JP2010107976A - 表示装置 - Google Patents

表示装置 Download PDF

Info

Publication number
JP2010107976A
JP2010107976A JP2009229378A JP2009229378A JP2010107976A JP 2010107976 A JP2010107976 A JP 2010107976A JP 2009229378 A JP2009229378 A JP 2009229378A JP 2009229378 A JP2009229378 A JP 2009229378A JP 2010107976 A JP2010107976 A JP 2010107976A
Authority
JP
Japan
Prior art keywords
thin film
wiring
layer
film transistor
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009229378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010107976A5 (enExample
Inventor
Shunpei Yamazaki
舜平 山崎
Kengo Akimoto
健吾 秋元
Shigeki Komori
茂樹 小森
Hideki Uoji
秀貴 魚地
Tomoya Futamura
智哉 二村
Takahiro Kasahara
崇廣 笠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2009229378A priority Critical patent/JP2010107976A/ja
Publication of JP2010107976A publication Critical patent/JP2010107976A/ja
Publication of JP2010107976A5 publication Critical patent/JP2010107976A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2009229378A 2008-10-03 2009-10-01 表示装置 Withdrawn JP2010107976A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009229378A JP2010107976A (ja) 2008-10-03 2009-10-01 表示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008259063 2008-10-03
JP2009229378A JP2010107976A (ja) 2008-10-03 2009-10-01 表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013192573A Division JP5766246B2 (ja) 2008-10-03 2013-09-18 半導体装置

Publications (2)

Publication Number Publication Date
JP2010107976A true JP2010107976A (ja) 2010-05-13
JP2010107976A5 JP2010107976A5 (enExample) 2012-02-02

Family

ID=42073577

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2009229378A Withdrawn JP2010107976A (ja) 2008-10-03 2009-10-01 表示装置
JP2013192573A Active JP5766246B2 (ja) 2008-10-03 2013-09-18 半導体装置
JP2015120826A Active JP6010188B2 (ja) 2008-10-03 2015-06-16 表示装置及び表示モジュール
JP2016180092A Active JP6317406B2 (ja) 2008-10-03 2016-09-15 半導体装置及び表示装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2013192573A Active JP5766246B2 (ja) 2008-10-03 2013-09-18 半導体装置
JP2015120826A Active JP6010188B2 (ja) 2008-10-03 2015-06-16 表示装置及び表示モジュール
JP2016180092A Active JP6317406B2 (ja) 2008-10-03 2016-09-15 半導体装置及び表示装置

Country Status (5)

Country Link
US (3) US7989815B2 (enExample)
JP (4) JP2010107976A (enExample)
KR (4) KR101803720B1 (enExample)
TW (2) TWI469298B (enExample)
WO (1) WO2010038819A1 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140068762A (ko) 2012-11-28 2014-06-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR20140068765A (ko) 2012-11-28 2014-06-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
KR20140082934A (ko) 2012-12-25 2014-07-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
JP2015115428A (ja) * 2013-12-11 2015-06-22 凸版印刷株式会社 静電気保護素子及びそれを用いた静電気保護回路
KR20150122166A (ko) 2013-02-25 2015-10-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
TWI607210B (zh) * 2012-02-10 2017-12-01 美商克萊譚克公司 於半導體裝置檢查系統中用於切趾的檢查系統
JP2019204960A (ja) * 2013-04-04 2019-11-28 株式会社半導体エネルギー研究所 半導体装置
JP2021040140A (ja) * 2010-09-10 2021-03-11 株式会社半導体エネルギー研究所 半導体装置
KR20220110719A (ko) * 2010-09-13 2022-08-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 파워 다이오드 및 정류기

