JP6654547B2 - SiOCN薄膜の形成 - Google Patents
SiOCN薄膜の形成 Download PDFInfo
- Publication number
- JP6654547B2 JP6654547B2 JP2016219973A JP2016219973A JP6654547B2 JP 6654547 B2 JP6654547 B2 JP 6654547B2 JP 2016219973 A JP2016219973 A JP 2016219973A JP 2016219973 A JP2016219973 A JP 2016219973A JP 6654547 B2 JP6654547 B2 JP 6654547B2
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- Prior art keywords
- siocn
- plasma
- substrate
- reactant
- hydrogen
- Prior art date
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- 239000010409 thin film Substances 0.000 title claims description 77
- 230000015572 biosynthetic process Effects 0.000 title description 4
- 239000000376 reactant Substances 0.000 claims description 190
- 239000000758 substrate Substances 0.000 claims description 180
- 238000000034 method Methods 0.000 claims description 162
- 229910052739 hydrogen Inorganic materials 0.000 claims description 132
- 239000001257 hydrogen Substances 0.000 claims description 130
- 238000000151 deposition Methods 0.000 claims description 126
- 230000008569 process Effects 0.000 claims description 120
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 116
- 230000008021 deposition Effects 0.000 claims description 106
- 238000006243 chemical reaction Methods 0.000 claims description 95
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 78
- 239000007789 gas Substances 0.000 claims description 73
- 229910052710 silicon Inorganic materials 0.000 claims description 71
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 68
- 239000012686 silicon precursor Substances 0.000 claims description 65
- 239000010703 silicon Substances 0.000 claims description 63
- 229910052757 nitrogen Inorganic materials 0.000 claims description 44
- 229910052760 oxygen Inorganic materials 0.000 claims description 41
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 36
- 239000001301 oxygen Substances 0.000 claims description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 35
- 238000000231 atomic layer deposition Methods 0.000 claims description 30
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 30
- 239000011368 organic material Substances 0.000 claims description 28
- 229910052799 carbon Inorganic materials 0.000 claims description 26
- 239000003446 ligand Substances 0.000 claims description 22
- NJSVDVPGINTNGX-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethanamine Chemical compound CCC[Si](OC)(OC)OCN NJSVDVPGINTNGX-UHFFFAOYSA-N 0.000 claims description 18
