JP2014503997A5 - - Google Patents
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- Publication number
- JP2014503997A5 JP2014503997A5 JP2013540265A JP2013540265A JP2014503997A5 JP 2014503997 A5 JP2014503997 A5 JP 2014503997A5 JP 2013540265 A JP2013540265 A JP 2013540265A JP 2013540265 A JP2013540265 A JP 2013540265A JP 2014503997 A5 JP2014503997 A5 JP 2014503997A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electronic device
- semi
- finished product
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 36
- 239000011265 semifinished product Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 12
- 239000004020 conductor Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000003825 pressing Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 239000012792 core layer Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010060855A DE102010060855A1 (de) | 2010-11-29 | 2010-11-29 | Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil |
| DE102010060855.6 | 2010-11-29 | ||
| PCT/EP2011/005912 WO2012072212A2 (de) | 2010-11-29 | 2011-11-24 | Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014503997A JP2014503997A (ja) | 2014-02-13 |
| JP2014503997A5 true JP2014503997A5 (enExample) | 2014-11-20 |
| JP5767338B2 JP5767338B2 (ja) | 2015-08-19 |
Family
ID=45390054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013540265A Active JP5767338B2 (ja) | 2010-11-29 | 2011-11-24 | 電子デバイス、その製作方法、及び電子デバイスを備えているプリント基板 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8811019B2 (enExample) |
| EP (1) | EP2524394B1 (enExample) |
| JP (1) | JP5767338B2 (enExample) |
| CN (1) | CN103339726B (enExample) |
| BR (1) | BR112013015289B1 (enExample) |
| DE (2) | DE102010060855A1 (enExample) |
| RU (1) | RU2556274C2 (enExample) |
| WO (1) | WO2012072212A2 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011105346A1 (de) | 2011-06-21 | 2012-12-27 | Schweizer Electronic Ag | Elektronische Baugruppe und Verfahren zu deren Herstellung |
| CN203013703U (zh) * | 2012-12-17 | 2013-06-19 | 中怡(苏州)科技有限公司 | 散热元件及应用该散热元件的通讯装置 |
| DE102013102541A1 (de) * | 2013-03-13 | 2014-09-18 | Schweizer Electronic Ag | Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil |
| DE102013102542A1 (de) * | 2013-03-13 | 2014-09-18 | Schweizer Electronic Ag | Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils |
| AT515069B1 (de) * | 2013-11-07 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Leiterplattenstruktur |
| RU2579434C2 (ru) * | 2014-03-19 | 2016-04-10 | Михаил Юрьевич Гончаров | Планарный индуктивный элемент и способ отвода тепла от его обмоток |
| DE102014008148B4 (de) * | 2014-05-23 | 2020-06-04 | Continental Automotive Gmbh | Verfahren zur Herstellung einer Leiterplatte und Leiterplatte |
| EP2988328B1 (en) * | 2014-08-19 | 2021-05-12 | ABB Schweiz AG | Power semiconductor module and method of manufacturing the same |
| DE102015200989A1 (de) * | 2015-01-22 | 2016-07-28 | Robert Bosch Gmbh | Verbindungsanordnung zwischen einem Trägerelement und einem elektronischen Schaltungsbauteil und Schaltungsträger |
| RU2602835C9 (ru) * | 2015-05-13 | 2017-02-02 | Акционерное общество "Концерн радиостроения "Вега" | Способ экранирования в электронном модуле |
| JP6501638B2 (ja) * | 2015-06-11 | 2019-04-17 | オムロンオートモーティブエレクトロニクス株式会社 | 電子装置 |
| US20170325327A1 (en) * | 2016-04-07 | 2017-11-09 | Massachusetts Institute Of Technology | Printed circuit board for high power components |
| WO2018001983A1 (en) | 2016-06-28 | 2018-01-04 | Abb Schweiz Ag | Cooled electronics package with stacked power electronics components |
| DE102017208147B4 (de) | 2017-05-15 | 2021-12-30 | Schweizer Electronic Ag | Elektronisches Bauteil und Leiterplatte mit diesem elektronischen Bauteil |
| RU2677633C1 (ru) * | 2017-12-12 | 2019-01-18 | Федеральное государственное унитарное предприятие "Научно-производственный центр автоматики и приборостроения имени академика Н.А. Пилюгина" (ФГУП "НПЦАП") | Конструкция многослойных печатных плат со встроенным теплоотводом |