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101762112B1 (ko) 2008-09-19 2017-07-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정표시장치
KR101273913B1 (ko) 2008-09-19 2013-06-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR101803720B1 (ko) 2008-10-03 2017-12-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
EP2172804B1 (en) 2008-10-03 2016-05-11 Semiconductor Energy Laboratory Co, Ltd. Display device
CN101719493B (zh) 2008-10-08 2014-05-14 株式会社半导体能源研究所 显示装置
WO2011004723A1 (en) * 2009-07-10 2011-01-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method the same
WO2011048925A1 (en) * 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011052258A1 (ja) * 2009-10-27 2011-05-05 シャープ株式会社 表示パネル及び表示装置
WO2011052437A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Non-linear element, display device including non-linear element, and electronic device including display device
WO2011065209A1 (en) * 2009-11-27 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Non-linear element, display device including non-linear element, and electronic device including display device
WO2011086905A1 (ja) * 2010-01-13 2011-07-21 シャープ株式会社 アクティブマトリクス基板及びその製造方法
JP5494115B2 (ja) * 2010-03-29 2014-05-14 ソニー株式会社 表示装置及び電子機器
TWI410722B (zh) * 2010-09-02 2013-10-01 Au Optronics Corp 液晶顯示單元
JP5899220B2 (ja) * 2010-09-29 2016-04-06 ポスコ ロール状の母基板を利用したフレキシブル電子素子の製造方法、フレキシブル電子素子及びフレキシブル基板
TWI658516B (zh) 2011-03-11 2019-05-01 日商半導體能源研究所股份有限公司 半導體裝置的製造方法
KR102223582B1 (ko) 2011-07-22 2021-03-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
TWI470808B (zh) 2011-12-28 2015-01-21 Au Optronics Corp 半導體元件及其製作方法
DE102012205415B4 (de) * 2012-04-03 2024-11-14 Bayerische Motoren Werke Aktiengesellschaft Fahrzeug
KR20140059576A (ko) * 2012-11-08 2014-05-16 삼성디스플레이 주식회사 박막 트랜지스터 및 이를 포함하는 유기 발광 디스플레이 장치
KR102105485B1 (ko) * 2012-11-23 2020-04-29 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 그 제조 방법
KR20220145922A (ko) 2012-12-25 2022-10-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6083089B2 (ja) * 2013-03-27 2017-02-22 株式会社Joled 半導体装置、表示装置および電子機器
US9915848B2 (en) 2013-04-19 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR102053410B1 (ko) * 2013-04-24 2019-12-09 삼성디스플레이 주식회사 박막 트랜지스터 및 유기 발광 표시 장치
US9704894B2 (en) 2013-05-10 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Display device including pixel electrode including oxide
TWI649606B (zh) 2013-06-05 2019-02-01 日商半導體能源研究所股份有限公司 顯示裝置及電子裝置
CN103995407B (zh) * 2014-05-08 2016-08-24 京东方科技集团股份有限公司 阵列基板和显示面板
WO2016063169A1 (en) 2014-10-23 2016-04-28 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element
US10680017B2 (en) 2014-11-07 2020-06-09 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element including EL layer, electrode which has high reflectance and a high work function, display device, electronic device, and lighting device
CN105470388B (zh) * 2015-11-18 2018-09-28 深圳市华星光电技术有限公司 有机半导体薄膜晶体管及其制作方法
KR102517092B1 (ko) * 2017-08-02 2023-04-04 삼성전자주식회사 가요성 디스플레이 패널을 포함하는 전자 장치
CN107274851A (zh) * 2017-08-14 2017-10-20 京东方科技集团股份有限公司 显示面板及其驱动方法和显示装置
US11287707B2 (en) * 2018-11-15 2022-03-29 Sharp Kabushiki Kaisha Array substrate, array substrate body component, and display device

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63220289A (ja) * 1987-03-10 1988-09-13 日本電気株式会社 薄膜トランジスタアレイ
JPH0588198A (ja) * 1991-09-27 1993-04-09 Nec Corp 液晶表示装置
JPH08179360A (ja) * 1994-12-20 1996-07-12 Casio Comput Co Ltd アクティブマトリックスパネル
JPH09504120A (ja) * 1993-10-22 1997-04-22 コピン・コーポレーシヨン 頭部装着形表示システム
JPH11183876A (ja) * 1997-12-24 1999-07-09 Casio Comput Co Ltd 液晶表示装置及びその駆動方法
JP2003086808A (ja) * 2001-09-10 2003-03-20 Masashi Kawasaki 薄膜トランジスタおよびマトリクス表示装置
JP2007096055A (ja) * 2005-09-29 2007-04-12 Semiconductor Energy Lab Co Ltd 半導体装置、及び半導体装置の作製方法
JP2007220818A (ja) * 2006-02-15 2007-08-30 Kochi Prefecture Sangyo Shinko Center 薄膜トランジスタ及びその製法
JP2007250982A (ja) * 2006-03-17 2007-09-27 Canon Inc 酸化物半導体を用いた薄膜トランジスタ及び表示装置
JP2008053356A (ja) * 2006-08-23 2008-03-06 Canon Inc アモルファス酸化物半導体膜を用いた薄膜トランジスタの製造方法
JP2008107807A (ja) * 2006-09-29 2008-05-08 Semiconductor Energy Lab Co Ltd 液晶表示装置および電子機器
JP2008182219A (ja) * 2006-12-28 2008-08-07 Semiconductor Energy Lab Co Ltd 半導体装置

