JP2010073838A5 - - Google Patents

Download PDF

Info

Publication number
JP2010073838A5
JP2010073838A5 JP2008238798A JP2008238798A JP2010073838A5 JP 2010073838 A5 JP2010073838 A5 JP 2010073838A5 JP 2008238798 A JP2008238798 A JP 2008238798A JP 2008238798 A JP2008238798 A JP 2008238798A JP 2010073838 A5 JP2010073838 A5 JP 2010073838A5
Authority
JP
Japan
Prior art keywords
resin layer
support plate
connection pad
semiconductor package
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008238798A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010073838A (ja
JP5281346B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008238798A priority Critical patent/JP5281346B2/ja
Priority claimed from JP2008238798A external-priority patent/JP5281346B2/ja
Priority to US12/542,987 priority patent/US20100065959A1/en
Publication of JP2010073838A publication Critical patent/JP2010073838A/ja
Publication of JP2010073838A5 publication Critical patent/JP2010073838A5/ja
Application granted granted Critical
Publication of JP5281346B2 publication Critical patent/JP5281346B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008238798A 2008-09-18 2008-09-18 半導体装置及びその製造方法 Active JP5281346B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008238798A JP5281346B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法
US12/542,987 US20100065959A1 (en) 2008-09-18 2009-08-18 Semiconductor package and method of manufacturing the same, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008238798A JP5281346B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010073838A JP2010073838A (ja) 2010-04-02
JP2010073838A5 true JP2010073838A5 (enExample) 2011-09-15
JP5281346B2 JP5281346B2 (ja) 2013-09-04

Family

ID=42006468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008238798A Active JP5281346B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US20100065959A1 (enExample)
JP (1) JP5281346B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5763887B2 (ja) * 2010-02-24 2015-08-12 千住金属工業株式会社 銅カラム及びその製造方法
JP2012164965A (ja) * 2011-01-21 2012-08-30 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
TWI739182B (zh) * 2019-10-24 2021-09-11 欣興電子股份有限公司 載板結構及其製作方法
CN113035789B (zh) * 2021-02-07 2022-07-05 深圳市星欣磊实业有限公司 一种to封装的高精度夹具及其使用方法
KR20220151431A (ko) 2021-05-06 2022-11-15 삼성전기주식회사 인쇄회로기판
JPWO2023135720A1 (enExample) * 2022-01-14 2023-07-20

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01217993A (ja) * 1988-02-26 1989-08-31 Hitachi Ltd 半導体装置
JP2658672B2 (ja) * 1991-10-11 1997-09-30 日本電気株式会社 Ｉ／ｏピンの修理構造および修理方法
US5288944A (en) * 1992-02-18 1994-02-22 International Business Machines, Inc. Pinned ceramic chip carrier
US5859470A (en) * 1992-11-12 1999-01-12 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device
US5303862A (en) * 1992-12-31 1994-04-19 International Business Machines Corporation Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures
JPH07221104A (ja) * 1994-01-28 1995-08-18 Fujitsu Ltd 半導体装置の製造方法及び半導体装置及び電極ピン形成用マスク及び電極ピン形成用マスクを用いた試験方法
WO1999060831A1 (fr) * 1998-05-19 1999-11-25 Ibiden Co., Ltd. Circuit imprime et son procede de fabrication
JP2000058736A (ja) * 1998-08-07 2000-02-25 Sumitomo Kinzoku Electro Device:Kk 樹脂基板へのピン接続方法
JP3635219B2 (ja) * 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
US6350664B1 (en) * 1999-09-02 2002-02-26 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method of manufacturing the same
JP3378550B2 (ja) * 2000-02-03 2003-02-17 日本特殊陶業株式会社 リードピン付き配線基板
US6660946B2 (en) * 2000-04-10 2003-12-09 Ngk Spark Plug Co., Ltd. Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
US6555757B2 (en) * 2000-04-10 2003-04-29 Ngk Spark Plug Co., Ltd. Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions
JP2004228595A (ja) * 2000-04-10 2004-08-12 Ngk Spark Plug Co Ltd ピン立設樹脂製基板、ピン立設樹脂製基板の製造方法、ピン及びピンの製造方法
TW503546B (en) * 2000-10-13 2002-09-21 Ngk Spark Plug Co Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
TW557559B (en) * 2001-07-27 2003-10-11 Ngk Spark Plug Co Resin-made substrate on which there is installed with a vertically installed pin, manufacturing method thereof, and manufacturing method for pin
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
JP3615727B2 (ja) * 2001-10-31 2005-02-02 新光電気工業株式会社 半導体装置用パッケージ
JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法
TWI255022B (en) * 2004-05-31 2006-05-11 Via Tech Inc Circuit carrier and manufacturing process thereof
JP2008277525A (ja) * 2007-04-27 2008-11-13 Shinko Electric Ind Co Ltd ピン付き基板並びに配線基板および半導体装置

Similar Documents

Publication Publication Date Title
CN103650650B (zh) 印刷电路板及其制造方法
JP2010147153A5 (enExample)
TWI555100B (zh) 晶片尺寸封裝件及其製法
JP2009130104A5 (enExample)
JP2015070269A5 (enExample)
JP2008305937A5 (enExample)
US10745819B2 (en) Printed wiring board, semiconductor package and method for manufacturing printed wiring board
TW201006334A (en) Flex-rigid wiring board and electronic device
JP2010245259A5 (enExample)
JP2010153498A5 (enExample)
JP2010073838A5 (enExample)
JP2009259924A5 (enExample)
JP2011003758A5 (enExample)
JP2012513079A5 (enExample)
JP2014127706A5 (ja) 半導体装置の製造方法
WO2018066462A1 (ja) 半導体チップの実装装置、および、半導体装置の製造方法
JP2014063902A (ja) 半導体ｉｃ内蔵基板及びその製造方法
JP2010118589A5 (ja) 電子部品内蔵配線基板の製造方法、電子部品内蔵配線基板及び半導体装置
JP2009081358A5 (enExample)
JP2017011075A5 (enExample)
JP2016149517A5 (enExample)
TW202015139A (zh) 內埋元件封裝結構及其製造方法
JP2011233915A (ja) 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法
CN103367339A (zh) 芯片封装方法及芯片封装结构
JP5432354B2 (ja) 配線基板製造用の仮基板及びその製造方法