JP2013243345A5 - - Google Patents

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Publication number
JP2013243345A5
JP2013243345A5 JP2013057468A JP2013057468A JP2013243345A5 JP 2013243345 A5 JP2013243345 A5 JP 2013243345A5 JP 2013057468 A JP2013057468 A JP 2013057468A JP 2013057468 A JP2013057468 A JP 2013057468A JP 2013243345 A5 JP2013243345 A5 JP 2013243345A5
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Japan
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laminate
layer
uncut
die
adhesive material
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JP2013057468A
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Japanese (ja)
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JP6342120B2 (ja
JP2013243345A (ja
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Priority claimed from US13/431,168 external-priority patent/US8658473B2/en
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JP2013057468A 2012-03-27 2013-03-21 超薄埋設ダイモジュール及びその製造方法 Active JP6342120B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/431,168 US8658473B2 (en) 2012-03-27 2012-03-27 Ultrathin buried die module and method of manufacturing thereof
US13/431,168 2012-03-27

Publications (3)

Publication Number Publication Date
JP2013243345A JP2013243345A (ja) 2013-12-05
JP2013243345A5 true JP2013243345A5 (enExample) 2017-09-21
JP6342120B2 JP6342120B2 (ja) 2018-06-13

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JP2013057468A Active JP6342120B2 (ja) 2012-03-27 2013-03-21 超薄埋設ダイモジュール及びその製造方法

Country Status (7)

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US (2) US8658473B2 (enExample)
EP (1) EP2672789B1 (enExample)
JP (1) JP6342120B2 (enExample)
KR (1) KR102071522B1 (enExample)
CN (2) CN103367169B (enExample)
SG (1) SG193756A1 (enExample)
TW (1) TWI593030B (enExample)

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