KR100512134B1 - 연마제 및 기판의 연마방법 - Google Patents

연마제 및 기판의 연마방법 Download PDF

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Publication number
KR100512134B1
KR100512134B1 KR10-2002-7013838A KR20027013838A KR100512134B1 KR 100512134 B1 KR100512134 B1 KR 100512134B1 KR 20027013838 A KR20027013838 A KR 20027013838A KR 100512134 B1 KR100512134 B1 KR 100512134B1
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KR
South Korea
Prior art keywords
polishing
abrasive
acid
particles
substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR10-2002-7013838A
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English (en)
Korean (ko)
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KR20020086953A (ko
Inventor
마치이요이치
코야마나오유키
니시야마마사야
요시다마사토
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히다치 가세고교 가부시끼가이샤
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G25/00—Compounds of zirconium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR10-2002-7013838A 2001-02-20 2002-02-20 연마제 및 기판의 연마방법 Expired - Lifetime KR100512134B1 (ko)

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
JP2001044252 2001-02-20
JPJP-P-2001-00044252 2001-02-20
JP2001197274 2001-06-28
JPJP-P-2001-00197274 2001-06-28
JP2001350598 2001-11-15
JPJP-P-2001-00350598 2001-11-15
JP2001378838 2001-12-12
JPJP-P-2001-00378838 2001-12-12
JPJP-P-2001-00400866 2001-12-28
JP2001400876 2001-12-28
JPJP-P-2001-00400872 2001-12-28
JP2001400882 2001-12-28
JPJP-P-2001-00400876 2001-12-28
JPJP-P-2001-00400891 2001-12-28
JP2001400888 2001-12-28
JP2001400866 2001-12-28
JP2001400872 2001-12-28
JPJP-P-2001-00400888 2001-12-28
JPJP-P-2001-00400882 2001-12-28
JP2001400891 2001-12-28

Publications (2)

Publication Number Publication Date
KR20020086953A KR20020086953A (ko) 2002-11-20
KR100512134B1 true KR100512134B1 (ko) 2005-09-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-7013838A Expired - Lifetime KR100512134B1 (ko) 2001-02-20 2002-02-20 연마제 및 기판의 연마방법

Country Status (6)

Country Link
US (1) US6786945B2 (enExample)
EP (2) EP2418258A1 (enExample)
JP (2) JPWO2002067309A1 (enExample)
KR (1) KR100512134B1 (enExample)
CN (2) CN1746255B (enExample)
WO (1) WO2002067309A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110068973A (ko) * 2008-09-12 2011-06-22 페로 코포레이션 화학적-기계적 연마 조성물 및 그 제조 및 사용 방법
KR20240054386A (ko) * 2015-03-05 2024-04-25 씨엠씨 머티리얼즈 엘엘씨 양이온성 중합체 첨가제를 포함하는 연마 조성물
US12428584B2 (en) 2021-08-30 2025-09-30 Kctech Co., Ltd. Cerium oxide abrasive particles and polishing slurry composition

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