной плате, имеющей покрытие из композиции, содержащей галогенуглеводородный полимер, при этом способ включает нанесение припоя и флюса на печатную плату при температуре и в течение периода времени таким образом, чтобы обеспечивалось локальное рассеяние и (или) абсорбция, и (или) испарение паяных соединений с металлом и композиции.
7. Использование композиции, включающей галогенуглеводородный полимер для защиты печатной платы от воздействия факторов окружающей среды, на которой предусматривается выполнение паяного соединения через композицию без ее предварительного удаления путем рассеяния и (или) абсорбции, и (или) испарения композиции выборочно в присутствии флюса.
8. Использование композиции, включающей галогенуглеводородный полимер, для обеспечения длительной устойчивости заготовки печатной платы при хранении, на которой предусматривается выполнение паяного соединения.
9. Использование композиции, включающей галогенуглеводородный полимер, с целью предотвращения окисления и (или) коррозии токопроводящих дорожек заготовки печатной платы до нанесения припоя на указанные токопроводящие дорожки и (или) до формирования паяного соединения.
10. Печатная плата, на которой предусматривается выполнение паяного соединения, при этом поверхность указанной печатной платы имеет покрытие из фторида металла, в которой толщина покрытия составляет от монослоя до 5 нм.
11. Печатная плата по п.10, дополнительно включающая покрытие из композиции, нанесенной поверх покрытия из фторида металла, при этом композиция включает один или несколько галогенуглеводородных полимеров с толщиной слоя от 1 нм до 10 мкм.
12. Использование композиции, в которой применяется сочетание галогенуглеводородного полимера и фторида метала, с целью обеспечения комбинированной стойкости к окислению и коррозии, сохраняя при этом свойство «проведения сварки через покрытие» указанной композиции, обеспечивающее формирование прочных паяных соединений.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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GB0703172.7 | 2007-02-19 | ||
GB0703172A GB0703172D0 (en) | 2007-02-19 | 2007-02-19 | Printed circuit boards |
PCT/GB2008/000552 WO2008102113A2 (en) | 2007-02-19 | 2008-02-18 | Printed circuit boards |
Publications (2)
Publication Number | Publication Date |
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RU2009130670A true RU2009130670A (ru) | 2011-04-10 |
RU2563978C2 RU2563978C2 (ru) | 2015-09-27 |
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Application Number | Title | Priority Date | Filing Date |
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RU2009130670/07A RU2563978C2 (ru) | 2007-02-19 | 2008-02-18 | Печатные платы |
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US (2) | US8492898B2 (ru) |
EP (1) | EP2130417B1 (ru) |
JP (3) | JP5558112B2 (ru) |
KR (3) | KR102096147B1 (ru) |
CN (1) | CN101682998B (ru) |
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TR (1) | TR201905093T4 (ru) |
TW (1) | TWI462671B (ru) |
WO (1) | WO2008102113A2 (ru) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
DE102007062202B4 (de) * | 2007-12-21 | 2021-06-10 | Vitesco Technologies GmbH | Beschreibung Verfahren zur Kontaktierung einer starren Leiterplatte mit einem Kontaktpartner und Anordnung aus starrer Leiterplatte und Kontaktpartner |
US8618420B2 (en) | 2008-08-18 | 2013-12-31 | Semblant Global Limited | Apparatus with a wire bond and method of forming the same |
CA2957997C (en) * | 2008-08-18 | 2019-10-22 | Semblant Limited | Halo-hydrocarbon polymer coating |
GB2462824A (en) * | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
US8701657B2 (en) * | 2008-08-21 | 2014-04-22 | Geno Llc | Systems for generating nitric oxide |
BE1019159A5 (nl) * | 2010-01-22 | 2012-04-03 | Europlasma Nv | Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces. |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
GB201003067D0 (en) * | 2010-02-23 | 2010-04-07 | Semblant Ltd | Plasma-polymerized polymer coating |
GB2485419B (en) * | 2010-11-15 | 2015-02-25 | Semblant Ltd | Method for reducing creep corrosion |
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EP2130417A2 (en) | 2009-12-09 |
CA2678309C (en) | 2016-10-04 |
US9648720B2 (en) | 2017-05-09 |
ES2728309T3 (es) | 2019-10-23 |
US20130334292A1 (en) | 2013-12-19 |
US20100025091A1 (en) | 2010-02-04 |
RU2563978C2 (ru) | 2015-09-27 |
KR20100014493A (ko) | 2010-02-10 |
CN101682998B (zh) | 2012-09-19 |
GB2453083B (en) | 2009-08-05 |
WO2008102113A2 (en) | 2008-08-28 |
KR20170089979A (ko) | 2017-08-04 |
GB0703172D0 (en) | 2007-03-28 |
TW200843590A (en) | 2008-11-01 |
US8492898B2 (en) | 2013-07-23 |
EP2130417B1 (en) | 2019-03-27 |
CN101682998A (zh) | 2010-03-24 |
TWI462671B (zh) | 2014-11-21 |
TR201905093T4 (tr) | 2019-05-21 |
CA2678309A1 (en) | 2008-08-28 |
KR20150043557A (ko) | 2015-04-22 |
GB2453083A (en) | 2009-03-25 |
JP2017005280A (ja) | 2017-01-05 |
KR102096147B1 (ko) | 2020-04-01 |
JP5558112B2 (ja) | 2014-07-23 |
AU2008217648A1 (en) | 2008-08-28 |
JP2013141016A (ja) | 2013-07-18 |
WO2008102113A3 (en) | 2008-12-11 |
DK2130417T3 (da) | 2019-05-27 |
GB0900635D0 (en) | 2009-02-25 |
PL2130417T3 (pl) | 2019-10-31 |
JP2010519728A (ja) | 2010-06-03 |
AU2008217648B2 (en) | 2010-07-29 |
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