KR940015697A - 노광방법 및 그 장치 - Google Patents

노광방법 및 그 장치 Download PDF

Info

Publication number
KR940015697A
KR940015697A KR1019930030163A KR930030163A KR940015697A KR 940015697 A KR940015697 A KR 940015697A KR 1019930030163 A KR1019930030163 A KR 1019930030163A KR 930030163 A KR930030163 A KR 930030163A KR 940015697 A KR940015697 A KR 940015697A
Authority
KR
South Korea
Prior art keywords
photosensitive substrate
optical system
mask
pattern
projection optical
Prior art date
Application number
KR1019930030163A
Other languages
English (en)
Other versions
KR100300618B1 (ko
Inventor
야스유끼 사까끼바라
야스아끼 다나까
세이로 무라까미
겐지 니시
Original Assignee
오노 시게오
가부시끼가이샤 니 콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34607392A external-priority patent/JP3218484B2/ja
Priority claimed from JP04242693A external-priority patent/JP3309927B2/ja
Priority claimed from JP06727193A external-priority patent/JP3316833B2/ja
Application filed by 오노 시게오, 가부시끼가이샤 니 콘 filed Critical 오노 시게오
Publication of KR940015697A publication Critical patent/KR940015697A/ko
Application granted granted Critical
Publication of KR100300618B1 publication Critical patent/KR100300618B1/ko

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026Focusing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

마스크로 형성된 패턴을 감광 기판상의 복수의 구획영역의 각각에 스텝 앤드리피트 방식으로 노광하는 장치는, 상기 마스크패턴을 상기 감광 기판상에 투영하는 투영광학계와, 상기 감광기판을 간직하여 상기 투영 광학계의 광축과 수직인 면에서 2차원 이동하는 기판 스테이지와, 상기 감광 기판상에 소정 형상의 패턴상을 투영함과 동시에 상기 투영기판에서 반사한 광을 광전 검출하여 상기 감광 기판상의 복수점의 각각에서의 상기 투영광학계의 광축방향의 위치를 검출하는 장치와, 상기 기판 스테이지의 스텝핑중에 상기 마스크패턴을 노광 해야할 다음 구획영역 내의 복수 계측점의 각각이 상기 패턴상과 일치, 혹은 근접할때에 상기 검출장치에 의하여 순차 검출되는 복수의 위치에 기인하여 상기 투영광학계의 결상면과 상기 다음 구획 영역의 상기 축방향의 어긋남량을 측정하는 장치로 이루어지며, 상기 다음구획 영역에 상기 마스크패턴이 노광되기 전에 상기 측정된 어긋남량에 따라 상기 결상면과 상기 다음구획 영역이 상기 광축 방향으로 상대 이동된다.

Description

노광방법 및 그 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 투영노광 장치의 구성을 부분적으로 나타낸 도면, 제2도는 투영 광학계의 투영 시야와 다점 AF계의 패턴상과의 위치 관계를 나타낸 도면, 제3A도 및 제3B도 및 제3C도는 XY 스테이지의 이동중에 웨이퍼상의 쇼트 영역내의 복수 계측점 각각에서의 높이 계측 동작을 설명하는 도면.

Claims (9)

