KR100806823B1 - 리소그래피 장치 및 디바이스 제조방법 - Google Patents

리소그래피 장치 및 디바이스 제조방법 Download PDF

Info

Publication number
KR100806823B1
KR100806823B1 KR1020050076451A KR20050076451A KR100806823B1 KR 100806823 B1 KR100806823 B1 KR 100806823B1 KR 1020050076451 A KR1020050076451 A KR 1020050076451A KR 20050076451 A KR20050076451 A KR 20050076451A KR 100806823 B1 KR100806823 B1 KR 100806823B1
Authority
KR
South Korea
Prior art keywords
liquid
substrate
gas
recess
volume
Prior art date
Application number
KR1020050076451A
Other languages
English (en)
Korean (ko)
Other versions
KR20060053182A (ko
Inventor
니콜라스 루돌프 켐퍼
헨리쿠스 헤어만 마리에 콕스
쇼에르트 니콜라스 람베르투스 돈더스
그라프 로엘로프 프레데릭 데
크리스티안 알렉산더 후겐담
카테 니콜라스 텐
예뢴 요한네스 소피아 마리아 메르텐스
데르 모일렌 프리츠 반
프란시스쿠스 요한네스 헤어만 마리아 토이니센
데르 투른 얀-게라르트 코르넬리스 반
마르티누스 코르넬리스 마리아 베어하겐
슈테판 필립 크리스티안 벨프로이트
요한네스 페트루스 마리아 슈모일러스
헤어만 포겔
Original Assignee
에이에스엠엘 네델란즈 비.브이.
에이에스엠엘 홀딩 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이에스엠엘 네델란즈 비.브이., 에이에스엠엘 홀딩 엔.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20060053182A publication Critical patent/KR20060053182A/ko
Application granted granted Critical
Publication of KR100806823B1 publication Critical patent/KR100806823B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
KR1020050076451A 2004-08-19 2005-08-19 리소그래피 장치 및 디바이스 제조방법 KR100806823B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/921,348 US7701550B2 (en) 2004-08-19 2004-08-19 Lithographic apparatus and device manufacturing method
US10/921,348 2004-08-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020070062952A Division KR100830141B1 (ko) 2004-08-19 2007-06-26 리소그래피 장치

Publications (2)

Publication Number Publication Date
KR20060053182A KR20060053182A (ko) 2006-05-19
KR100806823B1 true KR100806823B1 (ko) 2008-02-22

Family

ID=35432522

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020050076451A KR100806823B1 (ko) 2004-08-19 2005-08-19 리소그래피 장치 및 디바이스 제조방법
KR1020070062952A KR100830141B1 (ko) 2004-08-19 2007-06-26 리소그래피 장치
KR1020070114244A KR100806282B1 (ko) 2004-08-19 2007-11-09 리소그래피 장치 및 디바이스 제조방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020070062952A KR100830141B1 (ko) 2004-08-19 2007-06-26 리소그래피 장치
KR1020070114244A KR100806282B1 (ko) 2004-08-19 2007-11-09 리소그래피 장치 및 디바이스 제조방법

Country Status (8)

Country Link
US (13) US7701550B2 (fr)
EP (4) EP1628163B1 (fr)
JP (12) JP4456044B2 (fr)
KR (3) KR100806823B1 (fr)
CN (1) CN100526987C (fr)
DE (1) DE602005020720D1 (fr)
SG (3) SG120267A1 (fr)
TW (1) TWI308674B (fr)

