RU2556274C2 - Электронное устройство, способ его изготовления и печатная плата, содержащая электронное устройство - Google Patents

Электронное устройство, способ его изготовления и печатная плата, содержащая электронное устройство Download PDF

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Publication number
RU2556274C2
RU2556274C2 RU2013128431/28A RU2013128431A RU2556274C2 RU 2556274 C2 RU2556274 C2 RU 2556274C2 RU 2013128431/28 A RU2013128431/28 A RU 2013128431/28A RU 2013128431 A RU2013128431 A RU 2013128431A RU 2556274 C2 RU2556274 C2 RU 2556274C2
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Russia
Prior art keywords
layer
electronic device
component
circuit board
electrically conductive
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RU2013128431/28A
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English (en)
Russian (ru)
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RU2013128431A (ru
Inventor
Кристиан РЁССЛЕ
Томас ГОТВАЛЬД
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Швайцер Электроник Аг
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
RU2013128431/28A 2010-11-29 2011-11-24 Электронное устройство, способ его изготовления и печатная плата, содержащая электронное устройство RU2556274C2 (ru)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10210060855.6 2010-11-29
DE102010060855A DE102010060855A1 (de) 2010-11-29 2010-11-29 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil
DE102010060855.6 2010-11-29
PCT/EP2011/005912 WO2012072212A2 (de) 2010-11-29 2011-11-24 Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil

Publications (2)

Publication Number Publication Date
RU2013128431A RU2013128431A (ru) 2015-01-10
RU2556274C2 true RU2556274C2 (ru) 2015-07-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
RU2013128431/28A RU2556274C2 (ru) 2010-11-29 2011-11-24 Электронное устройство, способ его изготовления и печатная плата, содержащая электронное устройство

Country Status (8)

Country Link
US (1) US8811019B2 (enExample)
EP (1) EP2524394B1 (enExample)
JP (1) JP5767338B2 (enExample)
CN (1) CN103339726B (enExample)
BR (1) BR112013015289B1 (enExample)
DE (2) DE102010060855A1 (enExample)
RU (1) RU2556274C2 (enExample)
WO (1) WO2012072212A2 (enExample)

Cited By (1)

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RU2677633C1 (ru) * 2017-12-12 2019-01-18 Федеральное государственное унитарное предприятие "Научно-производственный центр автоматики и приборостроения имени академика Н.А. Пилюгина" (ФГУП "НПЦАП") Конструкция многослойных печатных плат со встроенным теплоотводом

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DE102011105346A1 (de) 2011-06-21 2012-12-27 Schweizer Electronic Ag Elektronische Baugruppe und Verfahren zu deren Herstellung
CN203013703U (zh) * 2012-12-17 2013-06-19 中怡(苏州)科技有限公司 散热元件及应用该散热元件的通讯装置
DE102013102541A1 (de) 2013-03-13 2014-09-18 Schweizer Electronic Ag Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil
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RU2579434C2 (ru) * 2014-03-19 2016-04-10 Михаил Юрьевич Гончаров Планарный индуктивный элемент и способ отвода тепла от его обмоток
DE102014008148B4 (de) * 2014-05-23 2020-06-04 Continental Automotive Gmbh Verfahren zur Herstellung einer Leiterplatte und Leiterplatte
EP2988328B1 (en) * 2014-08-19 2021-05-12 ABB Schweiz AG Power semiconductor module and method of manufacturing the same
DE102015200989A1 (de) * 2015-01-22 2016-07-28 Robert Bosch Gmbh Verbindungsanordnung zwischen einem Trägerelement und einem elektronischen Schaltungsbauteil und Schaltungsträger
RU2602835C9 (ru) * 2015-05-13 2017-02-02 Акционерное общество "Концерн радиостроения "Вега" Способ экранирования в электронном модуле
JP6501638B2 (ja) * 2015-06-11 2019-04-17 オムロンオートモーティブエレクトロニクス株式会社 電子装置
US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
WO2018001983A1 (en) 2016-06-28 2018-01-04 Abb Schweiz Ag Cooled electronics package with stacked power electronics components
DE102017208147B4 (de) 2017-05-15 2021-12-30 Schweizer Electronic Ag Elektronisches Bauteil und Leiterplatte mit diesem elektronischen Bauteil
CN111200899B (zh) * 2018-11-20 2023-09-15 奥特斯科技(重庆)有限公司 部件承载件及制造该部件承载件的方法
CN111372369B (zh) 2018-12-25 2023-07-07 奥特斯科技(重庆)有限公司 具有部件屏蔽的部件承载件及其制造方法
CN113196473A (zh) * 2019-05-29 2021-07-30 华为技术有限公司 集成部件和电力转换装置
EP3809805B1 (en) * 2019-10-14 2026-03-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier and method of manufacturing the same
US11632860B2 (en) 2019-10-25 2023-04-18 Infineon Technologies Ag Power electronic assembly and method of producing thereof
DE102020132808B4 (de) 2020-12-09 2023-03-09 Schweizer Electronic Aktiengesellschaft Leiterplattenmodul, Leiterplatte, Kühlkörper und Wärmeleitelement
US12009282B2 (en) 2021-03-11 2024-06-11 Meiko Electronics Co., Ltd. Memory device and memory device module
WO2022215381A1 (ja) * 2021-04-09 2022-10-13 株式会社村田製作所 接続構造およびアンテナモジュール
CN115707169A (zh) * 2021-08-06 2023-02-17 奥特斯(中国)有限公司 部件承载件及其制造方法和用途以及布置结构
DE102022135026B3 (de) 2022-12-30 2024-01-25 Schweizer Electronic Ag Leistungselektronisches Modul, leistungselektronischer Modulblock, Leiterplatte mit leistungselektronischem Modul bzw. Leiterplattenbauelement und Verfahren zur Herstellung eines leistungselektronischen Moduls
TW202534274A (zh) * 2024-02-19 2025-09-01 聚鼎科技股份有限公司 導熱元件
EP4622399A1 (en) * 2024-03-21 2025-09-24 ZF CV Systems Global GmbH Printed circuit board, electrical circuit assembly and methods of producing a printed circuit board and an electrical circuit assembly
CN119815730A (zh) * 2024-12-30 2025-04-11 胜伟策电子(江苏)有限公司 一种高绝缘电路板的制造方法及高绝缘电路板

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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
US20130329370A1 (en) 2013-12-12
EP2524394A2 (de) 2012-11-21
BR112013015289B1 (pt) 2020-10-06
JP2014503997A (ja) 2014-02-13
BR112013015289A2 (pt) 2018-05-15
DE202011110023U1 (de) 2013-01-03
JP5767338B2 (ja) 2015-08-19
DE102010060855A1 (de) 2012-05-31
US8811019B2 (en) 2014-08-19
CN103339726B (zh) 2014-12-31
WO2012072212A2 (de) 2012-06-07
WO2012072212A3 (de) 2012-09-07
RU2013128431A (ru) 2015-01-10
EP2524394B1 (de) 2013-07-31
CN103339726A (zh) 2013-10-02

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