  1. 마스크의 패턴을 상기 감광기판상에 투영하는 투영광학계와; 상기 감광기판을 보호 유지하여 상기 투영광학계의 광축과 수직인면 내에서 2차원 이동하는 기판 스테이지와; 상기 감광기판상에 소정형상의 패턴상을 투영함과 동시에, 상기 감광기판에서 반사된 광을 광전검출하여, 상기 감광기판상의 복수점의 각각에 있어서의 상기 투영광학계의 광축방향의 위치를 검출하는 수단과; 상기 기판스테이지의 스텝핑 중에, 상기 마스크의 패턴을 노광할 다음의 구획영역내의 복수의 계측점의 각각이 상기 패턴상과 일치, 혹은 근접했을 때에 상기 검출수단에으해 순차적으로 검출되는 복수의 위치에 의거하여, 상기 투영광학계의 결상면과 상기 다음 구획영역과의 상기 광축방향의 어긋남을 측정하는 수단을 포함하며, 마스크에 형성된 패턴을 감광기판상의 복수의 구획영역의 각각에 스텝 앤드 리피트 방식으로 노광하는 장치에 있어서, 상기 다음의 구획영역에 상기 마스크 패턴이 노광되기 전에, 상기 측정된 어긋남 양에 대응하여 상기 결상면과 상기 다음의 구획영역이 상기 광축방향으로 상대 이동되는 것을 특징으로 하는 장치.
  2. 제1항에 있어서, 상기 측정수단은 상기 복수의 위치를 통계연산하여 상기 다음의 구획영역의 면위치를 산출하는 연산수단을 가지며, 그 산출한 면위치에 따라, 상기 광축방향의 어긋남 양 및 상기 결상면과 상기 다음의 구획영역의 표면과의 상대적은 경사량을 구하고; 상기 경사량 및 어긋남량을 영역으로 하도록, 상기 결상면과 상기 다음의 구획영역을 상대적으로 기울임과 동시에, 상기 광축방향으로 상대이동하는 보정수단을 포함하는 것을 특징으로 하는 장치.
  3. 제2항에 있어서, 상기 보정수단은 상기 감광기판을 얹어 놓고, 상기 투영광학계의 광축과 수직인 면에 대하여 경사가능하며, 동시에, 상기 광축방향으로 이동가능한 가동 테이블을 포함하는 것을 특징으로 하는 장치.
  4. 제1항에 있어서, 상기 검출수단은 상기 투영광학계의 투영시야내의 복수의 위치 각각에 패턴상을 투영하는 수단과, 상기 기판 스테이지의 스텝핑방향에 대응하여 상기 복수의 패턴상중 얼마만큼 선택하는 수단을 가지며, 그 선택된 몇개의 패턴상을 이용하여, 상기 다음의 구획영역내의 복수의 계측점 각각에서의 상기 광축방향의 위치를 검출하는 것을 특징으로 하는 장치.
  5. 마스크의 패턴을 감광기판상에 주사노광하는 장치에 있어서, 마스크를 보유하고 상기 패턴의 면을 따른 소정방향으로 이동가능한 마스크 스테이지와; 상기 마스크의 패턴을 상기 감광기판상에 투영하는 투영광학계와; 상기 마스크의 패턴을 상기 감광기파상의 구획영역에 주사노광할때, 상기 마스크 스테이지와 상기 기판 스테이지를 동시에 구동하는 수단과; 상기 소정방향에 관하여 상기 투영광학계에 따른 상기 마스크의 패턴의 투영영역의 양측에 각각 적어도 하나의 패턴상을 투영하는 투영계를 포함하며, 상기 감광기판상에 복수의 패턴상을 투영함과 동시에, 상기 감광판에서 반사한 광을 광전검출하여, 상기 감광기판상의 복수점의 각각에 있어서의 상기 투영광학계의 광 축방향의 위치를 검훌하기 위한 수단과; 상기 주사노광중 상기 검출수단에서 출력되는 위치정보에따라, 상기 외측방향에 관하여 상기 투광광학계의 결상면과 상기 구획영역과를 합치시키는 수단으로 구성되는 것을 특징으로 하는 장치.
  6. 마스크와 감광기판과를 소정 방향으로 동시주사하여, 상기 마스크의 패턴을 투영광학계를 사이에 두고 상기 감광기판상의 구획영역에 주사노광 하는 방법에 있어서, 마스크와 상기 감광기판과의 도기주사를 개시한 후, 상기 투영광학계에 의한 상기 마스크의 패턴의 투영영역에서 상기 소정방향으로 소정간격만큼 떨어진 상기 감광기판상의 구획영역과 상기 투영광학계의 결상면과의 광축방향과의 편차를 검출하고, 상기 구획영역이 상기 투영영내에 도달했을 때에, 상기 검출된 편차를 이용하여 상기 감광기판을 상기 광축방향으로 이동하여, 상기 구획영역을 상기 투영광학계의 결상면에 합치시키는 것을 특징으로 하는 방법.
  7. 마스크와 감광기판용 소정방향으로 동기 주사하여, 상기 마스크의 패턴을 투영광학계를 사이에 두고 상기 감광기판상의 구획 영역에 주사노광하는 방법에 있어서, 마스크와 상기 감광기판과의 동기주사를 개시한후, 상기 투영광학계에 의한 상기 마스크의 패턴의 투영영역에서 상기 소정방향으로 소정간격만큼 떨어진 상기 감광기판상의 구획영역표면과 상기 투영광학계의 결상면과의 상대적인 경사량을 검출하고; 상기 구획영역이 상기 투영영역내에 도달했을 때, 상기 검출된 경사량을 이용하여 상기 감광기판과 상기 결상면을 상대적으로 기울이며, 상기 구획영역표면을 상기 투영 광학계의 결상면과 대략 평행하게 설정하는 것을 특징으로 하는 방법.
  8. 마스크 패턴을 감광기판상에 주사노광하는 장치에 있어서, 상기 마스크의 패턴을 상기 감광기판상에 투영하는 투영광학계; 상기 감광기판상의 복수점의 각각에서의 상기 투영광학계의 광축방향의 위치를 검출하는 다점계측수단과; 그 다점계측수단의 검출결과에 의해 상기 감광기판과 상기 투영광학계의 결상면과의 상대적인 경사각을 산출하는 연산수단과; 상기 감광기판을 보호하고 상기 투영광학계의 결상면에 대하여 상대적으로 경사가능한 테이블 및; 상기 마스크와 상기 감광기판의 주사방향에 관한 상기 테이블의 응답 속도와 직교하는 방향에 관한 상기 테이블의 응답속도를 다르게 하며 상기 산출된 경사각에 따라 기울어지는 상기 테이블의 응답 속도를 설정하는 수단을 구비하는 것을 특징으로 하는 장치.
  9. 마스크 패턴을 감광 기판상에 주사 노광하는 장치에 있어서, 상기 마스크 패턴을 상기 감광 기판상에 투영하는 투영광학계와; 상기 감광 기판과 상기 투영 광학계의 결상면을 광축방향으로 상대이동하는 수단과; 상기 투영 광학계에 따른 상기 마스크패턴의 투영영역으로부터 소정의 거리만큼 떨어진 복수의 계측점 각각에서, 상기 감광기판과 상기 투영 광학계의 결상면의 광축 방향의 편차를 검출하는 수단과; 상기 검출된 복수의 편차중의 최대치와 최소치에 기인하여 상기 상대 이동 수단을 제어하는 수단을 포함하는 것을 특징으로 하는 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930030163A 1992-12-25 1993-12-24 노광방법,노광장치,및그장치를사용하는디바이스제조방법 KR100300618B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP34607392A JP3218484B2 (ja) 1992-12-25 1992-12-25 投影露光装置、露光方法、及び該方法を用いる半導体製造方法
JP92-346073 1992-12-25
JP93-42426 1993-03-03
JP04242693A JP3309927B2 (ja) 1993-03-03 1993-03-03 露光方法、走査型露光装置、及びデバイス製造方法
JP06727193A JP3316833B2 (ja) 1993-03-26 1993-03-26 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法
JP93-67271 1993-03-26

Related Child Applications (5)

Application Number Title Priority Date Filing Date
KR1019990011934A Division KR100306311B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법 및 주사노광방법
KR1019990011935A Division KR100311427B1 (ko) 1992-12-25 1999-03-29 주사노광방법과 그 방법을 사용하는 디바이스 제조방법
KR1019990010829A Division KR100325182B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치, 노광방법, 및 디바이스 제조방법
KR1019990010828A Division KR100307049B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치, 주사노광방법, 및 디바이스 제조방법
KR1019990010827A Division KR100306310B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법 및 주사노광방법

Publications (2)

Publication Number Publication Date
KR940015697A true KR940015697A (ko) 1994-07-21
KR100300618B1 KR100300618B1 (ko) 2001-11-22

Family

ID=37478173

Family Applications (10)

Application Number Title Priority Date Filing Date
KR1019930030163A KR100300618B1 (ko) 1992-12-25 1993-12-24 노광방법,노광장치,및그장치를사용하는디바이스제조방법
KR1019990011934A KR100306311B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법 및 주사노광방법
KR1019990011935A KR100311427B1 (ko) 1992-12-25 1999-03-29 주사노광방법과 그 방법을 사용하는 디바이스 제조방법
KR1019990010827A KR100306310B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법 및 주사노광방법
KR1019990010829A KR100325182B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치, 노광방법, 및 디바이스 제조방법
KR1019990010828A KR100307049B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치, 주사노광방법, 및 디바이스 제조방법
KR1019990015291A KR100325184B1 (ko) 1992-12-25 1999-04-28 노광방법, 노광장치, 및 디바이스 제조방법
KR1020010009582A KR100313732B1 (ko) 1992-12-25 2001-02-26 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법및 주사노광방법
KR1020010009581A KR100300627B1 (ko) 1992-12-25 2001-02-26 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법및 주사노광방법
KR1020010009876A KR100325193B1 (ko) 1992-12-25 2001-02-27 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법및 주사노광방법

Family Applications After (9)

Application Number Title Priority Date Filing Date
KR1019990011934A KR100306311B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법 및 주사노광방법
KR1019990011935A KR100311427B1 (ko) 1992-12-25 1999-03-29 주사노광방법과 그 방법을 사용하는 디바이스 제조방법
KR1019990010827A KR100306310B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법 및 주사노광방법
KR1019990010829A KR100325182B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치, 노광방법, 및 디바이스 제조방법
KR1019990010828A KR100307049B1 (ko) 1992-12-25 1999-03-29 주사형 노광장치, 주사노광방법, 및 디바이스 제조방법
KR1019990015291A KR100325184B1 (ko) 1992-12-25 1999-04-28 노광방법, 노광장치, 및 디바이스 제조방법
KR1020010009582A KR100313732B1 (ko) 1992-12-25 2001-02-26 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법및 주사노광방법
KR1020010009581A KR100300627B1 (ko) 1992-12-25 2001-02-26 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법및 주사노광방법
KR1020010009876A KR100325193B1 (ko) 1992-12-25 2001-02-27 주사형 노광장치와 그 장치를 사용하는 디바이스 제조방법및 주사노광방법