Families Citing this family (243)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) * 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
JP3977324B2 (ja) 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
SG2012087615A (en) 2003-02-26 2015-08-28 Nippon Kogaku Kk Exposure apparatus, exposure method, and method for producing device
KR101369016B1 (ko) * 2003-04-10 2014-02-28 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
CN101813892B (zh) * 2003-04-10 2013-09-25 株式会社尼康 沉浸式光刻装置及使用光刻工艺制造微器件的方法
TWI442694B (zh) * 2003-05-30 2014-06-21 Asml Netherlands Bv 微影裝置及元件製造方法
WO2005006418A1 (fr) * 2003-07-09 2005-01-20 Nikon Corporation Dispositif d'exposition et procede de fabrication
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
KR20170070264A (ko) * 2003-09-03 2017-06-21 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
KR101748504B1 (ko) * 2004-01-05 2017-06-16 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR101554772B1 (ko) 2004-02-04 2015-09-22 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR101441777B1 (ko) * 2004-03-25 2014-09-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2490248A3 (fr) * 2004-04-19 2018-01-03 Nikon Corporation Appareil d'exposition et procédé de fabrication du dispositif
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US20070103661A1 (en) * 2004-06-04 2007-05-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20070216889A1 (en) * 2004-06-04 2007-09-20 Yasufumi Nishii Exposure Apparatus, Exposure Method, and Method for Producing Device
US8508713B2 (en) * 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR101505756B1 (ko) * 2004-06-10 2015-03-26 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
US8717533B2 (en) * 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20070139628A1 (en) * 2004-06-10 2007-06-21 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20070222959A1 (en) * 2004-06-10 2007-09-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
SG10201607447RA (en) 2004-06-10 2016-10-28 Nikon Corp Exposure equipment, exposure method and device manufacturing method
US7481867B2 (en) * 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522261B2 (en) * 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7362412B2 (en) * 2004-11-18 2008-04-22 International Business Machines Corporation Method and apparatus for cleaning a semiconductor substrate in an immersion lithography system
US7119035B2 (en) * 2004-11-22 2006-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method using specific contact angle for immersion lithography
US7397533B2 (en) * 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1681597B1 (fr) * 2005-01-14 2010-03-10 ASML Netherlands B.V. Appareil lithographique et procédé de fabrication d'un dispositif
KR20160135859A (ko) 2005-01-31 2016-11-28 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8692973B2 (en) * 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4262252B2 (ja) * 2005-03-02 2009-05-13 キヤノン株式会社 露光装置
TW200644079A (en) * 2005-03-31 2006-12-16 Nikon Corp Exposure apparatus, exposure method, and device production method
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1873816A4 (fr) 2005-04-18 2010-11-24 Nikon Corp Dispositif d'exposition, méthode d'exposition et méthode pour la fabrication du dispositif
US7433016B2 (en) * 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) * 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7751026B2 (en) 2005-08-25 2010-07-06 Nikon Corporation Apparatus and method for recovering fluid for immersion lithography
JP4125315B2 (ja) * 2005-10-11 2008-07-30 キヤノン株式会社 露光装置及びデバイス製造方法
WO2007055373A1 (fr) * 2005-11-14 2007-05-18 Nikon Corporation Élément de récupération de liquide, appareil d'exposition, procédé d'exposition et procédé de production de dispositif
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7446859B2 (en) * 2006-01-27 2008-11-04 International Business Machines Corporation Apparatus and method for reducing contamination in immersion lithography
US8027019B2 (en) * 2006-03-28 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7903232B2 (en) * 2006-04-12 2011-03-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477158B2 (en) * 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7701551B2 (en) 2006-04-14 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5151977B2 (ja) 2006-05-10 2013-02-27 株式会社ニコン 露光装置及びデバイス製造方法
CN102298274A (zh) * 2006-05-18 2011-12-28 株式会社尼康 曝光方法及装置、维护方法、以及组件制造方法
US8144305B2 (en) 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20090023335A (ko) * 2006-05-22 2009-03-04 가부시키가이샤 니콘 노광 방법 및 장치, 메인터넌스 방법, 그리고 디바이스 제조 방법
US20070273856A1 (en) * 2006-05-25 2007-11-29 Nikon Corporation Apparatus and methods for inhibiting immersion liquid from flowing below a substrate
US7532309B2 (en) * 2006-06-06 2009-05-12 Nikon Corporation Immersion lithography system and method having an immersion fluid containment plate for submerging the substrate to be imaged in immersion fluid
US7656502B2 (en) * 2006-06-22 2010-02-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100827507B1 (ko) * 2006-06-22 2008-05-06 주식회사 하이닉스반도체 이머젼 리소그래피 장치
WO2008001871A1 (fr) * 2006-06-30 2008-01-03 Nikon Corporation Procédé de maintenance, procédé d'exposition et procédé de fabrication d'appareil et de dispositif
US20080043211A1 (en) * 2006-08-21 2008-02-21 Nikon Corporation Apparatus and methods for recovering fluid in immersion lithography
TWI596444B (zh) * 2006-08-31 2017-08-21 尼康股份有限公司 Exposure method and device, and device manufacturing method
US7826030B2 (en) * 2006-09-07 2010-11-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8330936B2 (en) * 2006-09-20 2012-12-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080100812A1 (en) * 2006-10-26 2008-05-01 Nikon Corporation Immersion lithography system and method having a wafer chuck made of a porous material
JP5029870B2 (ja) * 2006-11-13 2012-09-19 株式会社ニコン 露光方法及び装置、液浸部材、露光装置のメンテナンス方法、並びにデバイス製造方法
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US8634053B2 (en) * 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US8004651B2 (en) 2007-01-23 2011-08-23 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
KR100843709B1 (ko) * 2007-02-05 2008-07-04 삼성전자주식회사 액체 실링 유니트 및 이를 갖는 이멀젼 포토리소그래피장치
US20080212050A1 (en) * 2007-02-06 2008-09-04 Nikon Corporation Apparatus and methods for removing immersion liquid from substrates using temperature gradient
US20080198348A1 (en) * 2007-02-20 2008-08-21 Nikon Corporation Apparatus and methods for minimizing force variation from immersion liquid in lithography systems
US8068209B2 (en) * 2007-03-23 2011-11-29 Nikon Corporation Nozzle to help reduce the escape of immersion liquid from an immersion lithography tool
US8134685B2 (en) * 2007-03-23 2012-03-13 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US20080231823A1 (en) * 2007-03-23 2008-09-25 Nikon Corporation Apparatus and methods for reducing the escape of immersion liquid from immersion lithography apparatus
KR101373013B1 (ko) 2007-05-14 2014-03-14 삼성전자주식회사 방송 서비스로의 효율적인 액세스를 위한 방송 전송 장치및 방법 및 방송 서비스 수신 장치 및 방법
US20090122282A1 (en) * 2007-05-21 2009-05-14 Nikon Corporation Exposure apparatus, liquid immersion system, exposing method, and device fabricating method
US8514365B2 (en) * 2007-06-01 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8141566B2 (en) * 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US7576833B2 (en) * 2007-06-28 2009-08-18 Nikon Corporation Gas curtain type immersion lithography tool using porous material for fluid removal
US7916269B2 (en) 2007-07-24 2011-03-29 Asml Netherlands B.V. Lithographic apparatus and contamination removal or prevention method
US20090025753A1 (en) * 2007-07-24 2009-01-29 Asml Netherlands B.V. Lithographic Apparatus And Contamination Removal Or Prevention Method
NL1035757A1 (nl) * 2007-08-02 2009-02-03 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP4961299B2 (ja) * 2007-08-08 2012-06-27 キヤノン株式会社 露光装置およびデバイス製造方法
US7924404B2 (en) * 2007-08-16 2011-04-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8681308B2 (en) * 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL1035908A1 (nl) 2007-09-25 2009-03-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
SG151198A1 (en) * 2007-09-27 2009-04-30 Asml Netherlands Bv Methods relating to immersion lithography and an immersion lithographic apparatus
NL1036009A1 (nl) * 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