- 238000001039 wet etching Methods 0.000 claims description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 14
- 229910052756 noble gas Inorganic materials 0.000 claims description 12
- 229910018557 Si O Inorganic materials 0.000 claims description 11
- -1 nitrogen ion Chemical class 0.000 claims description 11
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 4
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims description 2
- 150000004703 alkoxides Chemical group 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 180
- 239000010410 layer Substances 0.000 description 48
- 239000002243 precursor Substances 0.000 description 41
- 125000000217 alkyl group Chemical group 0.000 description 40
- 238000005137 deposition process Methods 0.000 description 31
- 239000000463 material Substances 0.000 description 29
- 229930195733 hydrocarbon Natural products 0.000 description 27
- 239000004215 Carbon black (E152) Substances 0.000 description 26
- 239000006227 byproduct Substances 0.000 description 25
- 229920002120 photoresistant polymer Polymers 0.000 description 25
- 241000894007 species Species 0.000 description 23
- 150000002430 hydrocarbons Chemical class 0.000 description 22
- 238000010926 purge Methods 0.000 description 22
- 239000000203 mixture Substances 0.000 description 16
- 238000009832 plasma treatment Methods 0.000 description 16
- 229910052786 argon Inorganic materials 0.000 description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 229910010271 silicon carbide Inorganic materials 0.000 description 12
- 229910018540 Si C Inorganic materials 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 11
- 229910052734 helium Inorganic materials 0.000 description 10
- 239000011261 inert gas Substances 0.000 description 10
- 239000012071 phase Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 150000002431 hydrogen Chemical class 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000007781 pre-processing Methods 0.000 description 8
- 238000007654 immersion Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 229910007991 Si-N Inorganic materials 0.000 description 6
- 229910006294 Si—N Inorganic materials 0.000 description 6
- 239000012159 carrier gas Substances 0.000 description 6
- 238000000671 immersion lithography Methods 0.000 description 6
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 238000006731 degradation reaction Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 125000004103 aminoalkyl group Chemical group 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000002052 molecular layer Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 229920002396 Polyurea Polymers 0.000 description 3