Country Status (2)

Country Link
US (4) US5448332A (ko)
KR (10) KR100300618B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328004B1 (ko) * 1993-04-06 2002-03-09 시마무라 테루오 주사노광방법, 주사형 노광장치 및 소자제조방법
KR100449056B1 (ko) * 1995-10-19 2004-12-03 가부시키가이샤 니콘 주사형투영노광장치

Families Citing this family (319)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3158446B2 (ja) * 1990-12-13 2001-04-23 株式会社ニコン 表面位置検出装置及び表面位置検出方法、並びに露光装置、露光方法及び半導体製造方法
US5415835A (en) * 1992-09-16 1995-05-16 University Of New Mexico Method for fine-line interferometric lithography
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
US5591958A (en) * 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
US6078381A (en) * 1993-02-01 2000-06-20 Nikon Corporation Exposure method and apparatus
US5602622A (en) * 1993-02-26 1997-02-11 Ziegler; William R. Alignable negative stage for a photographic enlarger
JP3291818B2 (ja) * 1993-03-16 2002-06-17 株式会社ニコン 投影露光装置、及び該装置を用いる半導体集積回路製造方法
US6122036A (en) * 1993-10-21 2000-09-19 Nikon Corporation Projection exposure apparatus and method
US6009279A (en) * 1993-12-03 1999-12-28 Nikon Corporation Photographing apparatus having anti-vibration function
JP3500618B2 (ja) * 1994-03-28 2004-02-23 株式会社ニコン 走査型露光装置
US5874820A (en) * 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US6989647B1 (en) 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5777722A (en) * 1994-04-28 1998-07-07 Nikon Corporation Scanning exposure apparatus and method
JPH0864518A (ja) * 1994-06-14 1996-03-08 Canon Inc 露光方法
JPH0845814A (ja) * 1994-07-27 1996-02-16 Nikon Corp 露光装置および位置決め方法
JP3572430B2 (ja) * 1994-11-29 2004-10-06 株式会社ニコン 露光方法及びその装置
US5563684A (en) * 1994-11-30 1996-10-08 Sgs-Thomson Microelectronics, Inc. Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer
US5754299A (en) * 1995-01-13 1998-05-19 Nikon Corporation Inspection apparatus and method for optical system, exposure apparatus provided with the inspection apparatus, and alignment apparatus and optical system thereof applicable to the exposure apparatus
JPH08316134A (ja) * 1995-05-24 1996-11-29 Nikon Corp 露光方法
JP3634068B2 (ja) 1995-07-13 2005-03-30 株式会社ニコン 露光方法及び装置
JPH09115799A (ja) 1995-10-16 1997-05-02 Nikon Corp 走査型露光装置
JP3564833B2 (ja) 1995-11-10 2004-09-15 株式会社ニコン 露光方法
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
JPH09237752A (ja) * 1996-03-01 1997-09-09 Nikon Corp 投影光学系の調整方法及び該方法を使用する投影露光装置
KR970067585A (ko) * 1996-03-25 1997-10-13 오노 시게오 결상특성의 측정방법 및 투영노광방법
KR970072024A (ko) * 1996-04-09 1997-11-07 오노 시게오 투영노광장치
JPH09304015A (ja) * 1996-05-09 1997-11-28 Nikon Corp 面位置検出方法及び面位置調整装置並びに投影露光装置
JPH09320933A (ja) * 1996-05-28 1997-12-12 Nikon Corp 走査型露光装置
KR980005334A (ko) 1996-06-04 1998-03-30 고노 시게오 노광 방법 및 노광 장치
US6559465B1 (en) * 1996-08-02 2003-05-06 Canon Kabushiki Kaisha Surface position detecting method having a detection timing determination
KR19980019031A (ko) 1996-08-27 1998-06-05 고노 시게오 스테이지 장치(a stage apparatus)
JPH1097083A (ja) * 1996-09-19 1998-04-14 Nikon Corp 投影露光方法及び投影露光装置
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
SG88824A1 (en) * 1996-11-28 2002-05-21 Nikon Corp Projection exposure method
JP2910716B2 (ja) * 1997-01-16 1999-06-23 日本電気株式会社 光強度計算のパラメトリック解析方法
JPH10209039A (ja) 1997-01-27 1998-08-07 Nikon Corp 投影露光方法及び投影露光装置
EP0867771A3 (en) * 1997-03-24 2000-10-25 Nikon Corporation Exposure apparatus, exposure method, and circuit making method
US6455214B1 (en) 1997-03-24 2002-09-24 Nikon Corporation Scanning exposure method detecting focus during relative movement between energy beam and substrate
JPH10326733A (ja) * 1997-05-23 1998-12-08 Mitsubishi Electric Corp スリットスキャン式投影露光装置及び投影露光方法並びにこれを用いた半導体装置の製造方法
US5898479A (en) * 1997-07-10 1999-04-27 Vlsi Technology, Inc. System for monitoring optical properties of photolithography equipment
JPH1154407A (ja) 1997-08-05 1999-02-26 Nikon Corp 位置合わせ方法
JP3428872B2 (ja) * 1997-08-29 2003-07-22 キヤノン株式会社 露光方法および装置
EP1039510A4 (en) 1997-11-14 2003-11-12 Nikon Corp EXPOSURE DEVICE, MANUFACTURING METHOD THEREOF, AND EXPOSURE METHOD
TW448487B (en) 1997-11-22 2001-08-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
JPH11162832A (ja) * 1997-11-25 1999-06-18 Nikon Corp 走査露光方法及び走査型露光装置
AU2076099A (en) 1998-01-29 1999-08-16 Nikon Corporation Exposure method and device
US6088322A (en) 1998-05-07 2000-07-11 Broome; Barry G. Single objective lens for use with CD or DVD optical disks
JPH11345761A (ja) 1998-05-29 1999-12-14 Nikon Corp 走査型露光装置
US6819799B1 (en) * 1998-07-17 2004-11-16 Fuji Photo Film Co., Ltd. Image reading apparatus, original reading method and original conveyance apparatus
JP2000082651A (ja) * 1998-09-04 2000-03-21 Nec Corp 走査露光装置及び走査露光方法
US6287735B2 (en) 1998-09-16 2001-09-11 Nikon Corporation Method and apparatus for controlling the leveling table of a wafer stage
USH1972H1 (en) 1998-10-06 2001-07-03 Nikon Corporation Autofocus system using common path interferometry
JP2000124122A (ja) * 1998-10-19 2000-04-28 Canon Inc 半導体露光装置および同装置を用いるデバイス製造方法
US6765647B1 (en) 1998-11-18 2004-07-20 Nikon Corporation Exposure method and device
TW466542B (en) 1999-02-26 2001-12-01 Nippon Kogaku Kk A stage device and a method of manufacturing same, a position controlling method, an exposure device and a method of manufacturing same, and a device and a method of manufacturing same
US7023521B2 (en) * 1999-04-13 2006-04-04 Nikon Corporation Exposure apparatus, exposure method and process for producing device
JP2001075294A (ja) * 1999-07-08 2001-03-23 Nikon Corp 面位置検出方法及び装置、並びに露光方法及び装置、露光装置の製造方法、半導体デバイス製造方法
US6381004B1 (en) 1999-09-29 2002-04-30 Nikon Corporation Exposure apparatus and device manufacturing method
US6768124B2 (en) 1999-10-19 2004-07-27 Nikon Corporation Reticle-focus detector, and charged-particle-beam microlithography apparatus and methods comprising same
US6538721B2 (en) * 2000-03-24 2003-03-25 Nikon Corporation Scanning exposure apparatus
US6633050B1 (en) * 2000-08-15 2003-10-14 Asml Holding Nv. Virtual gauging system for use in lithographic processing
US7561270B2 (en) * 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7289212B2 (en) * 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
TW527526B (en) 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7136159B2 (en) * 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
AU2001294275A1 (en) * 2000-10-19 2002-04-29 Nikon Corporation Position detection method, position detection device, exposure method, exposure system, control program, and device production method
US6958808B2 (en) * 2000-11-16 2005-10-25 Nikon Corporation System and method for resetting a reaction mass assembly of a stage assembly
US6885430B2 (en) * 2000-11-16 2005-04-26 Nikon Corporation System and method for resetting a reaction mass assembly of a stage assembly
US6852988B2 (en) * 2000-11-28 2005-02-08 Sumitomo Heavy Industries, Ltd. Gap adjustment apparatus and gap adjustment method for adjusting gap between two objects
KR20020074232A (ko) * 2000-12-06 2002-09-28 가부시키가이샤 니콘 X선 투영 노광장치, x선 투영 노광방법 및 반도체디바이스
CN1208654C (zh) * 2000-12-07 2005-06-29 索尼公司 图像投影装置、投影镜像图形、激光驱动装置、摄影装置
JP2002195819A (ja) * 2000-12-27 2002-07-10 Nikon Corp 形状測定方法、形状測定装置、露光方法、露光装置、及びデバイス製造方法
KR20020060282A (ko) 2001-01-10 2002-07-18 윤종용 리소그래피 시스템에서 노광 제어방법 및 노광 제어장치
EP1255162A1 (en) * 2001-05-04 2002-11-06 ASML Netherlands B.V. Lithographic apparatus
