JP2009181981A - 半導体装置の製造方法および半導体装置 - Google Patents
半導体装置の製造方法および半導体装置 Download PDFInfo
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- JP2009181981A JP2009181981A JP2008017141A JP2008017141A JP2009181981A JP 2009181981 A JP2009181981 A JP 2009181981A JP 2008017141 A JP2008017141 A JP 2008017141A JP 2008017141 A JP2008017141 A JP 2008017141A JP 2009181981 A JP2009181981 A JP 2009181981A
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Abstract
【解決手段】半導体基板4を貫通するリング状の溝部14を半導体基板4の裏面側から形成し、リング状の溝部14の内部と半導体基板4の裏面に絶縁膜7を形成した後、リング状の溝部14の内側の絶縁膜7および半導体基板4に、貫通孔5を半導体基板4の裏面側から形成し、半導体基板4の表面に形成された表面保護絶縁膜2を貫通孔5の底面に露出させる。続いて、貫通孔5の底面に露出する表面保護絶縁膜2を除去して開口部6を形成し、素子面電極3を露出させた後、素子面電極3に接続するコンタクト電極9を貫通孔5および開口部6の内壁に形成し、コンタクト電極9と同一層からなるパッド電極9aを半導体基板4の裏面に形成する。
【選択図】図1
Description
本実施の形態1による半導体装置が有する貫通電極を図1および図2を用いて説明する。図1は半導体装置が有する貫通電極の要部断面図、図2は半導体装置が有する貫通電極の要部平面図である。
本実施の形態2による半導体装置が有する貫通電極を図18を用いて説明する。図18は半導体装置が有する貫通電極の要部断面図である。
本実施の形態3による半導体装置が有する貫通電極を図19を用いて説明する。図19は半導体装置が有する貫通電極の要部断面図である。
本実施の形態4による半導体装置が有する貫通電極を図20を用いて説明する。図20は半導体装置が有する貫通電極の要部断面図である。
本実施の形態5による半導体チップを三次元的に積層形成したSIP(Single In-line Package)構造の半導体装置を図21を用いて説明する。図21はSIP構造の半導体装置の要部断面図である。ここでは、前述した実施の形態1で製造した貫通電極PD1を有する半導体チップを使用しているが、前述した実施の形態2、3または4で製造した貫通電極PD1,PD2,PD3,PD4を有する半導体チップを使用してもよい。
実施の形態1で記載した工程で、図12〜図14の工程は、次の工程でも製作可能である。図11までは、実施の形態1と同じ工程で、図11に示すようにシード層8、8aを形成した後、半導体ウエハの第2の面1yの全面にめっきを行う。これにより、電極9、9aも同時に形成される。この後、図14に示すように、例えばフォトリソグラフィ技術により、レジスト被覆部18を形成し、電極9、9aおよび配線以外のめっき膜およびシード層を除去する。この実施の形態によれば、図12、図13のフォトリソグラフィ工程を省略できるため、工程が簡略化するとともに、フォトリソグラフィに使用するフォトマスク等も減らすことができるため、コスト低減にもなる。
1x 第1面
1y 第2面
2 表面保護絶縁膜(第1絶縁膜)
3 素子面電極(第1電極)
4 半導体基板
5 貫通孔
6 開口部
7 絶縁膜(第2絶縁膜)
8,8a シード層
9 コンタクト電極(第3電極)
9a パッド電極(第2電極)
10 配線
11 接着層
12 支持基板
13 フォトレジスト膜
13a レジスト開口部
14 溝部
15 フォトレジスト膜
15a レジスト開口部
16 フォトレジスト膜
16a メッキ用レジスト開口部
18 レジスト被覆部
19 半導体チップ
20 スクライブライン
21 バンプ
22 コンタクトプラグ
23 内部電極
24 空洞
51a,51b,51c 半導体チップ
52 配線基板
53a,53b,53c 貫通電極
54a,54b,54c スタックドバンプ電極
55 電極
56 半田バンプ電極
57 封止用接着剤
PD1,PD2,PD3,PD4 貫通電極
Claims (27)
- 以下の工程を有する半導体装置の製造方法;
(a)半導体基板の第1面に半導体素子を形成した後、前記半導体素子の上層に第1絶縁膜を形成し、そして前記第1絶縁膜の上層に第1電極を形成する工程、
