JP2016518702A5 - - Google Patents
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- Publication number
- JP2016518702A5 JP2016518702A5 JP2016501422A JP2016501422A JP2016518702A5 JP 2016518702 A5 JP2016518702 A5 JP 2016518702A5 JP 2016501422 A JP2016501422 A JP 2016501422A JP 2016501422 A JP2016501422 A JP 2016501422A JP 2016518702 A5 JP2016518702 A5 JP 2016518702A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- capacitor
- dielectric
- plate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 30
- 239000003990 capacitor Substances 0.000 claims 18
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 239000011521 glass Substances 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/833,632 | 2013-03-15 | ||
| US13/833,632 US9935166B2 (en) | 2013-03-15 | 2013-03-15 | Capacitor with a dielectric between a via and a plate of the capacitor |
| PCT/US2014/024118 WO2014150747A1 (en) | 2013-03-15 | 2014-03-12 | Capacitor with a dielectric between a via and a plate of the capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016518702A JP2016518702A (ja) | 2016-06-23 |
| JP2016518702A5 true JP2016518702A5 (enExample) | 2017-03-30 |
Family
ID=50625088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016501422A Pending JP2016518702A (ja) | 2013-03-15 | 2014-03-12 | ビアとコンデンサのプレートとの間に誘電体を有するコンデンサ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9935166B2 (enExample) |
| EP (1) | EP2973693B1 (enExample) |
| JP (1) | JP2016518702A (enExample) |
| KR (1) | KR20150130516A (enExample) |
| CN (1) | CN105009280B (enExample) |
| WO (1) | WO2014150747A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9267653B2 (en) | 2013-05-16 | 2016-02-23 | Mckeon Products, Inc. | Light fixture with communication or power connector |
| US10480774B2 (en) | 2013-05-16 | 2019-11-19 | Mckeon Products, Inc. | Light emitter with communication or power connector |
| US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
| JP6657609B2 (ja) * | 2015-06-12 | 2020-03-04 | 凸版印刷株式会社 | 配線回路基板、半導体装置、配線回路基板の製造方法および半導体装置の製造方法 |
| US9954267B2 (en) | 2015-12-28 | 2018-04-24 | Qualcomm Incorporated | Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter |
| US10373868B2 (en) * | 2016-01-18 | 2019-08-06 | Infineon Technologies Austria Ag | Method of processing a porous conductive structure in connection to an electronic component on a substrate |
| JP6857329B2 (ja) * | 2016-10-24 | 2021-04-14 | 大日本印刷株式会社 | 高周波部品及びその製造方法 |
| JP6889399B2 (ja) * | 2017-08-08 | 2021-06-18 | 大日本印刷株式会社 | 貫通電極基板 |
| WO2019059898A1 (en) * | 2017-09-20 | 2019-03-28 | Intel Corporation | PERIPHERAL INDUCERS |
| JP2019102733A (ja) * | 2017-12-06 | 2019-06-24 | 凸版印刷株式会社 | 配線基板、半導体装置、及び配線基板の製造方法 |
| TWI669997B (zh) * | 2018-01-25 | 2019-08-21 | 欣興電子股份有限公司 | 線路板結構及其製作方法 |
| KR102609518B1 (ko) | 2018-09-21 | 2023-12-05 | 삼성전자주식회사 | 반도체 소자 형성 방법 |
| IT202000017554A1 (it) * | 2020-07-20 | 2022-01-20 | Thales Alenia Space Italia Spa Con Unico Socio | Feedthrough capacitivo per moduli ermetici ibridi |
| WO2022222131A1 (zh) * | 2021-04-23 | 2022-10-27 | 京东方科技集团股份有限公司 | 集成有无源器件的基板及其制备方法 |
| US20220375865A1 (en) * | 2021-05-18 | 2022-11-24 | Intel Corporation | Microelectronic assemblies with glass substrates and magnetic core inductors |
| US20220407212A1 (en) * | 2021-06-17 | 2022-12-22 | Intel Corporation | Millimeter wave components in a glass core of a substrate |
| CN114400286B (zh) * | 2022-01-14 | 2023-04-07 | 成都海威华芯科技有限公司 | 一种高可靠性通孔电容和制作方法 |
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| US20130223412A1 (en) | 2012-02-24 | 2013-08-29 | Qualcomm Incorporated | Method and system to improve frame early termination success rate |
| US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
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| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
-
2013
- 2013-03-15 US US13/833,632 patent/US9935166B2/en active Active
-
2014
- 2014-03-12 JP JP2016501422A patent/JP2016518702A/ja active Pending
- 2014-03-12 WO PCT/US2014/024118 patent/WO2014150747A1/en not_active Ceased
- 2014-03-12 KR KR1020157029145A patent/KR20150130516A/ko not_active Abandoned
- 2014-03-12 EP EP14720314.5A patent/EP2973693B1/en not_active Not-in-force
- 2014-03-12 CN CN201480012684.5A patent/CN105009280B/zh not_active Expired - Fee Related
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