Family Cites Families (184)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3819952A (en) 1973-01-29 1974-06-25 Mitsubishi Electric Corp Semiconductor device
DE69107101T2 (de) * 1990-02-06 1995-05-24 Semiconductor Energy Lab Verfahren zum Herstellen eines Oxydfilms.
JP3071851B2 (ja) 1991-03-25 2000-07-31 株式会社半導体エネルギー研究所 電気光学装置
JP3375659B2 (ja) * 1991-03-28 2003-02-10 テキサス インスツルメンツ インコーポレイテツド 静電放電保護回路の形成方法
US5233448A (en) * 1992-05-04 1993-08-03 Industrial Technology Research Institute Method of manufacturing a liquid crystal display panel including photoconductive electrostatic protection
US5464990A (en) * 1992-09-25 1995-11-07 Fuji Xerox Co., Ltd. Voltage non-linear device and liquid crystal display device incorporating same
US5815126A (en) 1993-10-22 1998-09-29 Kopin Corporation Monocular portable communication and display system
US6424321B1 (en) 1993-10-22 2002-07-23 Kopin Corporation Head-mounted matrix display
US7310072B2 (en) 1993-10-22 2007-12-18 Kopin Corporation Portable communication display device
JP2701738B2 (ja) 1994-05-17 1998-01-21 日本電気株式会社 有機薄膜el素子
JPH08179359A (ja) * 1994-12-20 1996-07-12 Casio Comput Co Ltd アクティブマトリックスパネル
JPH08254693A (ja) * 1995-03-16 1996-10-01 Hitachi Ltd 液晶表示基板およびその製造方法
WO1997006554A2 (en) * 1995-08-03 1997-02-20 Philips Electronics N.V. Semiconductor device provided with transparent switching element
JP3007025B2 (ja) * 1995-08-25 2000-02-07 シャープ株式会社 アクティブマトリクス型液晶表示装置及びその製造方法
JP3183390B2 (ja) * 1995-09-05 2001-07-09 キヤノン株式会社 光電変換装置及びそれを用いた撮像装置
USRE44267E1 (en) * 1995-10-03 2013-06-04 Seiko Epson Corporation Method to prevent static destruction of an active element comprised in a liquid crystal display device
US5847410A (en) 1995-11-24 1998-12-08 Semiconductor Energy Laboratory Co. Semiconductor electro-optical device
JP3625598B2 (ja) * 1995-12-30 2005-03-02 三星電子株式会社 液晶表示装置の製造方法
JP3629798B2 (ja) * 1996-02-20 2005-03-16 カシオ計算機株式会社 配線パターン
JPH1020336A (ja) * 1996-07-02 1998-01-23 Sharp Corp アクティブマトリクス基板およびその製造方法
JPH10123574A (ja) * 1996-10-17 1998-05-15 Hitachi Ltd アクティブマトリクス基板
KR100252308B1 (ko) 1997-01-10 2000-04-15 구본준, 론 위라하디락사 박막트랜지스터 어레이
JPH11174970A (ja) * 1997-12-16 1999-07-02 Hitachi Ltd 薄膜デバイス
JP4170454B2 (ja) 1998-07-24 2008-10-22 Hoya株式会社 透明導電性酸化物薄膜を有する物品及びその製造方法
JP4264675B2 (ja) 1998-08-17 2009-05-20 栄 田中 液晶表示装置とその製造方法
US6043971A (en) * 1998-11-04 2000-03-28 L.G. Philips Lcd Co., Ltd. Electrostatic discharge protection device for liquid crystal display using a COG package
JP2000150861A (ja) * 1998-11-16 2000-05-30 Tdk Corp 酸化物薄膜
JP3276930B2 (ja) * 1998-11-17 2002-04-22 科学技術振興事業団 トランジスタ及び半導体装置
TW444257B (en) * 1999-04-12 2001-07-01 Semiconductor Energy Lab Semiconductor device and method for fabricating the same
US6859193B1 (en) * 1999-07-14 2005-02-22 Sony Corporation Current drive circuit and display device using the same, pixel circuit, and drive method
US7379039B2 (en) * 1999-07-14 2008-05-27 Sony Corporation Current drive circuit and display device using same pixel circuit, and drive method
JP2001053283A (ja) * 1999-08-12 2001-02-23 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
TW457690B (en) * 1999-08-31 2001-10-01 Fujitsu Ltd Liquid crystal display
JP4390991B2 (ja) * 1999-08-31 2009-12-24 シャープ株式会社 液晶表示装置
TW460731B (en) 1999-09-03 2001-10-21 Ind Tech Res Inst Electrode structure and production method of wide viewing angle LCD
US7098084B2 (en) 2000-03-08 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2001324725A (ja) * 2000-05-12 2001-11-22 Hitachi Ltd 液晶表示装置およびその製造方法
JP2002026333A (ja) 2000-07-11 2002-01-25 Nec Corp アクティブマトリクス基板の製造方法
JP4089858B2 (ja) 2000-09-01 2008-05-28 国立大学法人東北大学 半導体デバイス
KR20020038482A (ko) * 2000-11-15 2002-05-23 모리시타 요이찌 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널
JP3997731B2 (ja) * 2001-03-19 2007-10-24 富士ゼロックス株式会社 基材上に結晶性半導体薄膜を形成する方法
JP2002289859A (ja) 2001-03-23 2002-10-04 Minolta Co Ltd 薄膜トランジスタ
KR100386849B1 (ko) * 2001-07-10 2003-06-09 엘지.필립스 엘시디 주식회사 박막 트랜지스터 표시장치의 정전방전 방지회로
GB0119299D0 (en) * 2001-08-08 2001-10-03 Koninkl Philips Electronics Nv Electrostatic discharge protection for pixellated electronic device
JP2003069028A (ja) 2001-08-27 2003-03-07 Casio Comput Co Ltd 薄膜トランジスタパネル
JP3925839B2 (ja) 2001-09-10 2007-06-06 シャープ株式会社 半導体記憶装置およびその試験方法
JP3810725B2 (ja) * 2001-09-21 2006-08-16 株式会社半導体エネルギー研究所 発光装置及び電子機器