JP2002334826A (ja) * 2001-05-09 2002-11-22 Canon Inc 露光方法、面位置合わせ方法、露光装置及びデバイス製造方法
DE10125971A1 (de) * 2001-05-29 2002-12-05 Leica Mikroskopie Systeme Ag H Verfahren zur Entfernungsmessung ausgedehnter Objekte in Verbindung mit einer optischen Betrachtungseinrichtung und Mikroskop zur Durchführung desselben
US7742938B2 (en) * 2001-08-30 2010-06-22 International Business Machines Corporation System and method for evaluating maintenance costs of products
US7303578B2 (en) 2001-11-01 2007-12-04 Photothera, Inc. Device and method for providing phototherapy to the brain
JP3780221B2 (ja) * 2002-03-26 2006-05-31 キヤノン株式会社 露光方法及び装置
JP3550394B2 (ja) * 2002-07-16 2004-08-04 沖電気工業株式会社 焦点ずれ測定方法及び焦点位置合わせ方法
JP2004063653A (ja) * 2002-07-26 2004-02-26 Nikon Corp 防振装置、ステージ装置及び露光装置
US7019844B2 (en) * 2002-08-13 2006-03-28 Lam Research Corporation Method for in-situ monitoring of patterned substrate processing using reflectometry.
US6979578B2 (en) * 2002-08-13 2005-12-27 Lam Research Corporation Process endpoint detection method using broadband reflectometry
US7399711B2 (en) * 2002-08-13 2008-07-15 Lam Research Corporation Method for controlling a recess etch process
JP2004132867A (ja) * 2002-10-11 2004-04-30 Shimadzu Corp 基板検査装置
CN101872135B (zh) * 2002-12-10 2013-07-31 株式会社尼康 曝光设备和器件制造法
DE10261775A1 (de) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
JP4174324B2 (ja) 2003-01-06 2008-10-29 キヤノン株式会社 露光方法及び装置
JP4652667B2 (ja) * 2003-02-13 2011-03-16 キヤノン株式会社 面位置計測方法及び走査型露光装置
EP1596425A4 (en) * 2003-02-19 2007-08-01 Nikon Corp Transfer method, exposure method and exposure device, and construction element manufacturing method
JP4174356B2 (ja) * 2003-03-10 2008-10-29 キヤノン株式会社 露光方法
JP4280523B2 (ja) * 2003-03-14 2009-06-17 キヤノン株式会社 露光装置及び方法、デバイス製造方法
CN101002140B (zh) * 2003-04-11 2010-12-08 株式会社尼康 保持平板印刷投射透镜下面的浸没流体的设备和方法
ATE542167T1 (de) * 2003-04-17 2012-02-15 Nikon Corp Lithographisches immersionsgerät
US7171054B2 (en) * 2003-05-01 2007-01-30 Eastman Kodak Company Scene-based method for determining focus
EP1482373A1 (en) * 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101419663B1 (ko) 2003-06-19 2014-07-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조방법
US7589911B2 (en) * 2003-09-18 2009-09-15 Canon Kabushiki Kaisha Technique for positioning optical system element
KR101289918B1 (ko) 2003-09-29 2013-07-25 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
JP4840958B2 (ja) * 2003-10-21 2011-12-21 キヤノン株式会社 走査露光装置及びデバイス製造方法
JP2005129674A (ja) 2003-10-23 2005-05-19 Canon Inc 走査露光装置およびデバイス製造方法
US7253885B2 (en) 2003-12-05 2007-08-07 Canon Kabushiki Kaisha Wavelength selecting method, position detecting method and apparatus, exposure method and apparatus, and device manufacturing method
KR101111363B1 (ko) * 2003-12-15 2012-04-12 가부시키가이샤 니콘 투영노광장치 및 스테이지 장치, 그리고 노광방법
US20070081133A1 (en) * 2004-12-14 2007-04-12 Niikon Corporation Projection exposure apparatus and stage unit, and exposure method
JP4497908B2 (ja) * 2003-12-15 2010-07-07 キヤノン株式会社 露光方法及び装置
EP1550527A1 (en) * 2003-12-30 2005-07-06 Advanced Laser Separation International (ALSI) B.V. Method of and arrangement for separating semiconductor elements formed in a wafer of semiconductor material, and semiconductor element separated therewith
JP4758358B2 (ja) 2004-01-29 2011-08-24 ケーエルエー−テンカー コーポレイション レチクル設計データにおける欠陥を検出するためのコンピュータに実装される方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
TWI471900B (zh) * 2004-02-20 2015-02-01 尼康股份有限公司 Exposure method, exposure apparatus, exposure system, and device manufacturing method
US20070229791A1 (en) * 2004-03-16 2007-10-04 Nikon Corporation Step Measuring Device and Apparatus, and Exposure Method and Apparatus
WO2005093792A1 (ja) * 2004-03-25 2005-10-06 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US20070247640A1 (en) * 2004-03-30 2007-10-25 Nikon Corporation Exposure Apparatus, Exposure Method and Device Manufacturing Method, and Surface Shape Detection Unit
WO2005098911A1 (ja) * 2004-04-09 2005-10-20 Nikon Corporation 移動体の駆動方法、ステージ装置及び露光装置
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7796274B2 (en) 2004-06-04 2010-09-14 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system
WO2005122242A1 (ja) 2004-06-07 2005-12-22 Nikon Corporation ステージ装置、露光装置及び露光方法
WO2006001416A1 (ja) * 2004-06-29 2006-01-05 Nikon Corporation 管理方法及び管理システム、並びにプログラム
KR100568876B1 (ko) * 2004-07-21 2006-04-10 삼성전자주식회사 반도체 소자 제조용 노광장치
TWI396225B (zh) * 2004-07-23 2013-05-11 尼康股份有限公司 成像面測量方法、曝光方法、元件製造方法以及曝光裝置
TW200615716A (en) * 2004-08-05 2006-05-16 Nikon Corp Stage device and exposure device
KR101193830B1 (ko) * 2004-08-09 2012-10-23 가부시키가이샤 니콘 광학 특성 계측 장치 및 광학 특성 계측 방법, 노광 장치및 노광 방법, 그리고 디바이스 제조 방법
JP4904034B2 (ja) 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
WO2006040890A1 (ja) * 2004-10-08 2006-04-20 Nikon Corporation 露光装置及びデバイス製造方法
JP2006112788A (ja) * 2004-10-12 2006-04-27 Canon Inc 表面形状計測装置、表面計測方法、及び露光装置
JP4843212B2 (ja) * 2004-10-29 2011-12-21 東京エレクトロン株式会社 レーザー処理装置及びレーザー処理方法
TWI654661B (zh) 2004-11-18 2019-03-21 日商尼康股份有限公司 位置測量方法、位置控制方法、測量方法、裝載方法、曝光方法及曝光裝置、及元件製造方法
US7271907B2 (en) * 2004-12-23 2007-09-18 Asml Netherlands B.V. Lithographic apparatus with two-dimensional alignment measurement arrangement and two-dimensional alignment measurement method
US7557529B2 (en) * 2005-01-11 2009-07-07 Nikon Corporation Stage unit and exposure apparatus
JP5125505B2 (ja) 2005-04-25 2013-01-23 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
CN1700101B (zh) * 2005-05-13 2010-12-08 上海微电子装备有限公司 用于投影光刻机的调焦调平传感器
EP1895570A4 (en) * 2005-05-24 2011-03-09 Nikon Corp EXPOSURE METHOD AND APPARATUS, AND DEVICE MANUFACTURING METHOD
EP1901337A1 (en) * 2005-05-25 2008-03-19 Nikon Corporation Exposure method and lithography system
US7838858B2 (en) * 2005-05-31 2010-11-23 Nikon Corporation Evaluation system and method of a search operation that detects a detection subject on an object
JP2007010951A (ja) * 2005-06-30 2007-01-18 Canon Inc 焦点検出装置及び撮像装置
JP2007027593A (ja) * 2005-07-21 2007-02-01 Canon Inc フォーカス計測方法および計測装置、露光方法および露光装置ならびにオフセット計測装置
US7769225B2 (en) * 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
EP1950794A4 (en) * 2005-10-07 2010-03-31 Nikon Corp METHOD FOR MEASURING AN OPTICAL CHARACTERISTIC, EXPOSURE METHOD, COMPONENT MANUFACTURING METHOD, INVESTIGATION DEVICE AND MEASURING METHOD
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
CN101326617B (zh) * 2005-12-28 2012-06-20 株式会社尼康 图案形成方法及图案形成装置、以及元件制造方法
EP2752714B8 (en) 2006-01-19 2015-10-28 Nikon Corporation Exposure apparatus and exposure method
EP1981066B1 (en) 2006-01-30 2014-01-22 Nikon Corporation Optical member holding apparatus and exposure apparatus
KR100741110B1 (ko) * 2006-02-15 2007-07-19 삼성에스디아이 주식회사 광 파이버 및 플라즈마 디스플레이 패널의 전극 형성 방법
EP1986222A4 (en) 2006-02-16 2010-09-01 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
KR20080102192A (ko) 2006-02-16 2008-11-24 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
JPWO2007094470A1 (ja) * 2006-02-16 2009-07-09 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
EP1986224A4 (en) 2006-02-16 2012-01-25 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
SG178791A1 (en) 2006-02-21 2012-03-29 Nikon Corp Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method and device manufacturing method