NL1036069A1 (nl) * 2007-10-30 2009-05-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
JP5017232B2 (ja) * 2007-10-31 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． クリーニング装置および液浸リソグラフィ装置
NL1036187A1 (nl) 2007-12-03 2009-06-04 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL1036211A1 (nl) * 2007-12-03 2009-06-04 Asml Netherlands Bv Lithographic Apparatus and Device Manufacturing Method.
NL1036253A1 (nl) * 2007-12-10 2009-06-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL1036273A1 (nl) * 2007-12-18 2009-06-19 Asml Netherlands Bv Lithographic apparatus and method of cleaning a surface of an immersion lithographic apparatus.
NL1036306A1 (nl) 2007-12-20 2009-06-23 Asml Netherlands Bv Lithographic apparatus and in-line cleaning apparatus.
US8339572B2 (en) 2008-01-25 2012-12-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5369443B2 (ja) 2008-02-05 2013-12-18 株式会社ニコン ステージ装置、露光装置、露光方法、及びデバイス製造方法
JP4922322B2 (ja) * 2008-02-14 2012-04-25 エーエスエムエル ネザーランズ ビー．ブイ． コーティング
NL1036579A1 (nl) * 2008-02-19 2009-08-20 Asml Netherlands Bv Lithographic apparatus and methods.
NL1036596A1 (nl) 2008-02-21 2009-08-24 Asml Holding Nv Re-flow and buffer system for immersion lithography.
US8289497B2 (en) * 2008-03-18 2012-10-16 Nikon Corporation Apparatus and methods for recovering fluid in immersion lithography
NL1036631A1 (nl) 2008-03-24 2009-09-25 Asml Netherlands Bv Immersion Lithographic Apparatus and Device Manufacturing Method.
US8233139B2 (en) * 2008-03-27 2012-07-31 Nikon Corporation Immersion system, exposure apparatus, exposing method, and device fabricating method
NL1036715A1 (nl) 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
NL1036709A1 (nl) 2008-04-24 2009-10-27 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
NL1036766A1 (nl) * 2008-04-25 2009-10-27 Asml Netherlands Bv Methods relating to immersion lithography and an immersion lithographic apparatus.
NL1036835A1 (nl) * 2008-05-08 2009-11-11 Asml Netherlands Bv Lithographic Apparatus and Method.
EP2131241B1 (fr) 2008-05-08 2019-07-31 ASML Netherlands B.V. Structure de manipulation de fluide, appareil lithographique et procédé de fabrication du dispositif
US8421993B2 (en) * 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
EP2249205B1 (fr) 2008-05-08 2012-03-07 ASML Netherlands BV Appareil lithographique à immersion, dispositif de séchage, appareil de métrologie à immersion et procédé de fabrication d'un dispositif
JP5097166B2 (ja) 2008-05-28 2012-12-12 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置の動作方法
EP2131242A1 (fr) * 2008-06-02 2009-12-09 ASML Netherlands B.V. Table de substrat, appareil lithographique et procédé de fabrication d'un dispositif
NL1036924A1 (nl) * 2008-06-02 2009-12-03 Asml Netherlands Bv Substrate table, lithographic apparatus and device manufacturing method.
NL2002964A1 (nl) * 2008-06-16 2009-12-17 Asml Netherlands Bv Lithographic Apparatus, a Metrology Apparatus and a Method of Using the Apparatus.
EP2136250A1 (fr) * 2008-06-18 2009-12-23 ASML Netherlands B.V. Appareil et procédé lithographique
NL2002983A1 (nl) * 2008-06-26 2009-12-29 Asml Netherlands Bv A lithographic apparatus and a method of operating the lithographic apparatus.
JP4922359B2 (ja) * 2008-07-25 2012-04-25 エーエスエムエル ネザーランズ ビー．ブイ． 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
TW201009895A (en) * 2008-08-11 2010-03-01 Nikon Corp Exposure apparatus, maintaining method and device fabricating method
NL2003226A (en) * 2008-08-19 2010-03-09 Asml Netherlands Bv Lithographic apparatus, drying device, metrology apparatus and device manufacturing method.
NL2003392A (en) 2008-09-17 2010-03-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
JP2010098172A (ja) * 2008-10-17 2010-04-30 Canon Inc 液体回収装置、露光装置及びデバイス製造方法
NL2003421A (en) * 2008-10-21 2010-04-22 Asml Netherlands Bv Lithographic apparatus and a method of removing contamination.
US8477284B2 (en) * 2008-10-22 2013-07-02 Nikon Corporation Apparatus and method to control vacuum at porous material using multiple porous materials
US8634055B2 (en) * 2008-10-22 2014-01-21 Nikon Corporation Apparatus and method to control vacuum at porous material using multiple porous materials
NL2003333A (en) * 2008-10-23 2010-04-26 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2003575A (en) 2008-10-29 2010-05-03 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2003638A (en) 2008-12-03 2010-06-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US20100328637A1 (en) * 2008-12-04 2010-12-30 Nikon Corporation Exposure apparatus, exposing method and device fabricating method
NL2003758A (en) * 2008-12-04 2010-06-07 Asml Netherlands Bv A member with a cleaning surface and a method of removing contamination.
TWI438577B (zh) 2008-12-08 2014-05-21 Asml Netherlands Bv 微影裝置及器件製造方法
EP2196857A3 (fr) 2008-12-09 2010-07-21 ASML Netherlands BV Appareil lithographique et procédé de fabrication de dispositif
JP5001343B2 (ja) * 2008-12-11 2012-08-15 エーエスエムエル ネザーランズ ビー．ブイ． 流体抽出システム、液浸リソグラフィ装置、及び液浸リソグラフィ装置で使用される液浸液の圧力変動を低減する方法
JP2010147471A (ja) * 2008-12-18 2010-07-01 Asml Netherlands Bv リソグラフィ装置及び少なくとも２つのターゲット部分を照射する方法
NL2003820A (en) * 2008-12-22 2010-06-23 Asml Netherlands Bv Fluid handling structure, table, lithographic apparatus, immersion lithographic apparatus, and device manufacturing methods.
US8896806B2 (en) 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
NL2004162A (en) * 2009-02-17 2010-08-18 Asml Netherlands Bv A fluid supply system, a lithographic apparatus, a method of varying fluid flow rate and a device manufacturing method.
EP2221669A3 (fr) 2009-02-19 2011-02-09 ASML Netherlands B.V. Appareil lithographique, procédé de commande de l'appareil et procédé de fabrication d'un dispositif
NL2004305A (en) 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
JP2010251745A (ja) * 2009-04-10 2010-11-04 Asml Netherlands Bv 液浸リソグラフィ装置及びデバイス製造方法
NL2004362A (en) * 2009-04-10 2010-10-12 Asml Netherlands Bv A fluid handling device, an immersion lithographic apparatus and a device manufacturing method.
NL2004497A (en) 2009-05-01 2010-11-02 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
NL2004523A (en) * 2009-05-08 2010-11-09 Asml Netherlands Bv Immersion lithographic apparatus and device manufacturing method.
NL2004547A (en) * 2009-05-14 2010-11-18 Asml Netherlands Bv An immersion lithographic apparatus and a device manufacturing method.
NL2004540A (en) * 2009-05-14 2010-11-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
EP2256553B1 (fr) * 2009-05-26 2016-05-25 ASML Netherlands B.V. Structure de manipulation de fluide et appareil lithographique
EP2264529A3 (fr) 2009-06-16 2011-02-09 ASML Netherlands B.V. Appareil lithographique, procédé de commande de l'appareil et procédé de fabrication d'un dispositif utilisant un appareil lithographique
EP2264528A1 (fr) 2009-06-19 2010-12-22 ASML Netherlands B.V. Capteur et appareil lithographique
JP5058305B2 (ja) 2009-06-19 2012-10-24 エーエスエムエル ネザーランズ ビー．ブイ． 液浸リソグラフィ装置、液体閉じ込め構造体、液浸リソグラフィ装置用の投影システムの最終エレメント、および基板テーブル
NL2004808A (en) * 2009-06-30 2011-01-12 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2004820A (en) * 2009-06-30 2011-01-04 Asml Netherlands Bv Lithographic apparatus and a method of measuring flow rate in a two phase flow.
NL2004980A (en) * 2009-07-13 2011-01-17 Asml Netherlands Bv Heat transfers assembly, lithographic apparatus and manufacturing method.
NL2005009A (en) * 2009-07-27 2011-01-31 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5507392B2 (ja) 2009-09-11 2014-05-28 エーエスエムエル ネザーランズ ビー．ブイ． シャッター部材、リソグラフィ装置及びデバイス製造方法
NL2005126A (en) * 2009-09-21 2011-03-22 Asml Netherlands Bv Lithographic apparatus, coverplate and device manufacturing method.
NL2005120A (en) * 2009-09-21 2011-03-22 Asml Netherlands Bv Lithographic apparatus, coverplate and device manufacturing method.
NL2005089A (nl) * 2009-09-23 2011-03-28 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2005208A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
NL2005207A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
NL2005167A (en) * 2009-10-02 2011-04-05 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
NL2005478A (en) * 2009-11-17 2011-05-18 Asml Netherlands Bv Lithographic apparatus, removable member and device manufacturing method.
NL2005479A (en) * 2009-11-17 2011-05-18 Asml Netherlands Bv Lithographic apparatus, removable member and device manufacturing method.
