JP6587792B2 - 埋め込み型半導体デバイスパッケージおよびその製造方法 - Google Patents

埋め込み型半導体デバイスパッケージおよびその製造方法 Download PDF

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Publication number
JP6587792B2
JP6587792B2 JP2014192072A JP2014192072A JP6587792B2 JP 6587792 B2 JP6587792 B2 JP 6587792B2 JP 2014192072 A JP2014192072 A JP 2014192072A JP 2014192072 A JP2014192072 A JP 2014192072A JP 6587792 B2 JP6587792 B2 JP 6587792B2
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Prior art keywords
dielectric
semiconductor device
package structure
dielectric layer
layer
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Japanese (ja)
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JP2015070269A5 (enExample
JP2015070269A (ja
Inventor
シャクティ・シン・チャウハン
ポール・アラン・マックコネリー
アルン・ヴィルパクシャ・ゴウダ
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General Electric Co
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General Electric Co
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Classifications

    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H10W20/42—
    • H10W20/43—
    • H10W20/4421—
    • H10W20/47—
    • H10W40/00—
    • H10W40/22—
    • H10W40/228—
    • H10W40/258—
    • H10W42/276—
    • H10W70/611—
    • H10W70/65—
    • H10W72/30—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H10W40/70—
    • H10W40/77—
    • H10W70/093—
    • H10W70/60—
    • H10W70/635—
    • H10W72/01323—
    • H10W72/01333—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/07323—
    • H10W72/07338—
    • H10W72/241—
    • H10W72/352—
    • H10W72/354—
    • H10W72/874—
    • H10W72/9413—
    • H10W72/944—
    • H10W74/00—
    • H10W90/00—
    • H10W90/10—
    • H10W90/734—
    • H10W90/736—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
JP2014192072A 2013-09-26 2014-09-22 埋め込み型半導体デバイスパッケージおよびその製造方法 Active JP6587792B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/037,728 US9209151B2 (en) 2013-09-26 2013-09-26 Embedded semiconductor device package and method of manufacturing thereof
US14/037,728 2013-09-26

Publications (3)

Publication Number Publication Date
JP2015070269A JP2015070269A (ja) 2015-04-13
JP2015070269A5 JP2015070269A5 (enExample) 2017-10-19
JP6587792B2 true JP6587792B2 (ja) 2019-10-09

Family

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JP2014192072A Active JP6587792B2 (ja) 2013-09-26 2014-09-22 埋め込み型半導体デバイスパッケージおよびその製造方法

Country Status (6)

Country Link
US (2) US9209151B2 (enExample)
EP (1) EP2854168A3 (enExample)
JP (1) JP6587792B2 (enExample)
KR (1) KR102295990B1 (enExample)
CN (1) CN104681520A (enExample)
TW (2) TWI679737B (enExample)

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EP2854168A2 (en) 2015-04-01
TWI679737B (zh) 2019-12-11
US20150380356A1 (en) 2015-12-31
KR102295990B1 (ko) 2021-09-02
JP2015070269A (ja) 2015-04-13
US9209151B2 (en) 2015-12-08
US9391027B2 (en) 2016-07-12
EP2854168A3 (en) 2015-08-05
TW201523821A (zh) 2015-06-16
US20150084207A1 (en) 2015-03-26

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