CN101385120B (zh) * 2006-02-21 2012-09-05 株式会社尼康 测定装置及方法、处理装置及方法、图案形成装置及方法、曝光装置及方法、以及元件制造方法
EP2003680B1 (en) 2006-02-21 2013-05-29 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
WO2007100087A1 (ja) 2006-03-03 2007-09-07 Nikon Corporation 露光装置及びデバイス製造方法
WO2007105645A1 (ja) 2006-03-13 2007-09-20 Nikon Corporation 露光装置、メンテナンス方法、露光方法及びデバイス製造方法
US8982322B2 (en) * 2006-03-17 2015-03-17 Nikon Corporation Exposure apparatus and device manufacturing method
JP2007250947A (ja) 2006-03-17 2007-09-27 Canon Inc 露光装置および像面検出方法
US20070242254A1 (en) * 2006-03-17 2007-10-18 Nikon Corporation Exposure apparatus and device manufacturing method
US20080013062A1 (en) 2006-03-23 2008-01-17 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
TWI454859B (zh) 2006-03-30 2014-10-01 尼康股份有限公司 移動體裝置、曝光裝置與曝光方法以及元件製造方法
US20070291261A1 (en) * 2006-04-14 2007-12-20 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8125613B2 (en) * 2006-04-21 2012-02-28 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
CN101438385B (zh) * 2006-05-10 2011-02-16 尼康股份有限公司 曝光装置及元件制造方法
JPWO2007135998A1 (ja) 2006-05-24 2009-10-01 株式会社ニコン 保持装置及び露光装置
EP2023379A4 (en) 2006-05-31 2009-07-08 Nikon Corp EXPOSURE APPARATUS AND EXPOSURE METHOD
JP4250637B2 (ja) * 2006-06-14 2009-04-08 キヤノン株式会社 走査露光装置及びデバイス製造方法
WO2008007765A1 (fr) * 2006-07-14 2008-01-17 Nikon Corporation Appareil de détection de position de surface, appareil d'exposition, et procédé de fabrication du dispositif
SG10201507256WA (en) 2006-08-31 2015-10-29 Nikon Corp Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method
EP2991101B1 (en) 2006-08-31 2017-04-12 Nikon Corporation Exposure method and apparatus, and device manufacturing method
KR101638306B1 (ko) 2006-08-31 2016-07-08 가부시키가이샤 니콘 이동체 구동 시스템 및 이동체 구동 방법, 패턴 형성 장치 및 방법, 노광 장치 및 방법, 디바이스 제조 방법, 그리고 결정 방법
KR20180058861A (ko) 2006-09-01 2018-06-01 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
KR101770082B1 (ko) 2006-09-01 2017-08-21 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법
TW200821772A (en) * 2006-09-28 2008-05-16 Nikon Corp Line width measuring method, image forming status detecting method, adjusting method, exposure method and device manufacturing method
JP5151989B2 (ja) * 2006-11-09 2013-02-27 株式会社ニコン 保持装置、位置検出装置及び露光装置、並びにデバイス製造方法
JP5427609B2 (ja) 2006-12-19 2014-02-26 ケーエルエー−テンカー・コーポレーション 検査レシピ作成システムおよびその方法
US7684050B2 (en) * 2006-12-22 2010-03-23 Canon Kabushiki Kaisha Shape measuring apparatus, shape measuring method, and exposure apparatus
WO2008086282A2 (en) 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
WO2008129762A1 (ja) 2007-03-05 2008-10-30 Nikon Corporation 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法
US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
TW200905157A (en) * 2007-04-12 2009-02-01 Nikon Corp Measuring method, exposure method, and device fabricating method
JP2008277468A (ja) * 2007-04-27 2008-11-13 Canon Inc 露光装置及びデバイス製造方法
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US7962863B2 (en) 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US8164736B2 (en) * 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
JP4953923B2 (ja) * 2007-05-30 2012-06-13 キヤノン株式会社 露光装置及びデバイス製造方法
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
KR101614666B1 (ko) 2007-07-18 2016-04-21 가부시키가이샤 니콘 계측 방법, 스테이지 장치, 및 노광 장치
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8194232B2 (en) 2007-07-24 2012-06-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
TWI534408B (zh) 2007-07-24 2016-05-21 尼康股份有限公司 Position measuring system, exposure apparatus, position measuring method, exposure method and component manufacturing method, and measuring tool and measuring method
US8547527B2 (en) * 2007-07-24 2013-10-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method
US8264669B2 (en) * 2007-07-24 2012-09-11 Nikon Corporation Movable body drive method, pattern formation method, exposure method, and device manufacturing method for maintaining position coordinate before and after switching encoder head
US7711514B2 (en) 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
TWI469235B (zh) 2007-08-20 2015-01-11 Kla Tencor Corp 決定實際缺陷是潛在系統性缺陷或潛在隨機缺陷之由電腦實施之方法
US20090051895A1 (en) * 2007-08-24 2009-02-26 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
US8023106B2 (en) * 2007-08-24 2011-09-20 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US8237919B2 (en) * 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US8218129B2 (en) * 2007-08-24 2012-07-10 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
US8867022B2 (en) * 2007-08-24 2014-10-21 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
US8421994B2 (en) * 2007-09-27 2013-04-16 Nikon Corporation Exposure apparatus
JP4512627B2 (ja) * 2007-10-03 2010-07-28 キヤノン株式会社 測定装置、露光装置及びデバイス製造方法
US8279399B2 (en) * 2007-10-22 2012-10-02 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US9013681B2 (en) * 2007-11-06 2015-04-21 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
WO2009060585A1 (ja) * 2007-11-07 2009-05-14 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US9256140B2 (en) * 2007-11-07 2016-02-09 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction
US8665455B2 (en) * 2007-11-08 2014-03-04 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US8422015B2 (en) 2007-11-09 2013-04-16 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US8711327B2 (en) * 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8115906B2 (en) * 2007-12-14 2012-02-14 Nikon Corporation Movable body system, pattern formation apparatus, exposure apparatus and measurement device, and device manufacturing method
SG183057A1 (en) * 2007-12-17 2012-08-30 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
US8269945B2 (en) * 2007-12-28 2012-09-18 Nikon Corporation Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method
US8237916B2 (en) * 2007-12-28 2012-08-07 Nikon Corporation Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method
US8792079B2 (en) * 2007-12-28 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method having encoders to measure displacement between optical member and measurement mount and between measurement mount and movable body
JP5088588B2 (ja) * 2007-12-28 2012-12-05 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
JP5498659B2 (ja) * 2008-02-07 2014-05-21 株式会社半導体エネルギー研究所 レーザ照射位置安定性評価方法及びレーザ照射装置
JP5084558B2 (ja) * 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
NL1036557A1 (nl) * 2008-03-11 2009-09-14 Asml Netherlands Bv Method and lithographic apparatus for measuring and acquiring height data relating to a substrate surface.
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
TW200951640A (en) * 2008-04-30 2009-12-16 Nikon Corp Exposure apparatus, exposure method, and device manufacturing method
JP5071894B2 (ja) * 2008-04-30 2012-11-14 株式会社ニコン ステージ装置、パターン形成装置、露光装置、ステージ駆動方法、露光方法、並びにデバイス製造方法
US8817236B2 (en) * 2008-05-13 2014-08-26 Nikon Corporation Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method
US8786829B2 (en) * 2008-05-13 2014-07-22 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8228482B2 (en) * 2008-05-13 2012-07-24 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP2009302344A (ja) * 2008-06-13 2009-12-24 Canon Inc 露光装置及びデバイス製造方法
