JP2015070269A5 - - Google Patents

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JP2015070269A5
JP2015070269A5 JP2014192072A JP2014192072A JP2015070269A5 JP 2015070269 A5 JP2015070269 A5 JP 2015070269A5 JP 2014192072 A JP2014192072 A JP 2014192072A JP 2014192072 A JP2014192072 A JP 2014192072A JP 2015070269 A5 JP2015070269 A5 JP 2015070269A5
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JP
Japan
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dielectric
semiconductor device
dielectric layer
package structure
vias
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JP2014192072A
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English (en)
Japanese (ja)
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JP2015070269A (ja
JP6587792B2 (ja
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Priority claimed from US14/037,728 external-priority patent/US9209151B2/en
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JP2014192072A 2013-09-26 2014-09-22 埋め込み型半導体デバイスパッケージおよびその製造方法 Active JP6587792B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/037,728 US9209151B2 (en) 2013-09-26 2013-09-26 Embedded semiconductor device package and method of manufacturing thereof
US14/037,728 2013-09-26

Publications (3)

Publication Number Publication Date
JP2015070269A JP2015070269A (ja) 2015-04-13
JP2015070269A5 true JP2015070269A5 (enExample) 2017-10-19
JP6587792B2 JP6587792B2 (ja) 2019-10-09

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JP2014192072A Active JP6587792B2 (ja) 2013-09-26 2014-09-22 埋め込み型半導体デバイスパッケージおよびその製造方法