- 229910003481 amorphous carbon Inorganic materials 0.000 description 3
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000003917 TEM image Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
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- 238000002161 passivation Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002094 self assembled monolayer Substances 0.000 description 2
- 239000013545 self-assembled monolayer Substances 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910005900 GeTe Inorganic materials 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- 238000012546 transfer Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02219—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Description
本願は、2015年11月12日に出願された米国特許出願第14/939,984号の一部継続出願である2016年11月3日に出願された米国特許出願第15/342,943号の優先権を主張するものである。
(RIO)4−xSi(RII−NH2)x (1)
式中、xは、1から4の整数であり、
RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
(RIO)3Si−RII−NH2 (2)
式中、RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
(RIO)4−xSi(−[CH2]n−NH2)x (3)
式中、xは、1から4の整数であり、
nは、1から5の整数であり、
RIは、独立に選択されるアルキル基である。
(RIO)4−xSi(RII−NH2)x (1)
式中、xは、1から4の整数であり、
RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
(RIO)3Si−RII−NH2 (2)
式中、RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
(RIO)4−xSi(−[CH2]n−NH2)x (3)
式中、xは、1から4の整数であり、
nは、1から5の整数であり、
RIは、独立に選択されるアルキル基である。
LnSi(ORI)4−x−y−z−n(RIINRIIIRIV)xHy(OH)z
式中、nは0から3の整数であり、xは1から4の整数であり、yは0から3の整数であり、zは0から3の整数であり、4−x−y−z−nは0から3であり、
RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
RIII及びRIVは、独立に選択されるアルキル基及び/又は水素であり、
Lは、独立に選択されるアルキル基又はハロゲンである。
LnSi(ORI)4−x−n(RIINRIIIRIV)x
式中、nは0から3の整数であり、xは1から3の整数であり、
Lは、独立に選択されるアルキル基又はハロゲンであり、
RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
RIII及びRIVは、独立に選択されるアルキル基及び/又は水素である。
Si(ORI)4−x−y−z(RIINRIIIRIV)xHy(OH)z
式中、xは1から4の整数であり、yは0から3の整数であり、zは0から3の整数であり、
RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
RIII及びRIVは、独立に選択されるアルキル基及び/又は水素である。
Si(ORI)4−x(RIINRIIIRIV)x
式中、xは、1から4の整数であり、
RIは、独立に選択されるアルキル基であり、
RIIは、独立に選択される炭化水素であり、
RIII及びRIVは、独立に選択されるアルキル基及び/又は水素である。
一部の実施形態においては、過剰の第2の前駆体は、ALDサイクル全体を通して流れる窒素、アルゴンなどの不活性ガスを利用してパージされる。一部の実施形態においては、基板は、第2の反応物を含む反応空間から異なる反応空間に移されてもよい。除去は、一部の実施形態においては、約0.1秒から約10秒、約0.1秒から約4秒、又は約0.1秒から約0.5秒であってもよい。共に、反応種の接触と除去は、SiOCN原子層堆積サイクルにおける第2の反応種段階を成す。
一部の実施形態においては、こうしたSiOCN薄膜は、有機材料の保護層として機能してもよく、有機材料を劣化又は損傷させるPEALDプロセスによって更なるSiOCN膜の堆積を可能にしてもよい。