WO2010014609A2 (en) 2008-07-28 2010-02-04 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8715910B2 (en) * 2008-08-14 2014-05-06 Infineon Technologies Ag Method for exposing an area on a substrate to a beam and photolithographic system
US8435723B2 (en) * 2008-09-11 2013-05-07 Nikon Corporation Pattern forming method and device production method
US8325325B2 (en) * 2008-09-22 2012-12-04 Nikon Corporation Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method
US8508735B2 (en) * 2008-09-22 2013-08-13 Nikon Corporation Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method
US8994923B2 (en) * 2008-09-22 2015-03-31 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US20100283979A1 (en) * 2008-10-31 2010-11-11 Nikon Corporation Exposure apparatus, exposing method, and device fabricating method
JP2010114265A (ja) * 2008-11-06 2010-05-20 Canon Inc 走査露光装置およびその制御方法、ならびにデバイス製造方法
US8902402B2 (en) 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8773635B2 (en) * 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8599359B2 (en) 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
JP2010192470A (ja) * 2009-02-13 2010-09-02 Canon Inc 計測装置、露光装置及びデバイスの製造方法
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8675210B2 (en) 2009-03-13 2014-03-18 Asml Netherlands B.V. Level sensor, lithographic apparatus, and substrate surface positioning method
EP2228685B1 (en) * 2009-03-13 2018-06-27 ASML Netherlands B.V. Level sensor arrangement for lithographic apparatus and device manufacturing method
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8488107B2 (en) 2009-03-13 2013-07-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a level sensor having multiple projection units and detection units
WO2010125813A1 (ja) * 2009-04-30 2010-11-04 株式会社ニコン 露光方法及びデバイス製造方法、並びに重ね合わせ誤差計測方法
US8792084B2 (en) * 2009-05-20 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8553204B2 (en) 2009-05-20 2013-10-08 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
WO2011016254A1 (ja) * 2009-08-07 2011-02-10 株式会社ニコン 移動体装置、露光装置及び露光方法、並びにデバイス製造方法
US20110032495A1 (en) * 2009-08-07 2011-02-10 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US20110053092A1 (en) * 2009-08-20 2011-03-03 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US20110042874A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US8488109B2 (en) 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8514395B2 (en) 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8493547B2 (en) 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
US20110096318A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110096312A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110086315A1 (en) 2009-09-30 2011-04-14 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
NL2005424A (en) * 2009-10-30 2011-05-02 Asml Netherlands Bv Lithographic method and apparatus.
CN102597873B (zh) 2009-11-05 2014-12-17 株式会社尼康 焦点测试光罩、焦点测量方法、曝光装置、及曝光方法
US20110242520A1 (en) 2009-11-17 2011-10-06 Nikon Corporation Optical properties measurement method, exposure method and device manufacturing method
US20110128523A1 (en) 2009-11-19 2011-06-02 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110164238A1 (en) 2009-12-02 2011-07-07 Nikon Corporation Exposure apparatus and device fabricating method
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method
NL2005821A (en) * 2009-12-23 2011-06-27 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and method of applying a pattern to a substrate.
US8488106B2 (en) 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
WO2011102109A1 (ja) 2010-02-20 2011-08-25 株式会社ニコン 光源最適化方法、露光方法、デバイス製造方法、プログラム、露光装置、リソグラフィシステム、及び光源評価方法、並びに光源変調方法
NL2006131A (en) * 2010-03-12 2011-09-13 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5498243B2 (ja) * 2010-05-07 2014-05-21 キヤノン株式会社 露光装置、露光方法及びデバイス製造方法
CN102298278B (zh) * 2010-06-25 2013-08-14 上海微电子装备有限公司 一种调焦调平检测方法
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method
US8795953B2 (en) 2010-09-14 2014-08-05 Nikon Corporation Pattern forming method and method for producing device
AU2011357735B2 (en) 2011-02-01 2015-07-30 Roche Diagnostics Hematology, Inc. Fast auto-focus in microscopic imaging
US9041791B2 (en) 2011-02-01 2015-05-26 Roche Diagnostics Hematology, Inc. Fast auto-focus in imaging
WO2012128323A1 (ja) 2011-03-22 2012-09-27 株式会社ニコン 光学素子、照明装置、測定装置、フォトマスク、露光方法、及びデバイス製造方法
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
CN102736430B (zh) * 2011-04-07 2014-08-20 上海微电子装备有限公司 一种用于调焦调平系统的测量方法
US9213227B2 (en) * 2011-08-18 2015-12-15 Nikon Corporation Custom color or polarization sensitive CCD for separating multiple signals in autofocus projection system
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US9360772B2 (en) 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
CN103543610B (zh) * 2012-07-12 2015-09-30 上海微电子装备有限公司 一种调焦调平光斑位置校准方法
KR102311833B1 (ko) 2012-10-02 2021-10-12 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
KR101974796B1 (ko) 2012-10-19 2019-05-02 가부시키가이샤 니콘 패턴 형성 방법 및 디바이스 제조 방법
US9772564B2 (en) 2012-11-12 2017-09-26 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
CN109976103A (zh) 2012-11-20 2019-07-05 株式会社尼康 曝光装置、移动体装置以及器件制造方法
EP2950328A4 (en) 2012-11-30 2017-01-25 Nikon Corporation Suction apparatus, carry-in method, conveyance system, light exposure device, and device production method
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9092846B2 (en) 2013-02-01 2015-07-28 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
KR102014586B1 (ko) 2013-06-28 2019-08-26 가부시키가이샤 니콘 이동체 장치 및 노광 장치, 그리고 디바이스 제조 방법
EP3065165B1 (en) 2013-10-30 2022-12-07 Nikon Corporation Substrate-holding apparatus and exposure apparatus
JP6380412B2 (ja) 2014-01-16 2018-08-29 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
CN107615473B (zh) 2014-12-24 2021-04-20 株式会社尼康 移动体的控制方法、曝光方法、器件制造方法、移动体装置及曝光装置
JP6459082B2 (ja) 2014-12-24 2019-01-30 株式会社ニコン 計測装置及び計測方法、露光装置及び露光方法、並びにデバイス製造方法
EP4300194A3 (en) 2015-02-23 2024-04-10 Nikon Corporation Measurement device, lithography system and exposure apparatus, and control method, overlay measurement method and device manufacturing method
EP3680717A1 (en) 2015-02-23 2020-07-15 Nikon Corporation Substrate processing system and substrate processing method, and device manufacturing method
KR20230107706A (ko) * 2015-02-23 2023-07-17 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고디바이스 제조 방법
WO2016153031A1 (ja) 2015-03-25 2016-09-29 株式会社ニコン レイアウト方法、マーク検出方法、露光方法、計測装置、露光装置、並びにデバイス製造方法
KR101582144B1 (ko) * 2015-07-15 2016-01-04 주식회사 삼원알텍 금속의 아노다이징 자동화 처리시스템
CN106997151B (zh) * 2016-01-22 2019-05-31 上海微电子装备(集团)股份有限公司 光斑布局结构、面形测量方法及曝光视场控制值计算方法
WO2017144277A1 (en) * 2016-02-24 2017-08-31 Asml Netherlands B.V. Substrate handling system and lithographic apparatus
CN107450287B (zh) * 2016-05-31 2019-10-25 上海微电子装备(集团)股份有限公司 调焦调平测量装置及方法
EP3506012A4 (en) 2016-08-24 2020-04-15 Nikon Corporation MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD
JP7081490B2 (ja) 2016-09-27 2022-06-07 株式会社ニコン レイアウト情報提供方法、レイアウト情報、決定方法、プログラム、並びに情報記録媒体
CN113608413B (zh) 2016-09-30 2024-05-28 株式会社尼康 测量系统及基板处理系统、及元件制造方法
WO2018074306A1 (ja) 2016-10-17 2018-04-26 株式会社ニコン 露光システム及びリソグラフィシステム
KR102280532B1 (ko) * 2016-12-23 2021-07-22 에이에스엠엘 네델란즈 비.브이. 패턴 충실도 제어를 위한 방법 및 장치
CN110268334A (zh) * 2017-02-03 2019-09-20 Asml荷兰有限公司 曝光设备
JP7364323B2 (ja) * 2017-07-14 2023-10-18 エーエスエムエル ネザーランズ ビー.ブイ. 計測装置及び基板ステージ・ハンドラ・システム