US7061014B2 (en) * 2001-11-05 2006-06-13 Japan Science And Technology Agency Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
JP4164562B2 (ja) 2002-09-11 2008-10-15 独立行政法人科学技術振興機構 ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
JP3810681B2 (ja) 2001-12-20 2006-08-16 シャープ株式会社 薄膜トランジスタ基板および液晶表示装置
JP4083486B2 (ja) * 2002-02-21 2008-04-30 独立行政法人科学技術振興機構 LnCuO(S,Se,Te)単結晶薄膜の製造方法
US7049190B2 (en) * 2002-03-15 2006-05-23 Sanyo Electric Co., Ltd. Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device
JP3933591B2 (ja) * 2002-03-26 2007-06-20 淳二 城戸 有機エレクトロルミネッセント素子
US6933528B2 (en) * 2002-04-04 2005-08-23 Nec Lcd Technologies, Ltd. In-plane switching mode active matrix type liquid crystal display device and method of fabricating the same
US7339187B2 (en) 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
US7002176B2 (en) 2002-05-31 2006-02-21 Ricoh Company, Ltd. Vertical organic transistor
JP2004022625A (ja) * 2002-06-13 2004-01-22 Murata Mfg Co Ltd 半導体デバイス及び該半導体デバイスの製造方法
US7105868B2 (en) * 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
JP4565799B2 (ja) 2002-07-01 2010-10-20 大林精工株式会社 横電界方式液晶表示装置、その製造方法、走査露光装置およびミックス走査露光装置
WO2004027740A1 (en) * 2002-09-20 2004-04-01 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
US7067843B2 (en) * 2002-10-11 2006-06-27 E. I. Du Pont De Nemours And Company Transparent oxide semiconductor thin film transistors
TW200415393A (en) 2003-01-15 2004-08-16 Toshiba Matsushita Display Tec LCD device
JP2004246202A (ja) 2003-02-14 2004-09-02 Koninkl Philips Electronics Nv 静電放電保護回路を有する電子装置
JP4166105B2 (ja) 2003-03-06 2008-10-15 シャープ株式会社 半導体装置およびその製造方法
JP2004273732A (ja) 2003-03-07 2004-09-30 Sharp Corp アクティブマトリクス基板およびその製造方法
KR100528697B1 (ko) * 2003-05-06 2005-11-16 엘지.필립스 엘시디 주식회사 액정표시장치의 검사방법 및 장치
JP4108633B2 (ja) 2003-06-20 2008-06-25 シャープ株式会社 薄膜トランジスタおよびその製造方法ならびに電子デバイス
US7262463B2 (en) * 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
JP2005108912A (ja) * 2003-09-29 2005-04-21 Quanta Display Japan Inc 液晶表示装置とその製造方法
JP4574158B2 (ja) 2003-10-28 2010-11-04 株式会社半導体エネルギー研究所 半導体表示装置及びその作製方法
US7145174B2 (en) * 2004-03-12 2006-12-05 Hewlett-Packard Development Company, Lp. Semiconductor device
US7297977B2 (en) * 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
KR101019337B1 (ko) 2004-03-12 2011-03-07 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 아몰퍼스 산화물 및 박막 트랜지스터
US7282782B2 (en) * 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
KR101116816B1 (ko) 2004-06-05 2012-02-28 엘지디스플레이 주식회사 반투과형 박막 트랜지스터 기판 및 그 제조 방법
US7211825B2 (en) * 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
TWI229933B (en) 2004-06-25 2005-03-21 Novatek Microelectronics Corp High voltage device for electrostatic discharge protective circuit and high voltage device
JP2006030627A (ja) 2004-07-16 2006-02-02 Sharp Corp 表示装置用基板及びそれを用いた液晶表示装置
JP4193805B2 (ja) * 2004-07-27 2008-12-10 セイコーエプソン株式会社 発光装置および画像形成装置
JP2006100760A (ja) * 2004-09-02 2006-04-13 Casio Comput Co Ltd 薄膜トランジスタおよびその製造方法
US7285501B2 (en) * 2004-09-17 2007-10-23 Hewlett-Packard Development Company, L.P. Method of forming a solution processed device
US7298084B2 (en) * 2004-11-02 2007-11-20 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
US7791072B2 (en) * 2004-11-10 2010-09-07 Canon Kabushiki Kaisha Display
US7863611B2 (en) * 2004-11-10 2011-01-04 Canon Kabushiki Kaisha Integrated circuits utilizing amorphous oxides
US7453065B2 (en) * 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
CA2585190A1 (en) * 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
CN101057333B (zh) * 2004-11-10 2011-11-16 佳能株式会社 发光器件
CN101057338B (zh) * 2004-11-10 2011-03-16 佳能株式会社 采用无定形氧化物的场效应晶体管
US7829444B2 (en) * 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
US7579224B2 (en) * 2005-01-21 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a thin film semiconductor device
TWI472037B (zh) * 2005-01-28 2015-02-01 半導體能源研究所股份有限公司 半導體裝置,電子裝置,和半導體裝置的製造方法
TWI569441B (zh) * 2005-01-28 2017-02-01 半導體能源研究所股份有限公司 半導體裝置,電子裝置,和半導體裝置的製造方法
US7858451B2 (en) * 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US7948171B2 (en) * 2005-02-18 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2006245093A (ja) 2005-03-01 2006-09-14 Renei Kagi Kofun Yugenkoshi 高電圧デバイス並びに静電気保護回路用高電圧デバイス