NL2005610A (en) 2009-12-02 2011-06-06 Asml Netherlands Bv Lithographic apparatus and surface cleaning method.
NL2005657A (en) * 2009-12-03 2011-06-06 Asml Netherlands Bv A lithographic apparatus and a method of forming a lyophobic coating on a surface.
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method
NL2005655A (en) 2009-12-09 2011-06-14 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2005717A (en) * 2009-12-18 2011-06-21 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2005666A (en) * 2009-12-18 2011-06-21 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2005874A (en) 2010-01-22 2011-07-25 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2005951A (en) * 2010-02-02 2011-08-03 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006054A (en) 2010-02-09 2011-08-10 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2005974A (en) * 2010-02-12 2011-08-15 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006127A (en) * 2010-02-17 2011-08-18 Asml Netherlands Bv A substrate table, a lithographic apparatus and a method for manufacturing a device using a lithographic apparatus.
NL2006076A (en) * 2010-03-04 2011-09-06 Asml Netherlands Bv A lithographic apparatus and a method of manufacturing a device using a lithographic apparatus.
WO2011109760A2 (fr) * 2010-03-05 2011-09-09 TeraDiode, Inc. Système et procédé de combinaison de faisceaux de longueurs d'ondes
US20110222031A1 (en) * 2010-03-12 2011-09-15 Nikon Corporation Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
JP5269128B2 (ja) 2010-03-12 2013-08-21 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置および方法
NL2006243A (en) * 2010-03-19 2011-09-20 Asml Netherlands Bv A lithographic apparatus, an illumination system, a projection system and a method of manufacturing a device using a lithographic apparatus.
NL2006389A (en) 2010-04-15 2011-10-18 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and a device manufacturing method.
EP2381310B1 (fr) 2010-04-22 2015-05-06 ASML Netherlands BV Structure de manipulation de fluide et appareil lithographique
NL2006272A (en) 2010-05-04 2011-11-07 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2006648A (en) 2010-06-01 2011-12-06 Asml Netherlands Bv A fluid supply system, a lithographic apparatus, a method of varying fluid flow rate and a device manufacturing method.
NL2006818A (en) 2010-07-02 2012-01-03 Asml Netherlands Bv A method of adjusting speed and/or routing of a table movement plan and a lithographic apparatus.
US20120013863A1 (en) * 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120013864A1 (en) * 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US8937703B2 (en) * 2010-07-14 2015-01-20 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120012191A1 (en) * 2010-07-16 2012-01-19 Nikon Corporation Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
EP2423749B1 (fr) 2010-08-24 2013-09-11 ASML Netherlands BV Appareil lithographique et procédé de fabrication d'un dispositif
NL2007453A (en) 2010-10-18 2012-04-19 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2007477A (en) 2010-10-22 2012-04-24 Asml Netherlands Bv Method of optimizing a lithographic process, device manufacturing method, lithographic apparatus, computer program product and simulation apparatus.
NL2007633A (en) 2010-11-22 2012-05-23 Asml Netherlands Bv A positioning system, a lithographic apparatus and a method for positional control.
NL2007768A (en) 2010-12-14 2012-06-18 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP2490073B1 (fr) 2011-02-18 2015-09-23 ASML Netherlands BV Porte-substrat, appareil lithographique et procédé de fabrication d'un porte-substrat
NL2008183A (en) 2011-02-25 2012-08-28 Asml Netherlands Bv A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method.
NL2008199A (en) * 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008250A (en) * 2011-03-08 2012-09-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2008272A (en) * 2011-03-09 2012-09-11 Asml Netherlands Bv Lithographic apparatus.
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2008979A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008980A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009139A (en) 2011-08-05 2013-02-06 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
JP5778093B2 (ja) 2011-08-10 2015-09-16 エーエスエムエル ネザーランズ ビー．ブイ． 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
SG188036A1 (en) 2011-08-18 2013-03-28 Asml Netherlands Bv Lithographic apparatus, support table for a lithographic apparatus and device manufacturing method
US9256137B2 (en) * 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US20130050666A1 (en) * 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
NL2009272A (en) 2011-08-31 2013-03-04 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009271A (en) 2011-09-15 2013-03-18 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009487A (en) 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2009472A (en) * 2011-10-24 2013-04-25 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009692A (en) 2011-12-07 2013-06-10 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2009899A (en) 2011-12-20 2013-06-24 Asml Netherlands Bv A pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN109298602B (zh) 2012-02-03 2021-10-15 Asml荷兰有限公司 衬底保持器和光刻装置
CN102621818B (zh) * 2012-04-10 2013-12-04 中国科学院光电技术研究所 一种用于光刻机的浸没控制装置
US20150124234A1 (en) 2012-04-19 2015-05-07 Asml Netherlands B.V. Substrate holder, lithographic apparatus, and device manufacturing method
US9891541B2 (en) 2012-05-17 2018-02-13 Asml Netherlands B.V. Thermal conditioning unit, lithographic apparatus and device manufacturing method
CN104321702B (zh) 2012-05-22 2016-11-23 Asml荷兰有限公司 传感器、光刻设备以及器件制造方法
EP2856262B1 (fr) 2012-05-29 2019-09-25 ASML Netherlands B.V. Procédé de fabrication de dispositif, appareil lithographique et appareil de support
NL2010762A (en) 2012-05-29 2013-12-02 Asml Netherlands Bv An object holder, a lithographic apparatus and a device manufacturing method.
CN102707580B (zh) * 2012-05-30 2014-01-29 浙江大学 用于浸没式光刻机的气密封和气液分离回收装置
WO2013186136A2 (fr) 2012-06-11 2013-12-19 Asml Netherlands B.V. Appareil lithographique et procédé de fabrication de dispositif
WO2014029603A1 (fr) 2012-08-20 2014-02-27 Asml Netherlands B.V. Procédé de préparation d'un motif, procédé de formation d'un ensemble de masques, procédé de fabrication de dispositif et programme informatique
JP6074058B2 (ja) 2012-12-20 2017-02-01 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびその装置で使用するためのテーブル
CN103176368B (zh) * 2013-03-06 2014-12-10 浙江大学 用于浸没式光刻机的气密封和气液减振回收装置
NL2010527A (en) 2013-03-27 2014-09-30 Asml Netherlands Bv Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder.
WO2015028202A1 (fr) 2013-08-30 2015-03-05 Asml Netherlands B.V. Appareil lithographique à immersion
CN105683839B (zh) 2013-09-27 2017-08-08 Asml荷兰有限公司 用于光刻设备的支撑台、光刻设备以及器件制造方法
WO2015106860A1 (fr) 2014-01-20 2015-07-23 Asml Netherlands B.V. Dispositif de maintien de substrat et plateau de support de lithographie
EP3137945B1 (fr) 2014-04-30 2020-05-06 ASML Netherlands B.V. Table de support pour appareil lithographique, appareil lithographique et procédé de fabrication de dispositif
US10551748B2 (en) 2014-12-19 2020-02-04 Asml Netherlands B.V. Fluid handling structure, a lithographic apparatus and a device manufacturing method
CN113204178A (zh) * 2016-01-13 2021-08-03 Asml荷兰有限公司 流体处理结构及光刻设备
CN107561865B (zh) * 2016-06-30 2019-10-25 上海微电子装备（集团）股份有限公司 一种流体抽排装置和一种浸没式光刻机
NL2019842A (en) * 2016-12-14 2018-06-18 Asml Netherlands Bv A lithography apparatus and a method of manufacturing a device
CN113508340A (zh) 2019-03-01 2021-10-15 Asml荷兰有限公司 包括静电夹具的物体保持器
CN109883995B (zh) * 2019-03-05 2021-06-29 中国计量大学 基于哈特曼光线追迹的非均匀介质场的测量系统及其方法
CN113138538A (zh) * 2020-01-17 2021-07-20 浙江启尔机电技术有限公司 一种用于浸没式光刻机的浸液供给回收装置
CN113138540B (zh) * 2020-01-17 2024-02-09 浙江启尔机电技术有限公司 一种具有气液分离回收功能的浸液供给回收装置
CN113138537B (zh) * 2020-01-17 2023-10-13 浙江大学 一种用于浸没式光刻机的浸液供给回收装置
KR20230169991A (ko) * 2021-04-15 2023-12-18 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 시스템, 방법 및 리소그래피 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053956A1 (fr) * 2002-12-10 2004-06-24 Nikon Corporation Appareil d'exposition, procede d'exposition et procede de fabrication d'un dispositif
KR20040054568A (ko) * 2002-12-19 2004-06-25 에이에스엠엘 홀딩 엔.브이. 액침 리소그래피용 액체 흐름 근접 센서

