JPS5571025A - Providing fine gap - Google Patents

Providing fine gap

Info

Publication number
JPS5571025A
JPS5571025A JP14421378A JP14421378A JPS5571025A JP S5571025 A JPS5571025 A JP S5571025A JP 14421378 A JP14421378 A JP 14421378A JP 14421378 A JP14421378 A JP 14421378A JP S5571025 A JPS5571025 A JP S5571025A
Authority
JP
Japan
Prior art keywords
wafer
gage
mask
movement
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14421378A
Other languages
Japanese (ja)
Inventor
Masaki Tsukagoshi
Kiyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14421378A priority Critical patent/JPS5571025A/en
Publication of JPS5571025A publication Critical patent/JPS5571025A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To obtain amount of movement to provide a gap between a mask and wafer, by specifying a standard amount of movement with respect to the mask of a wafer table by using a gage, and measuring the thickness of a wafer on the table as the difference in thicknesses of the gage.
CONSTITUTION: A gage 12 whose size is approximately the same as a wafer of interest is placed on a wafer table which is arranged at a position A. A value X0 is obtained by measuring with a contactless measuring device. A unit 5 is lifted so that the upper surface of a gage 12 is contacted with the lower surface of a mask 10. The distance of the movement of the gage is calculated to be Z0 with an electric microswitch. The gage is relaced by a wafer 13, and it is measured with a measuring device 8, and a value X is obtained. The difference ΔX between the wafer and the gage is obtained by X-X0. The unit is moved to a position B, and a gap G is provided between the upper surface of the wafer and the lower surfce of the mask. The amount of the movement of the wafer Z can be obtained by Z0-G-ΔX.
COPYRIGHT: (C)1980,JPO&Japio
JP14421378A 1978-11-24 1978-11-24 Providing fine gap Pending JPS5571025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14421378A JPS5571025A (en) 1978-11-24 1978-11-24 Providing fine gap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14421378A JPS5571025A (en) 1978-11-24 1978-11-24 Providing fine gap

Publications (1)

Publication Number Publication Date
JPS5571025A true JPS5571025A (en) 1980-05-28

Family

ID=15356857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14421378A Pending JPS5571025A (en) 1978-11-24 1978-11-24 Providing fine gap

Country Status (1)

Country Link
JP (1) JPS5571025A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4397078A (en) * 1980-08-11 1983-08-09 Telmec Co., Ltd. Method and apparatus for measuring a gap distance between a mask and a wafer to be used in fabrication of semiconductor integrated circuits
US5174201A (en) * 1991-06-07 1992-12-29 International Business Machines Corporation Thick film mask separation detection system
US5693439A (en) * 1992-12-25 1997-12-02 Nikon Corporation Exposure method and apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50152670A (en) * 1974-05-28 1975-12-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50152670A (en) * 1974-05-28 1975-12-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4397078A (en) * 1980-08-11 1983-08-09 Telmec Co., Ltd. Method and apparatus for measuring a gap distance between a mask and a wafer to be used in fabrication of semiconductor integrated circuits
US5174201A (en) * 1991-06-07 1992-12-29 International Business Machines Corporation Thick film mask separation detection system
US5693439A (en) * 1992-12-25 1997-12-02 Nikon Corporation Exposure method and apparatus
US6433872B1 (en) 1992-12-25 2002-08-13 Nikon Corporation Exposure method and apparatus
US6608681B2 (en) 1992-12-25 2003-08-19 Nikon Corporation Exposure method and apparatus

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