JP7387700B2 - 半導体装置、及び半導体装置の製造方法 - Google Patents
半導体装置、及び半導体装置の製造方法 Download PDFInfo
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- JP7387700B2 JP7387700B2 JP2021204942A JP2021204942A JP7387700B2 JP 7387700 B2 JP7387700 B2 JP 7387700B2 JP 2021204942 A JP2021204942 A JP 2021204942A JP 2021204942 A JP2021204942 A JP 2021204942A JP 7387700 B2 JP7387700 B2 JP 7387700B2
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Description
Claims (10)
- 互いに対向する第1表面及び第2表面を有し、前記第1表面から前記第2表面に至る貫通孔が形成された半導体基板と、
前記第1表面に設けられ、一部が前記貫通孔の前記第1表面側の第1開口上に位置する第1配線と、
前記貫通孔の内面及び前記第2表面に設けられ、前記貫通孔の前記第2表面側の第2開口を介して連続する絶縁層と、
前記絶縁層の表面に設けられ、前記絶縁層の前記第1表面側の開口において前記第1配線に電気的に接続された第2配線と、を備え、
前記貫通孔の前記内面は、前記第1表面及び前記第2表面に直交する面であり、
前記絶縁層の前記表面は、
前記貫通孔の内側において前記第1開口に至り、前記第1表面から前記第2表面に向かって広がるテーパ状の第1領域と、
前記貫通孔の内側において前記第2開口に至り、前記第1表面から前記第2表面に向かって広がるテーパ状の第2領域と、
前記貫通孔の外側において前記第2表面に対向する第3領域と、
前記第1領域と前記第2領域とを連続的に接続するように湾曲した第4領域と、
前記第2領域と前記第3領域とを連続的に接続するように湾曲した第5領域と、を含み、
前記第2領域の平均傾斜角度は、前記第1領域の平均傾斜角度よりも小さく、且つ前記貫通孔の前記内面の平均傾斜角度よりも小さく、
前記貫通孔の前記内面の前記平均傾斜角度は、前記第1領域の前記平均傾斜角度よりも大きい、半導体装置。 - 前記第1領域の前記平均傾斜角度は、前記第2領域の前記平均傾斜角度よりも前記貫通孔の前記内面の平均傾斜角度に近い、請求項1記載の半導体装置。
- 前記貫通孔の前記内面に設けられた前記絶縁層の平均厚さは、前記第2表面に設けられた前記絶縁層の平均厚さよりも大きい、請求項1又は2記載の半導体装置。
- 前記第1領域は、前記貫通孔の前記内面に設けられた前記絶縁層のうち、前記半導体基板の厚さと前記第2表面に設けられた前記絶縁層の平均厚さとの和の2/3以下の高さを有する部分の表面である、請求項1~3のいずれか一項記載の半導体装置。
- 前記第1領域は、前記貫通孔の前記内面に設けられた前記絶縁層のうち、前記半導体基板の厚さと前記第2表面に設けられた前記絶縁層の平均厚さとの和の1/2以下の高さを有する部分の表面である、請求項4記載の半導体装置。
- 前記第4領域は、前記貫通孔の前記内面とは反対側に凸の最大曲率を有する領域である、請求項1~5のいずれか一項記載の半導体装置。
- 前記絶縁層は、樹脂からなる、請求項1~6のいずれか一項記載の半導体装置。
- 請求項1~7のいずれか一項記載の半導体装置の製造方法であって、
互いに対向する第1表面及び第2表面を有する半導体基板の前記第1表面に第1配線を設ける第1工程と、
前記半導体基板に、前記第1表面から前記第2表面に至る貫通孔を形成し、前記貫通孔の前記第1表面側の第1開口に前記第1配線の一部を露出させる第2工程と、
前記貫通孔の内面及び前記第2表面に、前記貫通孔の前記第2表面側の第2開口を介して連続する絶縁層を設ける第3工程と、
前記絶縁層にコンタクトホールを形成し、前記絶縁層の前記第1表面側の開口に前記第1配線の一部を露出させる第4工程と、
前記絶縁層の表面に第2配線を設け、前記絶縁層の前記第1表面側の前記開口において前記第1配線と前記第2配線とを電気的に接続する第5工程と、を備える、半導体装置の製造方法。 - 前記第3工程では、10cp以上の粘度を有する樹脂材料を用いてディップコート法を実施することで、前記貫通孔の前記内面及び前記第2表面に前記絶縁層を設ける、請求項8記載の半導体装置の製造方法。
- 前記第3工程では、ポジ型の樹脂材料を用いて、前記貫通孔の前記内面及び前記第2表面に前記絶縁層を設け、
前記第4工程では、前記絶縁層において前記コンタクトホールに対応する部分を露光及び現像することで、前記絶縁層に前記コンタクトホールを形成する、請求項8又は9記載の半導体装置の製造方法。
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US11635186B2 (en) * | 2018-03-13 | 2023-04-25 | Motherson Innovations Company Limited | Polymeric substrate and a method of providing same |
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