TWI634632B - 嵌入式半導體裝置封裝及其製造方法 - Google Patents

嵌入式半導體裝置封裝及其製造方法 Download PDF

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Publication number
TWI634632B
TWI634632B TW103131743A TW103131743A TWI634632B TW I634632 B TWI634632 B TW I634632B TW 103131743 A TW103131743 A TW 103131743A TW 103131743 A TW103131743 A TW 103131743A TW I634632 B TWI634632 B TW I634632B
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Taiwan
Prior art keywords
semiconductor device
dielectric
layer
dielectric layer
package structure
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TW103131743A
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English (en)
Chinese (zh)
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TW201523821A (zh
Inventor
Shakti Singh Chauhan
夏可堤 喬漢
Paul Alan Mcconnelee
保羅 麥可隆尼
Arun Virupaksha Gowda
艾倫 格達
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General Electric Company
通用電機股份有限公司
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Publication of TW201523821A publication Critical patent/TW201523821A/zh
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Publication of TWI634632B publication Critical patent/TWI634632B/zh

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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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    • H05K3/46—Manufacturing multilayer circuits
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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
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TWI474450B (zh) * 2013-09-27 2015-02-21 旭德科技股份有限公司 封裝載板及其製作方法
US9704781B2 (en) 2013-11-19 2017-07-11 Micron Technology, Inc. Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
KR102042137B1 (ko) * 2014-05-30 2019-11-28 한국전자통신연구원 전자장치 및 그 제조 방법
JP2015228455A (ja) * 2014-06-02 2015-12-17 株式会社東芝 半導体装置及びその製造方法
US20150366081A1 (en) * 2014-06-15 2015-12-17 Unimicron Technology Corp. Manufacturing method for circuit structure embedded with electronic device
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
CN207166882U (zh) * 2014-10-16 2018-03-30 株式会社村田制作所 复合器件
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