JP6594264B2 - 配線基板及び半導体装置、並びにそれらの製造方法 - Google Patents
配線基板及び半導体装置、並びにそれらの製造方法 Download PDFInfo
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- JP6594264B2 JP6594264B2 JP2016113277A JP2016113277A JP6594264B2 JP 6594264 B2 JP6594264 B2 JP 6594264B2 JP 2016113277 A JP2016113277 A JP 2016113277A JP 2016113277 A JP2016113277 A JP 2016113277A JP 6594264 B2 JP6594264 B2 JP 6594264B2
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- insulating layer
- wiring
- layer
- external connection
- connection pad
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
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- Production Of Multi-Layered Print Wiring Board (AREA)
Description
[第1の実施の形態に係る配線基板及び半導体装置の構造]
図1は、第1の実施の形態に係る半導体装置を例示する図であり、図1(a)は断面図、図1(b)は図1(a)のA部の部分拡大断面図、図1(c)は外部接続用パッド近傍の部分縮小底面図である。
次に、第1の実施の形態に係る半導体装置の製造方法について説明する。図2〜図5は、第1の実施の形態に係る半導体装置の製造工程を例示する図である。なお、本実施の形態では、単品の半導体装置を形成する工程を示すが、半導体装置となる複数の部分を作製後、個片化して各半導体装置とする工程としてもよい。
第2の実施の形態では、貫通配線12の側面、絶縁層11の第1凹部11xの内側面、及び絶縁層11の他方の面11bを粗化する例を示す。なお、第2の実施の形態において、既に説明した実施の形態と同一構成部品についての説明は省略する場合がある。
第3の実施の形態では、貫通配線12の一部が逆円錐台形状である例を示す。なお、第3の実施の形態において、既に説明した実施の形態と同一構成部品についての説明は省略する場合がある。
図1に示した配線基板10(図13では実施例として示す)と、比較例に係る配線基板について、反り量のシミュレーション(25℃)を行った。配線基板10の貫通配線12と外部接続用パッド13の材料は銅とした。
1S 積層体
10 配線基板
11、15、17 絶縁層
11a 絶縁層11の一方の面
11b 絶縁層11の他方の面
11x 第1凹部
12 貫通配線
13 外部接続用パッド
13x 第2凹部
14、16、18 配線層
15x、17x ビアホール
20 半導体チップ
30 封止樹脂
40 バンプ
111 補強材
121、122、310 金属層
201 電極
300 支持体
320 レジスト層
320x 開口部
Claims (10)
- 補強材を備えた非感光性樹脂からなる単層の第1絶縁層と、
前記第1絶縁層の一方の面に配線層と絶縁層が積層された積層体と、
前記第1絶縁層の他方の面に形成された外部接続用パッドと、
前記第1絶縁層を貫通する貫通配線と、を有し、
前記補強材の中心位置は、前記第1絶縁層の厚さ方向の中心位置よりも前記第1絶縁層の一方の面側に偏在しており、
前記貫通配線の一端面は、前記第1絶縁層の一方の面から露出して前記配線層と接続され、
前記貫通配線の他端面は、前記第1絶縁層の他方の面から窪んだ位置に露出し、前記貫通配線の他端面が底面をなし前記第1絶縁層が内側面をなす第1凹部を形成し、
前記第1絶縁層の他方の面には、前記外部接続用パッドのみが形成され、
前記外部接続用パッドは、前記第1凹部の底面及び内側面に沿って形成され、前記内側面から前記第1凹部の周囲に位置する前記第1絶縁層の他方の面に延在し、
前記外部接続用パッドの前記第1絶縁層の他方の面に延在する部分の内側には、前記貫通配線側に窪む第2凹部が形成されている配線基板。 - 前記第1絶縁層の一方の面と前記貫通配線の一端面は研磨面かつ面一である請求項1に記載の配線基板。
- 前記積層体を構成する前記絶縁層は感光性樹脂からなり、
前記積層体を構成する前記配線層は微細配線層である請求項1又は2に記載の配線基板。 - 前記第1絶縁層の一方の面は、前記第1絶縁層の他方の面よりも平滑である請求項1乃至3の何れか一項に記載の配線基板。
- 前記補強材の中心位置は、前記第1絶縁層と前記積層体とを合わせた部分の厚さ方向の中心に位置している請求項1乃至4の何れか一項に記載の配線基板。
- 前記貫通配線の側面、前記第1絶縁層の第1凹部の内側面、及び前記第1絶縁層の他方の面は、粗化面である請求項1乃至5の何れか一項に記載の配線基板。
- 請求項1乃至6の何れか一項に記載の配線基板と、
前記積層体上に搭載され、前記積層体の最上の配線層と接続された半導体チップと、
前記積層体上に形成され、前記半導体チップを封止する封止樹脂と、を有する半導体装置。 - 支持体の一方の面に金属層及び貫通配線を積層形成する工程と、
前記支持体の一方の面に、補強材を備えた非感光性樹脂からなる単層の第1絶縁層を、前記金属層の側面並びに前記貫通配線の一端面及び側面を被覆するように形成する工程と、
前記第1絶縁層の一方の面を研磨し、前記第1絶縁層の一方の面から前記貫通配線の一端面を露出させると共に、前記補強材の中心位置を前記第1絶縁層の厚さ方向の中心位置よりも前記第1絶縁層の一方の面側に偏在させる工程と、
前記第1絶縁層の一方の面に配線層と絶縁層が積層された積層体を形成する工程と、
前記支持体を除去する工程と、
前記金属層を除去し、前記貫通配線の他端面を前記第1絶縁層の他方の面から窪んだ位置に露出させ、前記貫通配線の他端面が底面をなし前記第1絶縁層が内側面をなす第1凹部を形成する工程と、
前記第1絶縁層の他方の面に外部接続用パッドを形成する工程と、を有し、
前記外部接続用パッドを形成する工程では、
前記第1絶縁層の他方の面に前記外部接続用パッドのみが形成され、
前記外部接続用パッドは、前記第1凹部の底面及び内側面に沿って形成され、前記内側面から前記第1凹部の周囲に位置する前記第1絶縁層の他方の面に延在し、
前記外部接続用パッドの前記第1絶縁層の他方の面に延在する部分の内側には、前記貫通配線側に窪む第2凹部が形成される配線基板の製造方法。 - 前記貫通配線を積層形成する工程と、前記支持体の一方の面に前記第1絶縁層を形成する工程との間に、
前記支持体の一方の面、前記金属層の側面、並びに前記貫通配線の一端面及び側面を粗化する工程を有し、
前記支持体を除去する工程では、前記粗化する工程で前記支持体の一方の面に形成された凹凸が前記第1絶縁層の他方の面に転写される請求項8に記載の配線基板の製造方法。 - 請求項8又は9に記載の配線基板の製造方法において、
前記積層体を形成する工程から前記支持体を除去する工程の間に、更に、
前記積層体上に、前記積層体の最上の配線層と接続された半導体チップを搭載する工程と、
前記積層体上に、前記半導体チップを封止する封止樹脂を形成する工程と、を有する半導体装置の製造方法。
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