US20060197092A1 (en) * 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
US8681077B2 (en) * 2005-03-18 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
WO2006105077A2 (en) * 2005-03-28 2006-10-05 Massachusetts Institute Of Technology Low voltage thin film transistor with high-k dielectric material
US7645478B2 (en) * 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US8300031B2 (en) * 2005-04-20 2012-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element
CN100538794C (zh) 2005-05-02 2009-09-09 株式会社半导体能源研究所 发光器件及其驱动方法、显示模块以及电子器具
JP2006344849A (ja) 2005-06-10 2006-12-21 Casio Comput Co Ltd 薄膜トランジスタ
TWI260094B (en) 2005-06-13 2006-08-11 Au Optronics Corp Active device matrix substrate
US7691666B2 (en) 2005-06-16 2010-04-06 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7402506B2 (en) * 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7507618B2 (en) 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
US7732330B2 (en) 2005-06-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using an ink-jet method of the same
US7655566B2 (en) 2005-07-27 2010-02-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR100711890B1 (ko) * 2005-07-28 2007-04-25 삼성에스디아이 주식회사 유기 발광표시장치 및 그의 제조방법
JP4039446B2 (ja) * 2005-08-02 2008-01-30 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
JP2007059128A (ja) * 2005-08-23 2007-03-08 Canon Inc 有機el表示装置およびその製造方法
JP4850457B2 (ja) 2005-09-06 2012-01-11 キヤノン株式会社 薄膜トランジスタ及び薄膜ダイオード
JP2007073705A (ja) * 2005-09-06 2007-03-22 Canon Inc 酸化物半導体チャネル薄膜トランジスタおよびその製造方法
JP5116225B2 (ja) * 2005-09-06 2013-01-09 キヤノン株式会社 酸化物半導体デバイスの製造方法
JP4280736B2 (ja) * 2005-09-06 2009-06-17 キヤノン株式会社 半導体素子
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
EP1998374A3 (en) 2005-09-29 2012-01-18 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device having oxide semiconductor layer and manufacturing method thereof
CN101283388B (zh) 2005-10-05 2011-04-13 出光兴产株式会社 Tft基板及tft基板的制造方法
JP5037808B2 (ja) * 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置
JP5089139B2 (ja) 2005-11-15 2012-12-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101358954B1 (ko) * 2005-11-15 2014-02-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 다이오드 및 액티브 매트릭스 표시장치
JP4846348B2 (ja) * 2005-11-18 2011-12-28 株式会社 日立ディスプレイズ 表示装置
KR100754126B1 (ko) * 2005-11-23 2007-08-30 삼성에스디아이 주식회사 액정표시장치 어레이 기판 및 그 제조방법
JP5250929B2 (ja) 2005-11-30 2013-07-31 凸版印刷株式会社 トランジスタおよびその製造方法
US20070146564A1 (en) * 2005-12-23 2007-06-28 Innolux Display Corp. ESD protection circuit and driving circuit for LCD
TWI292281B (en) * 2005-12-29 2008-01-01 Ind Tech Res Inst Pixel structure of active organic light emitting diode and method of fabricating the same
US7867636B2 (en) * 2006-01-11 2011-01-11 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
JP4977478B2 (ja) * 2006-01-21 2012-07-18 三星電子株式会社 ZnOフィルム及びこれを用いたTFTの製造方法
US7576394B2 (en) * 2006-02-02 2009-08-18 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
JP2007212699A (ja) * 2006-02-09 2007-08-23 Idemitsu Kosan Co Ltd 反射型tft基板及び反射型tft基板の製造方法
US7977169B2 (en) * 2006-02-15 2011-07-12 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
US8222116B2 (en) * 2006-03-03 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2007272203A (ja) 2006-03-06 2007-10-18 Nec Corp 表示装置
JP5110803B2 (ja) * 2006-03-17 2012-12-26 キヤノン株式会社 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法
KR20070101595A (ko) 2006-04-11 2007-10-17 삼성전자주식회사 ZnO TFT
US20070246778A1 (en) 2006-04-21 2007-10-25 Meng-Chi Liou Electrostatic discharge panel protection structure
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
JP2007316105A (ja) * 2006-05-23 2007-12-06 Casio Comput Co Ltd 表示装置
KR100847640B1 (ko) * 2006-05-23 2008-07-21 가시오게산키 가부시키가이샤 표시장치
JP5028033B2 (ja) 2006-06-13 2012-09-19 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
KR101478810B1 (ko) 2006-07-28 2015-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 축전 장치
JP4404881B2 (ja) * 2006-08-09 2010-01-27 日本電気株式会社 薄膜トランジスタアレイ、その製造方法及び液晶表示装置
JP4999400B2 (ja) * 2006-08-09 2012-08-15 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4609797B2 (ja) * 2006-08-09 2011-01-12 Nec液晶テクノロジー株式会社 薄膜デバイス及びその製造方法
JP4332545B2 (ja) * 2006-09-15 2009-09-16 キヤノン株式会社 電界効果型トランジスタ及びその製造方法
JP4274219B2 (ja) * 2006-09-27 2009-06-03 セイコーエプソン株式会社 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置