上述したように、また、以下でより詳細に考察するように、一部の実施形態においては、SiOCN薄膜は、プラズマエンハンスト原子層堆積(PEALD)プロセスによって反応空間において基板上に堆積されうる。一部の実施形態によれば、SiOCN薄膜は、PEALDプロセスによってフィン型FET適用例などにおける3次元的形状を有する基板上に堆積される。一部の実施形態においては、本明細書に記載のPEALDプロセスは、種々の用途に使用されてもよい。例えば、本明細書に記載のPEALDプロセスは、ハードマスク層、犠牲層、保護層又はlow−kスペーサの形成に使用されてもよい。本明細書に記載のPEALDプロセスは、例えば、メモリ素子用途に使用されてもよい。
ステップ120において、ケイ素種が基板の表面に吸着するように基板を気相ケイ素含有前駆体と接触するステップと、
ステップ130において、過剰のケイ素含有前駆体及び反応副生物があれば、過剰のケイ素含有前駆体及び反応副生物を基板表面から除去するステップと、
ステップ140において、基板をプラズマによって生成された反応種を含む第2の反応物と接触させ、それによって吸着ケイ素種をSiOCNに転化するステップと、
ステップ150において、過剰の第2の反応物及び反応副生物があれば、過剰の第2の反応物及び反応副生物を基板表面から除去するステップと、
ステップ160において、場合によっては、接触及び除去ステップを繰り返して、所望の厚さ及び組成のSiOCN薄膜を形成するステップと、
を含む少なくとも1つのサイクルを含むPEALD堆積プロセス100によって、SiOCN薄膜は、反応空間において基板上に堆積される。
ケイ素化合物が基板表面に吸着するように基板を気相ケイ素反応物と接触するステップと、
基板をパージガス及び/又は真空に暴露するステップと、
第2の反応物中でプラズマを形成することによって生成された反応種と基板を接触するステップと、
基板をパージガス及び/又は真空に暴露するステップと、
場合によっては、所望の厚さ及び組成のSiOCN薄膜が得られるまで、接触及び暴露するステップを繰り返すステップと、
を含む。
ケイ素種が基板の表面に吸着するように基板をAPTMSと接触するステップと、
過剰のAPTMS及び反応副生物があれば、過剰のAPTMS及び反応副生物を基板表面から除去するステップと、
基板をプラズマによって生成された反応種を含む第2の反応物と接触するステップであって、ここで、反応種は水素を含む、ステップと、
過剰の第2の反応物及び反応副生物があれば、過剰の第2の反応物及び反応副生物を基板表面から除去するステップと、
場合によっては、接触及び除去ステップを繰り返して、所望の厚さ及び組成のSiOCN薄膜を形成するステップと、
を含む少なくとも1回のサイクルを含むPEALD堆積プロセスによって、SiOCN薄膜は、反応空間において基板上に堆積される。
ケイ素種が基板の表面に吸着するように基板を気相ケイ素含有前駆体と接触するステップと、
過剰のケイ素含有前駆体及び反応副生物があれば、過剰のケイ素含有前駆体及び反応副生物を基板表面から除去するステップと、
基板を窒素含有ガス及び/又は希ガス(単数又は複数)などの不活性ガスからプラズマによって生成された反応種を含む第2の反応物と接触するステップと、
過剰の第2の反応物及び反応副生物があれば、過剰の第2の反応物及び反応副生物を基板表面から除去するステップと、
場合によっては、接触及び除去するステップを繰り返して、所望の厚さ及び組成の第1のSiOCN層を形成するステップと、
を含む2以上の堆積サイクルを含む第1のプラズマ堆積プロセス、及び
ケイ素種が基板の表面に吸着するように基板を気相ケイ素含有前駆体と接触するステップと、
過剰のケイ素含有前駆体及び反応副生物があれば、過剰のケイ素含有前駆体及び反応副生物を基板表面から除去するステップと、
基板をプラズマによって生成された反応種を含む第2の反応物と接触するステップであって、ここで、反応種は水素を含む、ステップと、
過剰の第2の反応物及び反応副生物があれば、過剰の第2の反応物及び反応副生物を基板表面から除去するステップと、
場合によっては、接触及び除去するステップを繰り返して、所望の厚さ及び組成の第2のSiOCN層を形成するステップと、
を含む2以上の堆積サイクルを含む第2の水素含有プラズマ堆積プロセス
を含む方法によって、SiOCN薄膜は、反応空間において基板上に堆積されてもよい。
幾つかの異なる適切なSi前駆体は、本開示のPEALDプロセスに使用されてもよい。一部の実施形態においては、PEALDプロセスによるSiOCNの堆積に適切な少なくとも幾つかのSi前駆体は、以下の一般式を有する。
(1)Si(ORI)4−x(RIINRIIIRIV)x
式中、x=1〜4であり、RIは独立に選択されるアルキル基であってもよく、RIIは独立に選択される炭化水素基であってもよく、RIII及びRIVは独立に選択されるアルキル基及び/又は水素であってもよい。一部の実施形態においては、RI及びRIIは、メチル、エチル、n−プロピル、イソプロピルなどのC1〜C3アルキルリガンドである。一部の実施形態においては、RIは、メチル、エチル、n−プロピル、イソプロピル、tert−ブチルなどのC1〜C4アルキルリガンドであってもよい。一部の実施形態においては、RIIはC3炭化水素ではない。一部の実施形態においては、RIIは、C1〜C2炭化水素又はC4〜C6炭化水素である。一部の実施形態においては、RIIは、1以上の二重結合を含む炭化水素などの不飽和炭化水素であってもよい。一部の実施形態においては、RIIは、水素の1つが除去されたアルキル基であってもよい。一部の実施形態においては、RIII及びRIVは水素である。一部の実施形態においては、RIはメチルであり、RIIはn−プロピルであり、RIIIは水素であり、RIVは水素であり、x=1である。
(2) Si(ORI)4−x−y−z(RIINRIIIRIV)xHy(OH)z
