JP5281346B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5281346B2
JP5281346B2 JP2008238798A JP2008238798A JP5281346B2 JP 5281346 B2 JP5281346 B2 JP 5281346B2 JP 2008238798 A JP2008238798 A JP 2008238798A JP 2008238798 A JP2008238798 A JP 2008238798A JP 5281346 B2 JP5281346 B2 JP 5281346B2
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Japan
Prior art keywords
support plate
layer
wiring board
wiring
connection pad
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Application number
JP2008238798A
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English (en)
Japanese (ja)
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JP2010073838A (ja
JP2010073838A5 (enExample
Inventor
章夫 堀内
泰志 横田
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008238798A priority Critical patent/JP5281346B2/ja
Priority to US12/542,987 priority patent/US20100065959A1/en
Publication of JP2010073838A publication Critical patent/JP2010073838A/ja
Publication of JP2010073838A5 publication Critical patent/JP2010073838A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008238798A 2008-09-18 2008-09-18 半導体装置及びその製造方法 Active JP5281346B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008238798A JP5281346B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法
US12/542,987 US20100065959A1 (en) 2008-09-18 2009-08-18 Semiconductor package and method of manufacturing the same, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008238798A JP5281346B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010073838A JP2010073838A (ja) 2010-04-02
JP2010073838A5 JP2010073838A5 (enExample) 2011-09-15
JP5281346B2 true JP5281346B2 (ja) 2013-09-04

Family

ID=42006468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008238798A Active JP5281346B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US20100065959A1 (enExample)
JP (1) JP5281346B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11882652B2 (en) 2021-05-06 2024-01-23 Samsung Electro-Mechanics Co., Ltd. Printed circuit board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5763887B2 (ja) * 2010-02-24 2015-08-12 千住金属工業株式会社 銅カラム及びその製造方法
JP2012164965A (ja) * 2011-01-21 2012-08-30 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
TWI739182B (zh) * 2019-10-24 2021-09-11 欣興電子股份有限公司 載板結構及其製作方法
CN113035789B (zh) * 2021-02-07 2022-07-05 深圳市星欣磊实业有限公司 一种to封装的高精度夹具及其使用方法
JPWO2023135720A1 (enExample) * 2022-01-14 2023-07-20

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Publication number Priority date Publication date Assignee Title
JPH01217993A (ja) * 1988-02-26 1989-08-31 Hitachi Ltd 半導体装置
JP2658672B2 (ja) * 1991-10-11 1997-09-30 日本電気株式会社 Ｉ／ｏピンの修理構造および修理方法
US5288944A (en) * 1992-02-18 1994-02-22 International Business Machines, Inc. Pinned ceramic chip carrier
US5859470A (en) * 1992-11-12 1999-01-12 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device
US5303862A (en) * 1992-12-31 1994-04-19 International Business Machines Corporation Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures
JPH07221104A (ja) * 1994-01-28 1995-08-18 Fujitsu Ltd 半導体装置の製造方法及び半導体装置及び電極ピン形成用マスク及び電極ピン形成用マスクを用いた試験方法
WO1999060831A1 (fr) * 1998-05-19 1999-11-25 Ibiden Co., Ltd. Circuit imprime et son procede de fabrication
JP2000058736A (ja) * 1998-08-07 2000-02-25 Sumitomo Kinzoku Electro Device:Kk 樹脂基板へのピン接続方法
JP3635219B2 (ja) * 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
US6350664B1 (en) * 1999-09-02 2002-02-26 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method of manufacturing the same
JP3378550B2 (ja) * 2000-02-03 2003-02-17 日本特殊陶業株式会社 リードピン付き配線基板
US6660946B2 (en) * 2000-04-10 2003-12-09 Ngk Spark Plug Co., Ltd. Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
US6555757B2 (en) * 2000-04-10 2003-04-29 Ngk Spark Plug Co., Ltd. Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions
JP2004228595A (ja) * 2000-04-10 2004-08-12 Ngk Spark Plug Co Ltd ピン立設樹脂製基板、ピン立設樹脂製基板の製造方法、ピン及びピンの製造方法
TW503546B (en) * 2000-10-13 2002-09-21 Ngk Spark Plug Co Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
TW557559B (en) * 2001-07-27 2003-10-11 Ngk Spark Plug Co Resin-made substrate on which there is installed with a vertically installed pin, manufacturing method thereof, and manufacturing method for pin
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
JP3615727B2 (ja) * 2001-10-31 2005-02-02 新光電気工業株式会社 半導体装置用パッケージ
JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法
TWI255022B (en) * 2004-05-31 2006-05-11 Via Tech Inc Circuit carrier and manufacturing process thereof
JP2008277525A (ja) * 2007-04-27 2008-11-13 Shinko Electric Ind Co Ltd ピン付き基板並びに配線基板および半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11882652B2 (en) 2021-05-06 2024-01-23 Samsung Electro-Mechanics Co., Ltd. Printed circuit board

Also Published As

Publication number Publication date
JP2010073838A (ja) 2010-04-02
US20100065959A1 (en) 2010-03-18

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