JP5164357B2 (ja) * 2006-09-27 2013-03-21 キヤノン株式会社 半導体装置及び半導体装置の製造方法
JP5116277B2 (ja) * 2006-09-29 2013-01-09 株式会社半導体エネルギー研究所 半導体装置、表示装置、液晶表示装置、表示モジュール及び電子機器
JP4932415B2 (ja) * 2006-09-29 2012-05-16 株式会社半導体エネルギー研究所 半導体装置
TWI585730B (zh) 2006-09-29 2017-06-01 半導體能源研究所股份有限公司 顯示裝置和電子裝置
US7622371B2 (en) * 2006-10-10 2009-11-24 Hewlett-Packard Development Company, L.P. Fused nanocrystal thin film semiconductor and method
KR20080034704A (ko) * 2006-10-17 2008-04-22 삼성에스디아이 주식회사 유기 박막 트랜지스터 표시 기판 및 그 제조 방법
US7772021B2 (en) * 2006-11-29 2010-08-10 Samsung Electronics Co., Ltd. Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
JP2008140684A (ja) * 2006-12-04 2008-06-19 Toppan Printing Co Ltd カラーelディスプレイおよびその製造方法
JP5305630B2 (ja) 2006-12-05 2013-10-02 キヤノン株式会社 ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法
KR101146574B1 (ko) 2006-12-05 2012-05-16 캐논 가부시끼가이샤 산화물 반도체를 이용한 박막 트랜지스터의 제조방법 및 표시장치
KR101363714B1 (ko) 2006-12-11 2014-02-14 엘지디스플레이 주식회사 유기 박막트랜지스터, 그 제조 방법, 이를 이용한 정전기방지 소자, 액정표시장치 및 그 제조 방법
JP5325415B2 (ja) * 2006-12-18 2013-10-23 株式会社半導体エネルギー研究所 半導体装置
KR100993420B1 (ko) 2006-12-29 2010-11-09 엘지디스플레이 주식회사 액정표시장치
KR101303578B1 (ko) * 2007-01-05 2013-09-09 삼성전자주식회사 박막 식각 방법
US8207063B2 (en) * 2007-01-26 2012-06-26 Eastman Kodak Company Process for atomic layer deposition
KR100858088B1 (ko) * 2007-02-28 2008-09-10 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법
KR100851215B1 (ko) * 2007-03-14 2008-08-07 삼성에스디아이 주식회사 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치
JP4727684B2 (ja) * 2007-03-27 2011-07-20 富士フイルム株式会社 薄膜電界効果型トランジスタおよびそれを用いた表示装置
US7795613B2 (en) 2007-04-17 2010-09-14 Toppan Printing Co., Ltd. Structure with transistor
KR101325053B1 (ko) * 2007-04-18 2013-11-05 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR20080094300A (ko) 2007-04-19 2008-10-23 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이
KR101334181B1 (ko) 2007-04-20 2013-11-28 삼성전자주식회사 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법
WO2008133345A1 (en) * 2007-04-25 2008-11-06 Canon Kabushiki Kaisha Oxynitride semiconductor
JP5261979B2 (ja) 2007-05-16 2013-08-14 凸版印刷株式会社 画像表示装置
KR101345376B1 (ko) 2007-05-29 2013-12-24 삼성전자주식회사 ZnO 계 박막 트랜지스터 및 그 제조방법
CN103258512B (zh) * 2007-11-29 2017-03-01 株式会社半导体能源研究所 液晶显示器件和电子器件
US8202365B2 (en) * 2007-12-17 2012-06-19 Fujifilm Corporation Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film
CN101911166B (zh) * 2008-01-15 2013-08-21 株式会社半导体能源研究所 发光器件
TWI476921B (zh) * 2008-07-31 2015-03-11 Semiconductor Energy Lab 半導體裝置及其製造方法
KR20110056542A (ko) 2008-09-12 2011-05-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
WO2010029865A1 (en) 2008-09-12 2010-03-18 Semiconductor Energy Laboratory Co., Ltd. Display device
JP4623179B2 (ja) * 2008-09-18 2011-02-02 ソニー株式会社 薄膜トランジスタおよびその製造方法
KR101762112B1 (ko) 2008-09-19 2017-07-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정표시장치
KR101273913B1 (ko) 2008-09-19 2013-06-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR101803720B1 (ko) 2008-10-03 2017-12-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
EP2172804B1 (en) * 2008-10-03 2016-05-11 Semiconductor Energy Laboratory Co, Ltd. Display device
CN101719493B (zh) 2008-10-08 2014-05-14 株式会社半导体能源研究所 显示装置
JP5451280B2 (ja) * 2008-10-09 2014-03-26 キヤノン株式会社 ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63220289A (ja) * 1987-03-10 1988-09-13 日本電気株式会社 薄膜トランジスタアレイ
JPH0588198A (ja) * 1991-09-27 1993-04-09 Nec Corp 液晶表示装置
JPH09504120A (ja) * 1993-10-22 1997-04-22 コピン・コーポレーシヨン 頭部装着形表示システム
JPH08179360A (ja) * 1994-12-20 1996-07-12 Casio Comput Co Ltd アクティブマトリックスパネル
JPH11183876A (ja) * 1997-12-24 1999-07-09 Casio Comput Co Ltd 液晶表示装置及びその駆動方法
JP2003086808A (ja) * 2001-09-10 2003-03-20 Masashi Kawasaki 薄膜トランジスタおよびマトリクス表示装置
JP2007096055A (ja) * 2005-09-29 2007-04-12 Semiconductor Energy Lab Co Ltd 半導体装置、及び半導体装置の作製方法
JP2007220818A (ja) * 2006-02-15 2007-08-30 Kochi Prefecture Sangyo Shinko Center 薄膜トランジスタ及びその製法
JP2007250982A (ja) * 2006-03-17 2007-09-27 Canon Inc 酸化物半導体を用いた薄膜トランジスタ及び表示装置
JP2008053356A (ja) * 2006-08-23 2008-03-06 Canon Inc アモルファス酸化物半導体膜を用いた薄膜トランジスタの製造方法
JP2008107807A (ja) * 2006-09-29 2008-05-08 Semiconductor Energy Lab Co Ltd 液晶表示装置および電子機器
JP2008182219A (ja) * 2006-12-28 2008-08-07 Semiconductor Energy Lab Co Ltd 半導体装置