| CN111200899B (zh) * | 2018-11-20 | 2023-09-15 | 奥特斯科技(重庆)有限公司 | 部件承载件及制造该部件承载件的方法 |
| CN111372369B (zh) | 2018-12-25 | 2023-07-07 | 奥特斯科技(重庆)有限公司 | 具有部件屏蔽的部件承载件及其制造方法 |
| WO2020239221A1 (en) * | 2019-05-29 | 2020-12-03 | Huawei Technologies Co., Ltd. | Integrated component and porwer switching device |
| EP3809805A1 (en) * | 2019-10-14 | 2021-04-21 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| US11632860B2 (en) | 2019-10-25 | 2023-04-18 | Infineon Technologies Ag | Power electronic assembly and method of producing thereof |
| DE102020132808B4 (de) | 2020-12-09 | 2023-03-09 | Schweizer Electronic Aktiengesellschaft | Leiterplattenmodul, Leiterplatte, Kühlkörper und Wärmeleitelement |
| WO2022190316A1 (ja) | 2021-03-11 | 2022-09-15 | 株式会社メイコー | 記憶装置及び記憶装置モジュール |
| WO2022215381A1 (ja) * | 2021-04-09 | 2022-10-13 | 株式会社村田製作所 | 接続構造およびアンテナモジュール |
| CN115707169A (zh) * | 2021-08-06 | 2023-02-17 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法和用途以及布置结构 |
| DE102022135026B3 (de) | 2022-12-30 | 2024-01-25 | Schweizer Electronic Ag | Leistungselektronisches Modul, leistungselektronischer Modulblock, Leiterplatte mit leistungselektronischem Modul bzw. Leiterplattenbauelement und Verfahren zur Herstellung eines leistungselektronischen Moduls |
| EP4622399A1 (en) * | 2024-03-21 | 2025-09-24 | ZF CV Systems Global GmbH | Printed circuit board, electrical circuit assembly and methods of producing a printed circuit board and an electrical circuit assembly |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4200900A (en) * | 1978-06-30 | 1980-04-29 | Robertshaw Controls Company | Circuit board arrangement |
| JPS57128994A (en) * | 1981-02-02 | 1982-08-10 | Nippon Electric Co | Lsi mounting structure |
| CH687490A5 (de) * | 1992-03-25 | 1996-12-13 | Dyconex Ag | Leiterplattenverstaerkung. |
| US5278724A (en) * | 1992-07-06 | 1994-01-11 | International Business Machines Corporation | Electronic package and method of making same |
| JP3764214B2 (ja) * | 1996-08-12 | 2006-04-05 | 株式会社東芝 | プリント回路基板およびこれを備えた電子機器 |
| RU2176134C2 (ru) * | 1998-07-02 | 2001-11-20 | Закрытое акционерное общество "Техно-ТМ" | Трехмерный электронный модуль и способ его изготовления |
| US6368894B1 (en) * | 1999-09-08 | 2002-04-09 | Ming-Tung Shen | Multi-chip semiconductor module and manufacturing process thereof |
| JP2001085804A (ja) * | 1999-09-17 | 2001-03-30 | Sony Corp | プリント配線板およびその製造方法 |
| JP2002216934A (ja) * | 2001-01-22 | 2002-08-02 | Sumitomo Electric Ind Ltd | ヒータモジュール及び光導波路モジュール |
| TW557521B (en) * | 2002-01-16 | 2003-10-11 | Via Tech Inc | Integrated circuit package and its manufacturing process |
| JP2004079736A (ja) * | 2002-08-15 | 2004-03-11 | Sony Corp | チップ内蔵基板装置及びその製造方法 |
| KR100726240B1 (ko) * | 2005-10-04 | 2007-06-11 | 삼성전기주식회사 | 전자소자 내장 인쇄회로기판 및 그 제조방법 |
| NL1031206C2 (nl) * | 2006-02-22 | 2007-08-24 | Thales Nederland Bv | Vlakke warmtebuis voor koeldoeleinden. |
| US7759777B2 (en) | 2007-04-16 | 2010-07-20 | Infineon Technologies Ag | Semiconductor module |
| US8507320B2 (en) | 2008-03-18 | 2013-08-13 | Infineon Technologies Ag | Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof |
| TWI458400B (zh) * | 2008-10-31 | 2014-10-21 | 太陽誘電股份有限公司 | Printed circuit board and manufacturing method thereof |
-
2010
- 2010-11-29 DE DE102010060855A patent/DE102010060855A1/de not_active Withdrawn
-
2011
- 2011-11-24 WO PCT/EP2011/005912 patent/WO2012072212A2/de not_active Ceased
- 2011-11-24 BR BR112013015289-3A patent/BR112013015289B1/pt not_active IP Right Cessation
- 2011-11-24 JP JP2013540265A patent/JP5767338B2/ja active Active
- 2011-11-24 EP EP11799363.4A patent/EP2524394B1/de active Active
- 2011-11-24 RU RU2013128431/28A patent/RU2556274C2/ru active
- 2011-11-24 US US13/885,437 patent/US8811019B2/en active Active
- 2011-11-24 DE DE202011110023U patent/DE202011110023U1/de not_active Expired - Lifetime
- 2011-11-24 CN CN201180065944.1A patent/CN103339726B/zh active Active
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