Family Cites Families (266)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE242880C (fr)
DE221563C (fr)
DE224448C (fr)
DE206607C (fr)
GB1242527A (en) 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US3573975A (en) 1968-07-10 1971-04-06 Ibm Photochemical fabrication process
JPS5919912Y2 (ja) 1978-08-21 1984-06-08 清水建設株式会社 複合熱交換器
EP0023231B1 (fr) 1979-07-27 1982-08-11 Tabarelli, Werner, Dr. Procédé de lithographic optique et dispositif pour copier un dessin sur une plaquette semiconductrice
FR2474708B1 (fr) 1980-01-24 1987-02-20 Dme Procede de microphotolithographie a haute resolution de traits
JPS5754317A (en) 1980-09-19 1982-03-31 Hitachi Ltd Method and device for forming pattern
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
US4390273A (en) 1981-02-17 1983-06-28 Censor Patent-Und Versuchsanstalt Projection mask as well as a method and apparatus for the embedding thereof and projection printing system
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS57153433U (fr) 1981-03-20 1982-09-27
JPS58189018A (ja) * 1982-04-28 1983-11-04 Asahi Chem Ind Co Ltd 膜を利用した有機溶媒の分離濃縮方法
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS58189018U (ja) 1982-06-07 1983-12-15 株式会社神戸製鋼所 圧延機出側における圧延油回収装置
DD206607A1 (de) 1982-06-16 1984-02-01 Mikroelektronik Zt Forsch Tech Verfahren und vorrichtung zur beseitigung von interferenzeffekten
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD242880A1 (de) 1983-01-31 1987-02-11 Kuch Karl Heinz Einrichtung zur fotolithografischen strukturuebertragung
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS61113376A (ja) 1984-11-07 1986-05-31 Sony Corp テレビジヨン信号の動き検出装置
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS6265326U (fr) 1985-10-16 1987-04-23
JPS62121417A (ja) 1985-11-22 1987-06-02 Hitachi Ltd 液浸対物レンズ装置
WO1987004114A1 (fr) 1985-12-30 1987-07-16 Ebara Corporation Procede et dispositif de deshydratation
JPS62121417U (fr) 1986-01-24 1987-08-01
US4729932A (en) 1986-10-08 1988-03-08 United Technologies Corporation Fuel cell with integrated cooling water/static water removal means
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JPS63157419U (fr) 1987-03-31 1988-10-14
US5040020A (en) 1988-03-31 1991-08-13 Cornell Research Foundation, Inc. Self-aligned, high resolution resonant dielectric lithography
JPH03209479A (ja) 1989-09-06 1991-09-12 Sanee Giken Kk 露光方法
AU617957B2 (en) 1989-10-26 1991-12-05 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5207915A (en) * 1990-02-23 1993-05-04 Minnesota Mining And Manufacturing Company Separation method using controlled pore composite polytetrafluoroethylene article
US5121256A (en) 1991-03-14 1992-06-09 The Board Of Trustees Of The Leland Stanford Junior University Lithography system employing a solid immersion lens
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるｌｓｉ製造縮小投影露光装置の光学系
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP2520833B2 (ja) 1992-12-21 1996-07-31 東京エレクトロン株式会社 浸漬式の液処理装置
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US6104687A (en) 1996-08-26 2000-08-15 Digital Papyrus Corporation Method and apparatus for coupling an optical lens to a disk through a coupling medium having a relatively high index of refraction
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
EP0951054B1 (fr) 1996-11-28 2008-08-13 Nikon Corporation Dispositif d'alignement et procede d'exposition
JP3612920B2 (ja) 1997-02-14 2005-01-26 ソニー株式会社 光学記録媒体の原盤作製用露光装置
JPH10228861A (ja) 1997-02-17 1998-08-25 Hitachi Ltd シャドウマスク検査手段を具備した露光装置
DE69829614T2 (de) 1997-03-10 2006-03-09 Asml Netherlands B.V. Lithographiegerät mit einer positioniervorrichtung mit zwei objekthaltern
JPH10255319A (ja) 1997-03-12 1998-09-25 Hitachi Maxell Ltd 原盤露光装置及び方法
US5788477A (en) * 1997-03-26 1998-08-04 Jones; Wendyle Gas flare
JP3747566B2 (ja) 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JPH10340850A (ja) 1997-06-05 1998-12-22 Nikon Corp 露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
US5900354A (en) 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
JPH11176727A (ja) 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
AU1505699A (en) 1997-12-12 1999-07-05 Nikon Corporation Projection exposure method and projection aligner
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
TWI242111B (en) 1999-04-19 2005-10-21 Asml Netherlands Bv Gas bearings for use in vacuum chambers and their application in lithographic projection apparatus
WO2001008204A1 (fr) 1999-07-23 2001-02-01 Nikon Corporation Procede et appareil d'exposition
JP4504479B2 (ja) 1999-09-21 2010-07-14 オリンパス株式会社 顕微鏡用液浸対物レンズ
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
JP2001272604A (ja) 2000-03-27 2001-10-05 Olympus Optical Co Ltd 液浸対物レンズおよびそれを用いた光学装置
TW591653B (en) 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
JP2002260999A (ja) 2000-12-08 2002-09-13 Carl-Zeiss-Stiftung Trading As Carl Zeiss 対物レンズの少なくとも１つの内部空間を気体洗浄するシステム
KR100866818B1 (ko) 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
US7099896B2 (en) * 2001-04-06 2006-08-29 Patientkeeper, Inc. Synchronizing data between disparate schemas using composite version
WO2002091078A1 (fr) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Procedes et appareil utilisant un support d'adaptation d'indice
US6600547B2 (en) 2001-09-24 2003-07-29 Nikon Corporation Sliding seal
JP2006502558A (ja) 2001-11-07 2006-01-19 アプライド　マテリアルズ　インコーポレイテッド 光学式スポット格子アレイ印刷装置
JP3572357B2 (ja) 2001-12-17 2004-09-29 防衛庁技術研究本部長 ハンガ装置
US6686084B2 (en) * 2002-01-04 2004-02-03 Hybrid Power Generation Systems, Llc Gas block mechanism for water removal in fuel cells
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (de) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
FR2837098B1 (fr) 2002-03-18 2004-05-28 Vincience Composition cosmetique ou pharmaceutique comprenant des peptides, procedes de traitement et utilisations
JP2005531672A (ja) 2002-07-02 2005-10-20 デグサ アクチエンゲゼルシャフト 液状デュロプラスチック
KR20050035890A (ko) 2002-08-23 2005-04-19 가부시키가이샤 니콘 투영 광학계, 포토리소그래피 방법, 노광 장치 및 그 이용방법
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6788477B2 (en) 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
