JP2014158035A5 - - Google Patents
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- JP2014158035A5 JP2014158035A5 JP2014061971A JP2014061971A JP2014158035A5 JP 2014158035 A5 JP2014158035 A5 JP 2014158035A5 JP 2014061971 A JP2014061971 A JP 2014061971A JP 2014061971 A JP2014061971 A JP 2014061971A JP 2014158035 A5 JP2014158035 A5 JP 2014158035A5
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 claims 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- XMGQYMWWDOXHJM-JTQLQIEISA-N D-limonene Natural products CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 claims 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229940069096 dodecene Drugs 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37151710P | 2010-08-06 | 2010-08-06 | |
| US61/371,517 | 2010-08-06 | ||
| US13/198,294 US9263314B2 (en) | 2010-08-06 | 2011-08-04 | Multiple bonding layers for thin-wafer handling |
| US13/198,294 | 2011-08-04 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013523362A Division JP5972874B2 (ja) | 2010-08-06 | 2011-08-05 | 薄ウェーハーハンドリングのための多層接合層 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016195647A Division JP2016225662A (ja) | 2010-08-06 | 2016-10-03 | 薄ウェーハハンドリングのための多層接合層 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014158035A JP2014158035A (ja) | 2014-08-28 |
| JP2014158035A5 true JP2014158035A5 (enExample) | 2014-10-09 |
| JP6066105B2 JP6066105B2 (ja) | 2017-01-25 |
Family
ID=45556370
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013523362A Active JP5972874B2 (ja) | 2010-08-06 | 2011-08-05 | 薄ウェーハーハンドリングのための多層接合層 |
| JP2014061971A Active JP6066105B2 (ja) | 2010-08-06 | 2014-03-25 | 薄ウェーハハンドリングのための多層接合層 |
| JP2015256806A Pending JP2016106403A (ja) | 2010-08-06 | 2015-12-28 | 薄ウェーハーハンドリングのための多層接合層 |
| JP2016195647A Pending JP2016225662A (ja) | 2010-08-06 | 2016-10-03 | 薄ウェーハハンドリングのための多層接合層 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013523362A Active JP5972874B2 (ja) | 2010-08-06 | 2011-08-05 | 薄ウェーハーハンドリングのための多層接合層 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015256806A Pending JP2016106403A (ja) | 2010-08-06 | 2015-12-28 | 薄ウェーハーハンドリングのための多層接合層 |
| JP2016195647A Pending JP2016225662A (ja) | 2010-08-06 | 2016-10-03 | 薄ウェーハハンドリングのための多層接合層 |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US9263314B2 (enExample) |
| EP (3) | EP2601676B1 (enExample) |
| JP (4) | JP5972874B2 (enExample) |
| KR (3) | KR101900517B1 (enExample) |
| CN (2) | CN104022016B (enExample) |
| SG (4) | SG2014014922A (enExample) |
| TW (3) | TWI604520B (enExample) |
| WO (1) | WO2012057893A2 (enExample) |
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| EP2810300A4 (en) * | 2012-01-30 | 2016-05-11 | 3M Innovative Properties Co | DEVICE, HYBRID LAMINATED BODY, METHOD AND MATERIALS FOR TEMPORARY SUBSTRATE CARRIER |
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| US8999817B2 (en) * | 2012-02-28 | 2015-04-07 | Shin-Etsu Chemical Co., Ltd. | Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer |
| KR102063559B1 (ko) * | 2012-03-20 | 2020-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 일시적 기재 지지체 및 지지체 분리를 위한 적층체, 방법, 및 재료 |
| JP5983519B2 (ja) | 2012-04-24 | 2016-08-31 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
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2011
- 2011-08-04 US US13/198,294 patent/US9263314B2/en active Active
- 2011-08-05 KR KR1020137005496A patent/KR101900517B1/ko active Active
- 2011-08-05 KR KR1020147003864A patent/KR20140039330A/ko not_active Ceased
- 2011-08-05 EP EP11836791.1A patent/EP2601676B1/en active Active
- 2011-08-05 CN CN201410147263.5A patent/CN104022016B/zh active Active
- 2011-08-05 JP JP2013523362A patent/JP5972874B2/ja active Active
- 2011-08-05 CN CN201180047933.0A patent/CN103155100B/zh active Active
- 2011-08-05 SG SG2014014922A patent/SG2014014922A/en unknown
- 2011-08-05 SG SG2013009121A patent/SG187739A1/en unknown
- 2011-08-05 WO PCT/US2011/046751 patent/WO2012057893A2/en not_active Ceased
- 2011-08-05 KR KR1020177011582A patent/KR101913522B1/ko active Active
- 2011-08-05 EP EP14154702.6A patent/EP2733734B1/en active Active
- 2011-08-05 SG SG10201509693YA patent/SG10201509693YA/en unknown
- 2011-08-05 EP EP15190802.7A patent/EP2996140A3/en not_active Withdrawn
- 2011-08-05 SG SG10201506168WA patent/SG10201506168WA/en unknown
- 2011-08-08 TW TW100128146A patent/TWI604520B/zh active
- 2011-08-08 TW TW103122762A patent/TWI505347B/zh active
- 2011-08-08 TW TW104127546A patent/TW201545227A/zh unknown
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2014
- 2014-02-27 US US14/191,544 patent/US9224631B2/en active Active
- 2014-03-25 JP JP2014061971A patent/JP6066105B2/ja active Active
- 2014-05-08 US US14/273,369 patent/US9472436B2/en active Active
- 2014-11-21 US US14/550,008 patent/US20150122426A1/en not_active Abandoned
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2015
- 2015-12-28 JP JP2015256806A patent/JP2016106403A/ja active Pending
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2016
- 2016-10-03 JP JP2016195647A patent/JP2016225662A/ja active Pending
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