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571025A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Providing fine gap
US4383757A (en) * 1979-04-02 1983-05-17 Optimetrix Corporation Optical focusing system
NL186353C (nl) * 1979-06-12 1990-11-01 Philips Nv Inrichting voor het afbeelden van een maskerpatroon op een substraat voorzien van een opto-elektronisch detektiestelsel voor het bepalen van een afwijking tussen het beeldvlak van een projektielenzenstelsel en het substraatvlak.
JPS58113706A (ja) * 1981-12-26 1983-07-06 Nippon Kogaku Kk <Nikon> 水平位置検出装置
US4650983A (en) * 1983-11-07 1987-03-17 Nippon Kogaku K. K. Focusing apparatus for projection optical system
US4860374A (en) * 1984-04-19 1989-08-22 Nikon Corporation Apparatus for detecting position of reference pattern
US4702606A (en) * 1984-06-01 1987-10-27 Nippon Kogaku K.K. Position detecting system
JPS61131441A (ja) * 1984-11-30 1986-06-19 Canon Inc アライメント装置及び方法
US4769523A (en) * 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
US4749867A (en) * 1985-04-30 1988-06-07 Canon Kabushiki Kaisha Exposure apparatus
US4861162A (en) * 1985-05-16 1989-08-29 Canon Kabushiki Kaisha Alignment of an object
JPH0727857B2 (ja) * 1985-09-09 1995-03-29 株式会社ニコン 投影光学装置
US5162642A (en) * 1985-11-18 1992-11-10 Canon Kabushiki Kaisha Device for detecting the position of a surface
JPS62293633A (ja) * 1986-06-12 1987-12-21 Matsushita Electric Ind Co Ltd プロ−バ−のアライメント方法
JP2506616B2 (ja) * 1986-07-02 1996-06-12 キヤノン株式会社 露光装置及びそれを用いた回路の製造方法
JPH0789534B2 (ja) * 1986-07-04 1995-09-27 キヤノン株式会社 露光方法
US4747678A (en) * 1986-12-17 1988-05-31 The Perkin-Elmer Corporation Optical relay system with magnification
US4845530A (en) * 1986-12-26 1989-07-04 Kabushiki Kaisha Toshiba Reduced projection type step- and repeat-exposure apparatus
US4874954A (en) * 1987-02-02 1989-10-17 Canon Kabushiki Kaisha Projection exposure apparatus
JPS63307729A (ja) * 1987-06-09 1988-12-15 Tokyo Electron Ltd 半導体ウエハの露光方法
US4902900A (en) * 1987-12-21 1990-02-20 Nikon Corporation Device for detecting the levelling of the surface of an object
US5117254A (en) * 1988-05-13 1992-05-26 Canon Kabushiki Kaisha Projection exposure apparatus
JPH0228312A (ja) * 1988-07-18 1990-01-30 Nikon Corp 露光装置
JP2773147B2 (ja) * 1988-08-19 1998-07-09 株式会社ニコン 露光装置の位置合わせ装置及び方法
US4924257A (en) * 1988-10-05 1990-05-08 Kantilal Jain Scan and repeat high resolution projection lithography system
JPH0652707B2 (ja) * 1988-10-11 1994-07-06 キヤノン株式会社 面位置検出方法
US5189494A (en) * 1988-11-07 1993-02-23 Masato Muraki Position detecting method and apparatus
JPH02292813A (ja) * 1989-05-02 1990-12-04 Canon Inc 自動焦点合せ装置
JPH03198320A (ja) * 1989-12-27 1991-08-29 Nikon Corp 投影光学装置
JP2785146B2 (ja) * 1990-02-09 1998-08-13 キヤノン株式会社 自動焦点調整制御装置
JP2705312B2 (ja) * 1990-12-06 1998-01-28 ソニー株式会社 投影露光方法
US5241188A (en) * 1991-02-01 1993-08-31 Nikon Corporation Apparatus for detecting a focussing position
JP2830492B2 (ja) * 1991-03-06 1998-12-02 株式会社ニコン 投影露光装置及び投影露光方法
NL9100410A (nl) * 1991-03-07 1992-10-01 Asm Lithography Bv Afbeeldingsapparaat voorzien van een focusfout- en/of scheefstandsdetectie-inrichting.
US5506684A (en) 1991-04-04 1996-04-09 Nikon Corporation Projection scanning exposure apparatus with synchronous mask/wafer alignment system
US5243195A (en) * 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
US5298761A (en) * 1991-06-17 1994-03-29 Nikon Corporation Method and apparatus for exposure process
US5227839A (en) * 1991-06-24 1993-07-13 Etec Systems, Inc. Small field scanner
JPH0682605B2 (ja) * 1991-11-08 1994-10-19 キヤノン株式会社 露光方法及び素子製造方法
JPH05217845A (ja) * 1992-01-31 1993-08-27 Oki Electric Ind Co Ltd アライメント測定用パターン
US5281996A (en) * 1992-09-04 1994-01-25 General Signal Corporation Photolithographic reduction imaging of extended field
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3412704B2 (ja) * 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
TW335466B (en) * 1995-02-28 1998-07-01 Hitachi Ltd Data processor and shade processor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328004B1 (ko) * 1993-04-06 2002-03-09 시마무라 테루오 주사노광방법, 주사형 노광장치 및 소자제조방법
KR100449056B1 (ko) * 1995-10-19 2004-12-03 가부시키가이샤 니콘 주사형투영노광장치