SG121819A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420300B1 (fr) 2002-11-12 2015-07-29 ASML Netherlands B.V. Appareil lithographique et méthode de fabrication d'un dispositif
CN101382738B (zh) 2002-11-12 2011-01-12 Asml荷兰有限公司 光刻投射装置
JP3977324B2 (ja) 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
EP1429188B1 (fr) 2002-11-12 2013-06-19 ASML Netherlands B.V. Appareil lithographique à projection
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (de) 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121829A1 (en) 2002-11-29 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
AU2003289272A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Surface position detection apparatus, exposure method, and device porducing method
AU2003302831A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Exposure method, exposure apparatus and method for manufacturing device
US7242455B2 (en) 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
KR20130010039A (ko) 2002-12-10 2013-01-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US6992750B2 (en) 2002-12-10 2006-01-31 Canon Kabushiki Kaisha Exposure apparatus and method
SG171468A1 (en) 2002-12-10 2011-06-29 Nikon Corp Exposure apparatus and method for producing device
JP4595320B2 (ja) 2002-12-10 2010-12-08 株式会社ニコン 露光装置、及びデバイス製造方法
EP1571695A4 (fr) 2002-12-10 2008-10-15 Nikon Corp Appareil d'exposition et son procede de fabrication
JP4232449B2 (ja) 2002-12-10 2009-03-04 株式会社ニコン 露光方法、露光装置、及びデバイス製造方法
WO2004053950A1 (fr) 2002-12-10 2004-06-24 Nikon Corporation Appareil d'exposition et procede de fabrication du dispositif
DE10257766A1 (de) 2002-12-10 2004-07-15 Carl Zeiss Smt Ag Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage
JP4179283B2 (ja) 2002-12-10 2008-11-12 株式会社ニコン 光学素子及びその光学素子を用いた投影露光装置
JP4352874B2 (ja) 2002-12-10 2009-10-28 株式会社ニコン 露光装置及びデバイス製造方法
WO2004053954A1 (fr) 2002-12-10 2004-06-24 Nikon Corporation Dispositif d'exposition, et procede de fabrication
ATE424026T1 (de) 2002-12-13 2009-03-15 Koninkl Philips Electronics Nv Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
DE60314668T2 (de) 2002-12-19 2008-03-06 Koninklijke Philips Electronics N.V. Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
WO2004057590A1 (fr) 2002-12-19 2004-07-08 Koninklijke Philips Electronics N.V. Procede et dispositif d'eclairage de points sur une couche
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
AU2003282325A1 (en) 2002-12-20 2004-07-14 Koninklijke Philips Electronics N.V. Protocol-based volume visualization
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
SG2012087615A (en) 2003-02-26 2015-08-28 Nippon Kogaku Kk Exposure apparatus, exposure method, and method for producing device
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US7105089B2 (en) * 2003-03-13 2006-09-12 3M Innovative Properties Company Liquid—liquid extraction system and method
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
ATE426914T1 (de) 2003-04-07 2009-04-15 Nikon Corp Belichtungsgerat und verfahren zur herstellung einer vorrichtung
WO2004093159A2 (fr) 2003-04-09 2004-10-28 Nikon Corporation Systeme de regulation des fluides pour lithographie par immersion
JP4488005B2 (ja) 2003-04-10 2010-06-23 株式会社ニコン 液浸リソグラフィ装置用の液体を捕集するための流出通路
JP4656057B2 (ja) 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
CN101813892B (zh) 2003-04-10 2013-09-25 株式会社尼康 沉浸式光刻装置及使用光刻工艺制造微器件的方法
KR101369016B1 (ko) 2003-04-10 2014-02-28 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
EP2172809B1 (fr) 2003-04-11 2018-11-07 Nikon Corporation Méthode de nettoyage pour des optiques dans un appareil de lithographie par immersion, et appareil de lithographie par immersion correspondant
SG10201404132YA (en) 2003-04-11 2014-09-26 Nippon Kogaku Kk Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
WO2004092830A2 (fr) 2003-04-11 2004-10-28 Nikon Corporation Systeme de projection et de recuperation de liquides pour lithographie par immersion
JP2006523958A (ja) 2003-04-17 2006-10-19 株式会社ニコン 液浸リソグラフィで使用するためのオートフォーカス素子の光学的構造
PL1620423T3 (pl) 2003-05-02 2008-07-31 Dsm Sinochem Pharm Nl Bv Sposób wytwarzania (4-hydroksy-6-okso-tetrahydropiran-2-ylo) acetonitrylu i jego pochodnych
JP4025683B2 (ja) 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
JP4146755B2 (ja) 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN1307456C (zh) 2003-05-23 2007-03-28 佳能株式会社 投影光学系统、曝光装置及器件的制造方法
TWI518742B (zh) * 2003-05-23 2016-01-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
US7274472B2 (en) 2003-05-28 2007-09-25 Timbre Technologies, Inc. Resolution enhanced optical metrology
US7013094B2 (en) 2003-05-29 2006-03-14 Xerox Corporation Reload error compensation method
TWI442694B (zh) 2003-05-30 2014-06-21 Asml Netherlands Bv 微影裝置及元件製造方法
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684008B2 (en) 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4054285B2 (ja) 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
JP4084710B2 (ja) 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
EP2738792B1 (fr) * 2003-06-13 2015-08-05 Nikon Corporation Procédé et appareil d'exposition, support de substrat et procédé de fabrication d'un dispositif
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4084712B2 (ja) 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
JP4029064B2 (ja) 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP4343597B2 (ja) 2003-06-25 2009-10-14 キヤノン株式会社 露光装置及びデバイス製造方法
JP2005019616A (ja) 2003-06-25 2005-01-20 Canon Inc 液浸式露光装置
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP1498778A1 (fr) 2003-06-27 2005-01-19 ASML Netherlands B.V. Appareil lithographique et méthode de fabrication d'un dispositif
EP1494074A1 (fr) 2003-06-30 2005-01-05 ASML Netherlands B.V. Appareil lithographique et méthode de fabrication d'un dispositif
WO2005006026A2 (fr) 2003-07-01 2005-01-20 Nikon Corporation Utilisation de fluides specifies isotopiquement comme elements optiques
EP1652003B1 (fr) 2003-07-08 2015-01-07 Nikon Corporation Table porte-plaquettes pour lithographie par immersion
SG109000A1 (en) 2003-07-16 2005-02-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
EP1500982A1 (fr) 2003-07-24 2005-01-26 ASML Netherlands B.V. Appareil lithographique et méthode de fabrication d'un dispositif
