CN104681520A - 嵌入式半导体装置封装及其制造方法 - Google Patents

嵌入式半导体装置封装及其制造方法 Download PDF

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Publication number
CN104681520A
CN104681520A CN201410848599.4A CN201410848599A CN104681520A CN 104681520 A CN104681520 A CN 104681520A CN 201410848599 A CN201410848599 A CN 201410848599A CN 104681520 A CN104681520 A CN 104681520A
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China
Prior art keywords
dielectric
semiconductor device
dielectric layer
package structure
encapsulating structure
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CN201410848599.4A
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English (en)
Chinese (zh)
Inventor
S·S·乔罕
P·A·麦康奈利
A·V·高达
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General Electric Co
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General Electric Co
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Publication of CN104681520A publication Critical patent/CN104681520A/zh
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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CN106601701A (zh) * 2017-01-19 2017-04-26 贵州煜立电子科技有限公司 大功率二端表面引出脚电子元器件立体封装方法及结构
CN107622988A (zh) * 2016-07-13 2018-01-23 通用电气公司 嵌入式干膜电池模块及其制造方法
CN110600440A (zh) * 2019-05-13 2019-12-20 华为技术有限公司 一种埋入式封装结构及其制备方法、终端
CN111564414A (zh) * 2019-12-12 2020-08-21 奥特斯(中国)有限公司 部件承载件及制造部件承载件的方法
CN113632223A (zh) * 2019-03-25 2021-11-09 三菱电机株式会社 具有厚导电层的电力组件
CN113937086A (zh) * 2020-07-14 2022-01-14 Gan系统公司 功率半导体器件的嵌入式裸片封装
CN119993913A (zh) * 2025-04-15 2025-05-13 江苏长晶科技股份有限公司 芯片封装方法、芯片结构及电子设备

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CN103857210A (zh) * 2012-11-28 2014-06-11 宏启胜精密电子(秦皇岛)有限公司 承载电路板、承载电路板的制作方法及封装结构
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