式中、x=1〜4、y=0〜3及びz=0〜3であり、RI及びRIIは独立に選択されるアルキル基であってもよく、RIIは独立に選択される炭化水素であってもよく、RIII及びRIVは独立に選択されるアルキル基及び/又は水素であってもよい。一部の実施形態においては、RIIは、1以上の二重結合を含む炭化水素などの不飽和炭化水素であってもよい。一部の実施形態においては、RIIは、水素の1つが除去されたアルキル基であってもよい。
(3)LnSi(ORI)4−x−n(RIINRIIIRIV)x
式中、n=1〜3、x=0〜3であり、RIは独立に選択されるアルキル基であってもよく、RIIは独立に選択される炭化水素であってもよく、RIII及びRIVは独立に選択されるアルキル基及び/又は水素であってもよく、Lは独立に選択されるアルキル基又はハロゲンである。一部の実施形態においては、RIIは、1以上の二重結合を含む炭化水素などの不飽和炭化水素であってもよい。一部の実施形態においては、RIIは、水素の1つが除去されたアルキル基であってもよい。
(4)LnSi(ORI)4−x−y−z−n(RIINRIIIRIV)xHy(OH)z
式中、n=0〜3、x=1〜4、y=0〜3、z=0〜3であり、RIは独立に選択されるアルキル基であってもよく、RIIは独立に選択される炭化水素であってもよく、RIII及びRIVは独立に選択されるアルキル基及び/又は水素であってもよく、Lは独立に選択されるアルキル基又はハロゲンである。一部の実施形態においては、RIIは、1以上の二重結合を含む炭化水素などの不飽和炭化水素であってもよい。一部の実施形態においては、RIIは、水素の1つが除去されたアルキル基であってもよい。
5)(RIO)4−xSi(RII−NH2)x
式中、x=1〜4であり、RIは独立に選択されるアルキル基であってもよく、RIIは独立に選択される炭化水素であってもよい。一部の実施形態においては、RI及びRIIは、メチル、エチル、n−プロピル、イソプロピルなどのC1〜C3アルキルリガンドである。一部の実施形態においては、RIはメチルであり、RIIはn−プロピルであり、x=1である。一部の実施形態においては、RIIは、1以上の二重結合を含む炭化水素などの不飽和炭化水素であってもよい。一部の実施形態においては、RIIは、水素の1つが除去されたアルキル基であってもよい。
6)(RIO)3Si−RII−NH2
式中、RIは独立に選択されるアルキル基であってもよく、RIIは独立に選択される炭化水素であってもよい。一部の実施形態においては、RI及びRIIは、メチル、エチル、n−プロピル、イソプロピルなどのC1〜C3アルキルリガンドである。一部の実施形態においては、RIIは、1以上の二重結合を含む炭化水素などの不飽和炭化水素であってもよい。一部の実施形態においては、RIIは、水素の1つが除去されたアルキル基であってもよい。
7)(RIO)4−xSi(−[CH2]n−NH2)x
式中、x=1〜4、n=1〜5であり、RIは独立に選択されるアルキル基であってもよい。一部の実施形態においては、RIは、メチル、エチル、n−プロピル、イソプロピルなどのC1〜C4アルキルリガンドである。一部の実施形態においては、RIはメチルであり、x=1である。
上述したように、本開示に係るSiOCNを堆積するための第2の反応物は、反応種を含んでもよい水素前駆体を含んでもよい。一部の実施形態においては、反応種としては、ラジカル、プラズマ及び/又は励起原子若しくは種が挙げられるが、それだけに限定されない。こうした反応種は、例えば、プラズマ放電、熱線又は別の適切な方法によって生成されてもよい。一部の実施形態においては、反応種は、反応室から遠隔で、例えば、反応室の上流で生成されてもよい(「リモートプラズマ」)。一部の実施形態においては、反応種は、反応室において、基板のすぐ近くで、又は直接基板上で生成されてもよい(「ダイレクトプラズマ」)。
本明細書で述べる実施形態の幾つかによって堆積したSiOCN薄膜は、不純物レベル又は濃度を約3原子%未満、約1原子%未満、約0.5原子%未満又は約0.1原子%未満にしてもよい。幾つかの薄膜においては、水素を除いた全不純物レベルは、約5原子%未満、約2原子%未満、約1原子%未満又は約0.2原子%未満であってもよい。さらに、幾つかの薄膜においては、水素レベルは、約30原子%未満、約20原子%未満、約15原子%未満又は約10原子%未満であってもよい。本明細書では、不純物は、Si、O、C及び/又はN以外の任意の元素と考えられてもよい。
一部の実施形態においては、本明細書に記載のSiOCN薄膜堆積プロセスを使用して、例えば自己整合パターニングプロセスなどのマルチパターニングプロセスに使用される、SiOCN薄膜が形成されてもよい。一部の実施形態においては、SiOCN薄膜は、有機材料、例えば、フォトレジストを含むパターン形成有機材料を含む基板上に、マルチパターニングプロセスの一部として形成又は堆積されてもよい。一部の実施形態においては、本明細書に記載のSiOCN堆積プロセスは、スペーサデファインドダブルパターニング(SDDP)プロセス又はスペーサデファインドクアドラプルパターニング(SDQP)プロセスの一部として使用されてもよい。
例示的なSiOCN薄膜を本明細書に記載のPEALDプロセスによって堆積させた。堆積温度は300℃であり、APTMSをケイ素前駆体として使用した。200WのRFパワーを第2の反応物に印加することによってプラズマを発生させた。H2とN2との混合物を、Arキャリアガスと一緒に供給した第2の反応物として使用した。図2に、本明細書に記載のPEALDプロセスによって堆積されたSiOCN膜の1サイクル当たりの成長(Å/サイクル)、屈折率、及びTOXと比べたWERRを第2の反応物ガス比の関数として示す。第2の反応物ガス比は、図2のX軸に沿って示され、第2の反応物におけるH2とN2の両方に対するN2の比(N2:(H2+N2))である。