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021040140A (ja) * 2010-09-10 2021-03-11 株式会社半導体エネルギー研究所 半導体装置
KR20220110719A (ko) * 2010-09-13 2022-08-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 파워 다이오드 및 정류기
US12094982B2 (en) 2010-09-13 2024-09-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, power diode, and rectifier
KR102653084B1 (ko) 2010-09-13 2024-04-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 파워 다이오드 및 정류기
TWI607210B (zh) * 2012-02-10 2017-12-01 美商克萊譚克公司 於半導體裝置檢查系統中用於切趾的檢查系統
KR20240153303A (ko) 2012-11-28 2024-10-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
US9324737B2 (en) 2012-11-28 2016-04-26 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US9842863B2 (en) 2012-11-28 2017-12-12 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US9130367B2 (en) 2012-11-28 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Display device
KR20250005026A (ko) 2012-11-28 2025-01-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR20230012092A (ko) 2012-11-28 2023-01-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR20140068762A (ko) 2012-11-28 2014-06-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR20220088664A (ko) 2012-11-28 2022-06-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
KR20210094506A (ko) 2012-11-28 2021-07-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR20140068765A (ko) 2012-11-28 2014-06-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
US10978492B2 (en) 2012-12-25 2021-04-13 Semiconductor Energy Laboratory Co., Ltd. Resistor, display device, and electronic device
US10229934B2 (en) 2012-12-25 2019-03-12 Semiconductor Energy Laboratory Co., Ltd. Resistor, display device, and electronic device
KR20140082934A (ko) 2012-12-25 2014-07-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
KR20210042299A (ko) 2012-12-25 2021-04-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
KR20220050120A (ko) 2012-12-25 2022-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
US10629625B2 (en) 2012-12-25 2020-04-21 Semiconductor Energy Laboratory Co., Ltd. Resistor, display device, and electronic device
KR20210132630A (ko) 2012-12-25 2021-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
KR20200080335A (ko) 2013-02-25 2020-07-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
JP2018151649A (ja) * 2013-02-25 2018-09-27 株式会社半導体エネルギー研究所 表示装置
JP2023065489A (ja) * 2013-02-25 2023-05-12 株式会社半導体エネルギー研究所 表示装置
KR20210011074A (ko) 2013-02-25 2021-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9482919B2 (en) 2013-02-25 2016-11-01 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device with improved driver circuit
KR20150122166A (ko) 2013-02-25 2015-10-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
US10991731B2 (en) 2013-04-04 2021-04-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2019204960A (ja) * 2013-04-04 2019-11-28 株式会社半導体エネルギー研究所 半導体装置
US11495626B2 (en) 2013-04-04 2022-11-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US12051703B2 (en) 2013-04-04 2024-07-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2015115428A (ja) * 2013-12-11 2015-06-22 凸版印刷株式会社 静電気保護素子及びそれを用いた静電気保護回路