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US (2) US9209151B2 (enExample)
EP (1) EP2854168A3 (enExample)
JP (1) JP6587792B2 (enExample)
KR (1) KR102295990B1 (enExample)
CN (1) CN104681520A (enExample)
TW (2) TWI634632B (enExample)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857210A (zh) * 2012-11-28 2014-06-11 宏启胜精密电子(秦皇岛)有限公司 承载电路板、承载电路板的制作方法及封装结构
TWI474450B (zh) * 2013-09-27 2015-02-21 旭德科技股份有限公司 封裝載板及其製作方法
US9704781B2 (en) * 2013-11-19 2017-07-11 Micron Technology, Inc. Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
KR102042137B1 (ko) 2014-05-30 2019-11-28 한국전자통신연구원 전자장치 및 그 제조 방법
JP2015228455A (ja) * 2014-06-02 2015-12-17 株式会社東芝 半導体装置及びその製造方法
US20150366081A1 (en) * 2014-06-15 2015-12-17 Unimicron Technology Corp. Manufacturing method for circuit structure embedded with electronic device
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
CN207166882U (zh) * 2014-10-16 2018-03-30 株式会社村田制作所 复合器件
JP6048481B2 (ja) * 2014-11-27 2016-12-21 株式会社豊田自動織機 電子機器
KR20160084143A (ko) * 2015-01-05 2016-07-13 삼성전기주식회사 전자소자 내장기판 및 그 제조 방법
JP6430883B2 (ja) * 2015-04-10 2018-11-28 株式会社ジェイデバイス 半導体パッケージ及びその製造方法
US10535633B2 (en) 2015-07-02 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chip package having die structures of different heights and method of forming same
US9806058B2 (en) * 2015-07-02 2017-10-31 Taiwan Semiconductor Manufacturing Company, Ltd. Chip package having die structures of different heights and method of forming same
WO2017039275A1 (ko) 2015-08-31 2017-03-09 한양대학교 산학협력단 반도체 패키지 구조체, 및 그 제조 방법
KR101923659B1 (ko) * 2015-08-31 2019-02-22 삼성전자주식회사 반도체 패키지 구조체, 및 그 제조 방법
JP6862087B2 (ja) * 2015-12-11 2021-04-21 株式会社アムコー・テクノロジー・ジャパン 配線基板、配線基板を有する半導体パッケージ、およびその製造方法
EP3443584B1 (en) * 2016-04-11 2021-11-03 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Batch manufacturing of component carriers and their related semi-finished product
US10660208B2 (en) * 2016-07-13 2020-05-19 General Electric Company Embedded dry film battery module and method of manufacturing thereof
US10743422B2 (en) 2016-09-27 2020-08-11 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding a component in a core on conductive foil
SG10201608773PA (en) * 2016-10-19 2018-05-30 Delta Electronics Intl Singapore Pte Ltd Method Of Packaging Semiconductor Device
US10700035B2 (en) 2016-11-04 2020-06-30 General Electric Company Stacked electronics package and method of manufacturing thereof
US10312194B2 (en) * 2016-11-04 2019-06-04 General Electric Company Stacked electronics package and method of manufacturing thereof
US9966361B1 (en) 2016-11-04 2018-05-08 General Electric Company Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
US20180130732A1 (en) * 2016-11-04 2018-05-10 General Electric Company Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
US9966371B1 (en) * 2016-11-04 2018-05-08 General Electric Company Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
US9953913B1 (en) 2016-12-12 2018-04-24 General Electric Company Electronics package with embedded through-connect structure and method of manufacturing thereof
US9953917B1 (en) * 2016-12-12 2018-04-24 General Electric Company Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof
CN106601701B (zh) * 2017-01-19 2023-03-28 贵州煜立电子科技有限公司 大功率二端表面引出脚电子元器件立体封装方法及结构
JP6768843B2 (ja) * 2017-01-30 2020-10-14 三菱電機株式会社 パワー半導体装置の製造方法およびパワー半導体装置
JP6809294B2 (ja) * 2017-03-02 2021-01-06 三菱電機株式会社 パワーモジュール
US11305488B2 (en) 2017-04-03 2022-04-19 Creative Ic3D Ltd. Process for producing three dimensional structures
US10804115B2 (en) 2017-08-03 2020-10-13 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541153B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541209B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
US10910290B2 (en) * 2017-10-19 2021-02-02 Taiwan Semiconductor Manufacturing Co., Ltd. Structures and methods for heat dissipation of semiconductor devices
US10643919B2 (en) * 2017-11-08 2020-05-05 Samsung Electronics Co., Ltd. Fan-out semiconductor package
US12506055B2 (en) 2017-11-29 2025-12-23 Pep Innovation Pte. Ltd. Chip packaging method and chip structure
WO2019117967A1 (en) 2017-12-15 2019-06-20 Hewlett-Packard Development Company, L.P. Three-dimensional printing
WO2019171684A1 (ja) * 2018-03-07 2019-09-12 三菱電機株式会社 半導体装置及び電力変換装置
US10497648B2 (en) 2018-04-03 2019-12-03 General Electric Company Embedded electronics package with multi-thickness interconnect structure and method of making same
KR102164795B1 (ko) * 2018-09-06 2020-10-13 삼성전자주식회사 팬-아웃 반도체 패키지
US11296001B2 (en) * 2018-10-19 2022-04-05 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
JP6573415B1 (ja) * 2018-11-15 2019-09-11 有限会社アイピーシステムズ ビア配線形成用基板及びビア配線形成用基板の製造方法並びに半導体装置実装部品の製造方法
US20200161206A1 (en) * 2018-11-20 2020-05-21 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and semiconductor manufacturing process
CN109727969A (zh) * 2018-12-29 2019-05-07 华进半导体封装先导技术研发中心有限公司 一种基板埋入式功率器件封装结构及其制造方法
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
EP3716326A1 (en) * 2019-03-25 2020-09-30 Mitsubishi Electric R&D Centre Europe B.V. Electrically power assembly with thick electrically conductive layers
US12245377B2 (en) 2019-03-29 2025-03-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled
EP3716321B1 (en) * 2019-03-29 2025-01-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded semiconductor component and embedded highly conductive block which are mutually coupled
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
CN110600440B (zh) * 2019-05-13 2021-12-14 华为技术有限公司 一种埋入式封装结构及其制备方法、终端
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
KR102574409B1 (ko) * 2019-07-01 2023-09-04 삼성전기주식회사 반도체 패키지