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
EP1503244A1 (fr) 2003-07-28 2005-02-02 ASML Netherlands B.V. Appareil de projection lithographique et méthode de fabrication d'un dispositif
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
EP2264534B1 (fr) 2003-07-28 2013-07-17 Nikon Corporation Appareil d'exposition, procédé de fabrication d'un dispositif et procédé de commande de l'appareil
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR20170070264A (ko) 2003-09-03 2017-06-21 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
JP4378136B2 (ja) 2003-09-04 2009-12-02 キヤノン株式会社 露光装置及びデバイス製造方法
JP3870182B2 (ja) 2003-09-09 2007-01-17 キヤノン株式会社 露光装置及びデバイス製造方法
JP4444920B2 (ja) 2003-09-19 2010-03-31 株式会社ニコン 露光装置及びデバイス製造方法
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
JP2005159322A (ja) 2003-10-31 2005-06-16 Nikon Corp 定盤、ステージ装置及び露光装置並びに露光方法
EP1685446A2 (fr) 2003-11-05 2006-08-02 DSM IP Assets B.V. Procede et appareil de production de microcircuits
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
WO2005054953A2 (fr) 2003-11-24 2005-06-16 Carl-Zeiss Smt Ag Dispositif de support d'element optique dans un objectif
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
JP2005166197A (ja) 2003-12-04 2005-06-23 Fuji Photo Film Co Ltd 磁気転写マスターの位置測定装置および位置決め装置
JP2005175016A (ja) 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
JP2005175034A (ja) 2003-12-09 2005-06-30 Canon Inc 露光装置
WO2005106589A1 (fr) 2004-05-04 2005-11-10 Carl Zeiss Smt Ag Appareil d'exposition par projection microlithographique, et liquide d'immersion destine a l'appareil
WO2005059617A2 (fr) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Objectif de projection a grande ouverture et surface d'extremite plane
WO2005059654A1 (fr) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Objectif utilise comme objectif de projection pour microlithographie dote d'au moins une lentille liquide
JP4720506B2 (ja) * 2003-12-15 2011-07-13 株式会社ニコン ステージ装置、露光装置、及び露光方法
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4954444B2 (ja) 2003-12-26 2012-06-13 株式会社ニコン 流路形成部材、露光装置及びデバイス製造方法
JP2005191381A (ja) 2003-12-26 2005-07-14 Canon Inc 露光方法及び装置
JP2005191393A (ja) 2003-12-26 2005-07-14 Canon Inc 露光方法及び装置
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
KR101748504B1 (ko) * 2004-01-05 2017-06-16 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
JP4371822B2 (ja) 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
CN102169226B (zh) 2004-01-14 2014-04-23 卡尔蔡司Smt有限责任公司 反射折射投影物镜
KR101295439B1 (ko) 2004-01-16 2013-08-09 칼 짜이스 에스엠티 게엠베하 편광변조 광학소자
WO2005069078A1 (fr) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Dispositif d'exposition par projection microlithographique avec objectif de projection par immersion
WO2005071491A2 (fr) 2004-01-20 2005-08-04 Carl Zeiss Smt Ag Appareil microlithographique d'insolation par projection et dispositif de mesure pour objectif de projection
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
US7697110B2 (en) 2004-01-26 2010-04-13 Nikon Corporation Exposure apparatus and device manufacturing method
JP2005217188A (ja) 2004-01-29 2005-08-11 Hamamatsu Photonics Kk 半導体光検出装置及び製造方法
US8852850B2 (en) 2004-02-03 2014-10-07 Rochester Institute Of Technology Method of photolithography using a fluid and a system thereof
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005076084A1 (fr) 2004-02-09 2005-08-18 Carl Zeiss Smt Ag Objectif de projection pour appareil d'exposition microlithographique a projection
JP4018647B2 (ja) 2004-02-09 2007-12-05 キヤノン株式会社 投影露光装置およびデバイス製造方法
KR101115111B1 (ko) 2004-02-13 2012-04-16 칼 짜이스 에스엠티 게엠베하 마이크로 리소그래프 투영 노광 장치 투영 대물 렌즈
WO2005081030A1 (fr) 2004-02-18 2005-09-01 Corning Incorporated Systeme d'imagerie catadioptrique pour imagerie a ouverture numerique elevee avec lumiere a uv lointain
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
JP2005286068A (ja) 2004-03-29 2005-10-13 Canon Inc 露光装置及び方法
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
WO2005093506A1 (fr) 2004-03-29 2005-10-06 Quanta Display Inc. Structure de pixels et son procede de fabrication
JP4510494B2 (ja) 2004-03-29 2010-07-21 キヤノン株式会社 露光装置
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7712905B2 (en) 2004-04-08 2010-05-11 Carl Zeiss Smt Ag Imaging system with mirror group
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7271878B2 (en) 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
US7244665B2 (en) 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
KR101213831B1 (ko) 2004-05-17 2012-12-24 칼 짜이스 에스엠티 게엠베하 중간이미지를 갖는 카타디옵트릭 투사 대물렌즈
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8605257B2 (en) 2004-06-04 2013-12-10 Carl Zeiss Smt Gmbh Projection system with compensation of intensity variations and compensation element therefor
EP1774405B1 (fr) 2004-06-04 2014-08-06 Carl Zeiss SMT GmbH Systeme permettant de mesurer la qualite d'une image d'un systeme d'imagerie optique
US8705008B2 (en) 2004-06-09 2014-04-22 Nikon Corporation Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
JP4543767B2 (ja) 2004-06-10 2010-09-15 株式会社ニコン 露光装置及びデバイス製造方法
KR101505756B1 (ko) 2004-06-10 2015-03-26 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
US20070222959A1 (en) 2004-06-10 2007-09-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
SG10201607447RA (en) 2004-06-10 2016-10-28 Nikon Corp Exposure equipment, exposure method and device manufacturing method
US20070139628A1 (en) 2004-06-10 2007-06-21 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7481867B2 (en) 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
EP3258318B1 (fr) 2004-08-03 2019-02-27 Nikon Corporation Appareil d'exposition, procédé d'exposition et procédé de production d'un dispositif
JP4752375B2 (ja) * 2004-08-03 2011-08-17 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006059720A1 (fr) 2004-12-02 2006-06-08 Nikon Corporation Appareil d’exposition, procede d’exposition et procede de fabrication d’un dispositif
EP1681597B1 (fr) 2005-01-14 2010-03-10 ASML Netherlands B.V. Appareil lithographique et procédé de fabrication d'un dispositif
JP4622595B2 (ja) 2005-03-11 2011-02-02 株式会社ニコン 露光装置及びデバイス製造方法
KR200454568Y1 (ko) * 2009-07-24 2011-07-20 배유라 다기능 가방