図5A及び5Bは、それぞれ、dHFウェットエッチング溶液に2分間浸漬暴露前後のトレンチ構造上に形成されたSiOCN膜の断面図を示す走査型電子顕微鏡(SEM:scanning electron microscopy)画像である。図5A及び5BのSiOCN膜は、本明細書に記載のPEALDプロセスによって形成された。堆積温度は300℃であり、APTMSをケイ素前駆体として使用した。400WのRFパワーをH2を含む第2の反応物に印加することによってプラズマを発生させた。プラズマパルス時間は8秒であった。図5C及び5Dは、それぞれ、dHFウェットエッチング溶液に2分間浸漬暴露前後のトレンチ構造上に形成されたSiOCN膜の断面図を示す走査型電子顕微鏡(SEM:scanning electron microscopy)画像である。図5C及び5DのSiOCN膜は、本明細書に記載のPEALDプロセスによって形成された。堆積温度は300℃であり、APTMSをケイ素前駆体として使用した。400WのRFパワーをH2及びN2を含む第2の反応物に印加することによってプラズマを発生させた。プラズマパルス時間は8秒であった。
例示的なSiOCN膜を本明細書に記載の方法によって堆積させた。ケイ素前駆体としてのAPTMSとN2からプラズマによって生成された反応種を含む第2の反応物とを含む複数の堆積サイクルと、所与の数の堆積サイクルの後に繰り返される水素プラズマサイクルとを含む、一部の実施形態によるPEALDプロセスによって、SiOCN膜を堆積させた。水素プラズマサイクルは、基板を、H2からプラズマによって生成された反応種と約4秒間接触するステップを含んだ。
表面にポリイミド膜を含む基板上に試料SiOCN膜を堆積させた。第1の窒素含有プラズマ堆積ステップ及び第2の水素含有プラズマ堆積ステップを含む本明細書に記載のPEALD法によって試料SiOCN膜を堆積させた。第1の窒素含有プラズマ堆積ステップは、ケイ素前駆体としてのAPTMSとN2からプラズマによって生成された反応種を含む第2の反応物とを使用して、第1のSiOCN層を形成した。第2の水素含有プラズマ堆積ステップは、第2のSiOCN層を形成するために、ケイ素前駆体としてのAPTMSとH2からプラズマによって生成された反応種を含む第2の反応物とを含んだ。
図7に、ケイ素前駆体としてのAPTMSと反応室に100sccmで流入するH2からプラズマによって生成された反応種を含む第2の反応物とを利用した本明細書に記載のPEALDプロセスによって、3次元トレンチ構造を含む基板上に堆積された試料SiOCN膜701を示す。堆積中の反応室の圧力は4Torrであり、温度は225℃であり、200WのRFパワーを第2の反応物に印加することによって第2の反応物を生成させた。各堆積サイクルにおいてケイ素前駆体を反応室に4秒間パルスし、4秒間パージし、一方、第2の反応物を反応室に4秒間パルスし、0.5秒間パージした。
Claims (18)
- 反応空間においてプラズマエンハンスト原子層堆積(PEALD)プロセスによって基板上にSi−O結合を含む薄膜を形成する方法であって、
前記PEALDプロセスが、
前記基板の表面を気相ケイ素前駆体に接触させ、それにより前記基板の表面上にケイ素種を吸着させるステップと、
吸着された前記ケイ素種を、酸素を含まないガスから形成されたプラズマによって生成された少なくとも1つの反応種と接触させるステップであって、吸着された前記ケイ素種は、ガスから生成された酸素含有反応種とは接触されない、ステップと、
を含む少なくとも1つの堆積サイクルを含み、
前記ケイ素前駆体は、ケイ素原子、前記ケイ素原子と結合されたアルコキシド基及び炭素を介して前記ケイ素原子と結合されたアミノ基を含むリガンドを含み、前記PEALDプロセスは、所望の厚さのケイ素、酸素及び炭素を含む薄膜が形成されるまで、前記接触させるステップを繰り返すステップを更に含む、
方法。 - 前記薄膜は、10原子%までの窒素を含む、請求項1に記載の方法。
- 前記薄膜は、5原子%超の窒素を含む、請求項2に記載の方法。
- 前記薄膜は、少なくとも20原子%の酸素を含む、請求項1に記載の方法。
- 前記薄膜は、少なくとも5原子%の炭素を含む、請求項1に記載の方法。
- 前記薄膜のウェットエッチング速度と熱酸化ケイ素のウェットエッチング速度との比は、約5未満である、請求項1に記載の方法。
- 前記薄膜のウェットエッチング速度と熱酸化ケイ素のウェットエッチング速度との比は、約0.3未満である、請求項1に記載の方法。
- 前記薄膜は、三次元構造上に堆積される、請求項1に記載の方法。
- 前記三次元構造の表面に形成される前記薄膜のウェットエッチング速度と前記三次元構造の側壁表面に形成される前記薄膜のウェットエッチング速度との比は、希釈HF中で約1:1である、請求項8に記載の方法。
- 前記ケイ素前駆体は、ハロゲンを含まない、請求項1に記載の方法。
- 前記ケイ素前駆体は、(3−アミノプロピル)トリメトキシシラン(3−aminopropyl)trimethoxysilane)(APTMS)を含む、請求項1に記載の方法。
- 前記反応種は、水素プラズマ、水素原子、水素ラジカル又は水素イオンを含む、請求項1に記載の方法。
- 前記反応種は、窒素プラズマ、窒素原子、窒素ラジカル又は窒素イオンを更に含む、請求項12に記載の方法。
- 前記反応種は、希ガスを含む第2の反応物から生成される、請求項1に記載の方法。
- 前記反応種は、水素を含む第2の反応物からプラズマによって生成される、請求項1に記載の方法。
- 前記第2の反応物は、H2を含む、請求項15に記載の方法。
- 前記堆積サイクルは、約100℃未満のプロセス温度で実施される、請求項1に記載の方法。
- 前記基板は、有機材料を含む、請求項1に記載の方法。
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