Also Published As

Publication number Publication date
KR20110083760A (ko) 2011-07-20
JP2017041639A (ja) 2017-02-23
TWI469302B (zh) 2015-01-11
KR20160101725A (ko) 2016-08-25
KR101761108B1 (ko) 2017-07-25
US20100084653A1 (en) 2010-04-08
KR101652693B1 (ko) 2016-09-01
KR101273972B1 (ko) 2013-06-12
JP5766246B2 (ja) 2015-08-19
KR20110086017A (ko) 2011-07-27
US20130092934A1 (en) 2013-04-18
JP6317406B2 (ja) 2018-04-25
TWI469298B (zh) 2015-01-11
JP2014042036A (ja) 2014-03-06
US8334540B2 (en) 2012-12-18
TW201030923A (en) 2010-08-16
JP6010188B2 (ja) 2016-10-19
US7989815B2 (en) 2011-08-02
TW201143010A (en) 2011-12-01
US20110260159A1 (en) 2011-10-27
KR101803720B1 (ko) 2017-12-01
US8674371B2 (en) 2014-03-18
JP2015213179A (ja) 2015-11-26
KR20170086144A (ko) 2017-07-25
WO2010038819A1 (en) 2010-04-08

Similar Documents

Publication Publication Date Title
JP6600761B1 (ja) 表示装置
JP6317406B2 (ja) 半導体装置及び表示装置
JP6408529B2 (ja) 表示装置
JP5534769B2 (ja) 表示装置
JP5436129B2 (ja) 表示装置
JP5091209B2 (ja) 表示装置
JP5436108B2 (ja) 表示装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111209

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111209

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130220

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130806

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20130918