CN112447777A (zh) * 2019-08-30 2021-03-05 旭景科技股份有限公司 集成电路封装结构及其形成方法
US11632860B2 (en) 2019-10-25 2023-04-18 Infineon Technologies Ag Power electronic assembly and method of producing thereof
EP3836208A1 (en) * 2019-11-19 2021-06-16 Mitsubishi Electric R & D Centre Europe B.V. Method and system for interconnecting a power device embedded in a substrate using conducting paste into cavities
US11862546B2 (en) * 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
CN111564414B (zh) * 2019-12-12 2021-09-24 奥特斯(中国)有限公司 部件承载件及制造部件承载件的方法
WO2021156958A1 (ja) * 2020-02-05 2021-08-12 太陽誘電株式会社 半導体モジュールおよび電源モジュール
EP3869923B1 (en) 2020-02-20 2025-01-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Cooling profile integration for embedded power systems
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11398445B2 (en) 2020-05-29 2022-07-26 General Electric Company Mechanical punched via formation in electronics package and electronics package formed thereby
TWI753468B (zh) * 2020-06-24 2022-01-21 欣興電子股份有限公司 具散熱結構之基板結構及其製造方法
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11342248B2 (en) * 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
CN114038843B (zh) * 2020-10-24 2025-09-05 Pep创新私人有限公司 芯片封装、芯片结构及其制造方法
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
TWI766540B (zh) * 2021-01-13 2022-06-01 矽品精密工業股份有限公司 電子封裝件及其製法
JP7168828B2 (ja) * 2021-03-31 2022-11-10 株式会社Flosfia 半導体装置および半導体システム
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US11950394B2 (en) 2021-10-12 2024-04-02 Ge Aviation Systems Llc Liquid-cooled assembly and method
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
TWI816267B (zh) 2021-10-29 2023-09-21 財團法人工業技術研究院 內埋式封裝結構
US20250183233A1 (en) 2022-03-14 2025-06-05 Mitsubishi Electric Corporation Power module semiconductor package and semiconductor apparatus
US20230378042A1 (en) * 2022-05-23 2023-11-23 Taiwan Semiconductor Manufacturing Company Limited Reinforced substrates to mitigate underflow stress and package warp and methods of making the same
TWI844243B (zh) * 2023-01-18 2024-06-01 宏碁股份有限公司 電子封裝結構
US20240321674A1 (en) * 2023-03-23 2024-09-26 Mediatek Inc. Semiconductor device
CN118173455A (zh) * 2024-02-20 2024-06-11 深南电路股份有限公司 一种功率芯片埋入式的封装基板及封装方法
CN119993913A (zh) * 2025-04-15 2025-05-13 江苏长晶科技股份有限公司 芯片封装方法、芯片结构及电子设备
CN120709250A (zh) * 2025-05-14 2025-09-26 青岛佳恩半导体科技有限公司 一种改进型的igbt模块结构及封装方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353498A (en) 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US6306680B1 (en) 1999-02-22 2001-10-23 General Electric Company Power overlay chip scale packages for discrete power devices
US6232151B1 (en) 1999-11-01 2001-05-15 General Electric Company Power electronic module packaging
JP3815239B2 (ja) * 2001-03-13 2006-08-30 日本電気株式会社 半導体素子の実装構造及びプリント配線基板
US6706563B2 (en) * 2002-04-10 2004-03-16 St Assembly Test Services Pte Ltd Heat spreader interconnect methodology for thermally enhanced PBGA packages
CN100452342C (zh) * 2002-07-31 2009-01-14 索尼株式会社 制造内置器件的基板的方法
US20050233122A1 (en) * 2004-04-19 2005-10-20 Mikio Nishimura Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
JP4800606B2 (ja) * 2004-11-19 2011-10-26 Ｏｋｉセミコンダクタ株式会社 素子内蔵基板の製造方法
TWI245388B (en) * 2005-01-06 2005-12-11 Phoenix Prec Technology Corp Three dimensional package structure of semiconductor chip embedded in substrate and method for fabricating the same
US7518236B2 (en) 2005-10-26 2009-04-14 General Electric Company Power circuit package and fabrication method
US20080190748A1 (en) 2007-02-13 2008-08-14 Stephen Daley Arthur Power overlay structure for mems devices and method for making power overlay structure for mems devices
DE102007009521B4 (de) * 2007-02-27 2011-12-15 Infineon Technologies Ag Bauteil und Verfahren zu dessen Herstellung
WO2009020240A2 (en) * 2007-08-08 2009-02-12 Casio Computer Co., Ltd. Semiconductor device and method for manufacturing the same
JP5042762B2 (ja) * 2007-09-27 2012-10-03 株式会社テラミクロス 半導体装置
US7935893B2 (en) * 2008-02-14 2011-05-03 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8507320B2 (en) * 2008-03-18 2013-08-13 Infineon Technologies Ag Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
TWI443789B (zh) * 2008-07-04 2014-07-01 欣興電子股份有限公司 嵌埋有半導體晶片之電路板及其製法
KR101486420B1 (ko) * 2008-07-25 2015-01-26 삼성전자주식회사 칩 패키지, 이를 이용한 적층형 패키지 및 그 제조 방법
TWI417993B (zh) * 2009-02-04 2013-12-01 Unimicron Technology Corp 具凹穴結構的封裝基板、半導體封裝體及其製作方法
US8358000B2 (en) 2009-03-13 2013-01-22 General Electric Company Double side cooled power module with power overlay
JP2010251688A (ja) 2009-03-25 2010-11-04 Nec Toppan Circuit Solutions Inc 部品内蔵印刷配線板及びその製造方法
JPWO2011016555A1 (ja) * 2009-08-07 2013-01-17 日本電気株式会社 半導体装置とその製造方法
US8120158B2 (en) * 2009-11-10 2012-02-21 Infineon Technologies Ag Laminate electronic device
US8822281B2 (en) 2010-02-23 2014-09-02 Stats Chippac, Ltd. Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
WO2011114774A1 (ja) 2010-03-18 2011-09-22 日本電気株式会社 半導体素子内蔵基板およびその製造方法
JP2011222555A (ja) * 2010-04-02 2011-11-04 Denso Corp 半導体チップ内蔵配線基板の製造方法
US8531027B2 (en) 2010-04-30 2013-09-10 General Electric Company Press-pack module with power overlay interconnection
US8310040B2 (en) 2010-12-08 2012-11-13 General Electric Company Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
US8114712B1 (en) 2010-12-22 2012-02-14 General Electric Company Method for fabricating a semiconductor device package
KR101422437B1 (ko) * 2011-05-13 2014-07-22 이비덴 가부시키가이샤 배선판 및 그 제조 방법
JP5349532B2 (ja) * 2011-05-20 2013-11-20 パナソニック株式会社 部品内蔵モジュールの製造方法
JP5843539B2 (ja) * 2011-09-16 2016-01-13 三菱電機株式会社 半導体装置及び当該半導体装置の製造方法

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