Also Published As

Publication number Publication date
US20020176082A1 (en) 2002-11-28
KR100300618B1 (ko) 2001-11-22
KR100311427B1 (ko) 2001-11-02
KR100325184B1 (ko) 2002-03-25
KR100306310B1 (ko) 2001-09-24
KR100313732B1 (ko) 2001-11-29
US5448332A (en) 1995-09-05
KR100307049B1 (ko) 2001-09-24
KR100300627B1 (ko) 2001-09-22
KR100325182B1 (ko) 2002-03-25
US6608681B2 (en) 2003-08-19
KR100325193B1 (ko) 2002-03-13
US5693439A (en) 1997-12-02
KR100306311B1 (ko) 2001-09-24
US6433872B1 (en) 2002-08-13

Similar Documents

Publication Publication Date Title
KR940015697A (ko) 노광방법 및 그 장치
KR100365602B1 (ko) 노광방법및장치와반도체디바이스제조방법
JP3255312B2 (ja) 投影露光装置
JP3309927B2 (ja) 露光方法、走査型露光装置、及びデバイス製造方法
KR950012572A (ko) 노광 방법
KR950014931A (ko) 스캐닝형 노출 장치 및 노출 방법
JP3880155B2 (ja) 位置決め方法及び位置決め装置
US6433352B1 (en) Method of positioning semiconductor wafer
JP2506616B2 (ja) 露光装置及びそれを用いた回路の製造方法
JPH07142331A (ja) 投影露光装置
JPH09223650A (ja) 露光装置
JP2003086492A (ja) 露光装置及びその制御方法並びにデバイスの製造方法
JP3387074B2 (ja) 走査露光方法、及び走査型露光装置
JP3460131B2 (ja) 投影露光装置
JP3255299B2 (ja) 位置検出方法及び装置、並びに露光方法及び装置
JP3754743B2 (ja) 表面位置設定方法、ウエハ高さ設定方法、面位置設定方法、ウエハ面位置検出方法および露光装置
JPH05190423A (ja) 投影露光装置
JP3376219B2 (ja) 面位置検出装置および方法
JPH11168050A (ja) 露光方法及び装置
JP2001313241A (ja) 露光装置および露光方法
KR950020975A (ko) 스캐닝 노출방법
JP3230675B2 (ja) 走査露光方法、走査型露光装置、及び前記方法を用いるデバイス製造方法
JPH1041215A (ja) 走査型露光装置
JPH10270303A (ja) 走査型露光装置及び走査型露光方法
JPH0478126A (ja) 自動焦点検出装置

Legal Events

Date Code Title Description
A201 Request for examination
A107 Divisional application of patent
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]
FPAY Annual fee payment

Payment date: 20120611

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20130531

Year of fee payment: 13

EXPY Expiration of term