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053956A1 (fr) * 2002-12-10 2004-06-24 Nikon Corporation Appareil d'exposition, procede d'exposition et procede de fabrication d'un dispositif
KR20040054568A (ko) * 2002-12-19 2004-06-25 에이에스엠엘 홀딩 엔.브이. 액침 리소그래피용 액체 흐름 근접 센서

Also Published As

Publication number Publication date
CN1737690A (zh) 2006-02-22
JP2019074770A (ja) 2019-05-16
US20110273675A1 (en) 2011-11-10
EP1783556A3 (fr) 2007-05-16
JP2009076951A (ja) 2009-04-09
US8755028B2 (en) 2014-06-17
JP6259489B2 (ja) 2018-01-10
US20060038968A1 (en) 2006-02-23
TWI308674B (en) 2009-04-11
US10705439B2 (en) 2020-07-07
JP2015015503A (ja) 2015-01-22
JP5763255B2 (ja) 2015-08-12
US9746788B2 (en) 2017-08-29
JP5952926B2 (ja) 2016-07-13
US9507278B2 (en) 2016-11-29
EP2261745B1 (fr) 2012-03-14
JP2006060223A (ja) 2006-03-02
SG139771A1 (en) 2008-02-29
KR20070115831A (ko) 2007-12-06
US20170031250A1 (en) 2017-02-02
EP2261744A2 (fr) 2010-12-15
EP1783556B1 (fr) 2015-09-30
US20170045831A1 (en) 2017-02-16
US20140300883A1 (en) 2014-10-09
US20110310367A1 (en) 2011-12-22
EP1783556A2 (fr) 2007-05-09
US8031325B2 (en) 2011-10-04
JP4718619B2 (ja) 2011-07-06
EP1628163B1 (fr) 2010-04-21
JP5023231B2 (ja) 2012-09-12
JP6518305B2 (ja) 2019-05-22
US20190294058A1 (en) 2019-09-26
US7701550B2 (en) 2010-04-20
JP2011199313A (ja) 2011-10-06
JP5676508B2 (ja) 2015-02-25
US9904185B2 (en) 2018-02-27
JP2016153918A (ja) 2016-08-25
US9488923B2 (en) 2016-11-08
EP2261745A3 (fr) 2011-01-05
JP5655131B2 (ja) 2015-01-14
KR100830141B1 (ko) 2008-05-20
US20150323876A1 (en) 2015-11-12
EP1628163A2 (fr) 2006-02-22
SG173341A1 (en) 2011-08-29
JP2010199619A (ja) 2010-09-09
US10331047B2 (en) 2019-06-25
EP1628163A3 (fr) 2006-03-15
TW200615703A (en) 2006-05-16
JP5023187B2 (ja) 2012-09-12
US10599054B2 (en) 2020-03-24
US8446563B2 (en) 2013-05-21
US20060087630A1 (en) 2006-04-27
US20100149514A1 (en) 2010-06-17
JP2017224000A (ja) 2017-12-21
EP2261744A3 (fr) 2011-01-05
EP2261744B1 (fr) 2012-05-09
JP2015099934A (ja) 2015-05-28
JP4456044B2 (ja) 2010-04-28
JP5167307B2 (ja) 2013-03-21
JP2012114478A (ja) 2012-06-14
JP2014057108A (ja) 2014-03-27
US20170357165A1 (en) 2017-12-14
US20090303455A1 (en) 2009-12-10
EP2261745A2 (fr) 2010-12-15
US7602470B2 (en) 2009-10-13
DE602005020720D1 (de) 2010-06-02
JP2010177715A (ja) 2010-08-12
KR20060053182A (ko) 2006-05-19
KR20070077165A (ko) 2007-07-25
US9097992B2 (en) 2015-08-04
SG120267A1 (en) 2006-03-28
US20180188661A1 (en) 2018-07-05
CN100526987C (zh) 2009-08-12
KR100806282B1 (ko) 2008-02-22

Similar Documents

Publication Publication Date Title
US10599054B2 (en) Lithographic apparatus and device manufacturing method

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
A107 Divisional application of patent
E90F Notification of reason for final refusal
N231 Notification of change of applicant
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]
FPAY Annual fee payment

Payment date: 20130208

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140207

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20150206

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20160211

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20170210

Year of fee payment: 10

FPAY Annual fee payment

Payment date: 20180209

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20190212

Year of fee payment: 12