(b)前記半導体基板を貫通するリング状の溝部を前記半導体基板の前記第1面と反対の第2面の側から形成する工程、
(c)前記リング状の溝部の内部を含む前記半導体基板の前記第2面に第2絶縁膜を形成する工程、
(d)前記リング状の溝部の内側の前記第2絶縁膜および前記半導体基板に、前記半導体基板の前記第2面の側から貫通孔を形成する工程、
(e)前記貫通孔の底面に露出する前記第1絶縁膜を除去して、前記第1電極を露出させる開口部を形成する工程、
(f)前記貫通孔および前記開口部の内壁を含み、前記半導体基板の前記第2面に前記第1電極に接触するシード層を形成する工程、
(g)前記貫通孔の周囲の前記半導体基板の前記第2面に形成された前記シード層上に第2電極を形成し、同時に前記貫通孔および前記開口部の内壁に形成された前記シード層上に第3電極を形成する工程、
(h)前記第2および第3電極が形成された領域以外の前記シード層を除去する工程。 - 請求項1記載の半導体装置の製造方法において、前記(b)工程の前に、
(i)前記半導体基板の前記第2面を研削して、前記半導体基板を所定の厚さにする工程、
をさらに含むことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、前記(h)工程の後に、
(j)前記第1電極にバンプを接続する工程、
をさらに含むことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、前記(e)工程において、前記第1絶縁膜はドライエッチング法により除去されることを特徴とする半導体装置の製造方法。
- 請求項1記載の半導体装置の製造方法において、前記(e)工程において、前記第1絶縁膜はウエットエッチング法により除去されることを特徴とする半導体装置の製造方法。
- 以下の工程を有する半導体装置の製造方法;
(a)半導体基板の第1面に半導体素子を形成した後、前記半導体素子の上層に第1絶縁膜を形成する工程、
(b)前記第1絶縁膜の所定の領域に前記半導体基板に達する複数の孔を形成した後、前記複数の孔の内部に導電性材料を埋め込み、複数のコンタクトプラグを形成する工程、
(c)前記複数のコンタクトプラグに接続する第1電極を形成する工程、
(d)前記半導体基板を貫通するリング状の溝部を前記半導体基板の前記第1面と反対の第2面の側から形成する工程、
(e)前記リング状の溝部の内部を含む前記半導体基板の前記第2面に第2絶縁膜を形成する工程、
(f)前記リング状の溝部の内側の前記第2絶縁膜および前記半導体基板に、前記半導体基板の前記第2面の側から貫通孔を形成する工程、
(g)前記貫通孔の内壁を含み、前記半導体基板の前記第2面に前記複数のコンタクトプラグに接続するシード層を形成する工程、
(h)前記貫通孔の周囲の前記半導体基板の前記第2面に形成された前記シード層上に第2電極を形成し、同時に前記貫通孔の内壁に形成された前記シード層上に第3電極を形成する工程、
(i)前記第2および第3電極が形成された領域以外の前記シード層を除去する工程。 - 請求項6記載の半導体装置の製造方法において、前記(d)工程の前に、
(j)前記半導体基板の前記第2面を研削して、前記半導体基板を所定の厚さにする工程、
をさらに含むことを特徴とする半導体装置の製造方法。 - 請求項6記載の半導体装置の製造方法において、前記(i)工程の後に、
(k)前記第1電極にバンプを接続する工程、
をさらに含むことを特徴とする半導体装置の製造方法。 - 以下の工程を有する半導体装置の製造方法;
(a)半導体基板の第1面に半導体素子および第4電極を形成した後、前記半導体素子および前記第4電極の上層に第1絶縁膜を形成する工程、
(b)前記第1絶縁膜の所定の領域に前記第4電極に達する複数の孔を形成した後、前記複数の孔の内部に導電性材料を埋め込み、複数のコンタクトプラグを形成する工程、
(c)前記複数のコンタクトプラグに接続する第1電極を形成する工程、
(d)前記半導体基板を貫通するリング状の溝部を前記半導体基板の前記第1面と反対の第2面の側から形成する工程、
(e)前記リング状の溝部の内部を含む前記半導体基板の前記第2面に第2絶縁膜を形成する工程、
(f)前記リング状の溝部の内側の前記第2絶縁膜および前記半導体基板に、前記半導体基板の前記第2面の側から貫通孔を形成する工程、
(g)前記貫通孔の内壁を含み、前記半導体基板の前記第2面に前記第4電極に接続するシード層を形成する工程、
(h)前記貫通孔の周囲の前記半導体基板の前記第2面に形成された前記シード層上に第2電極を形成し、同時に前記貫通孔の内壁に形成された前記シード層上に第3電極を形成する工程、
(i)前記第2および第3電極が形成された領域以外の前記シード層を除去する工程。 - 請求項9記載の半導体装置の製造方法において、前記(d)工程の前に、
(j)前記半導体基板の前記第2面を研削して、前記半導体基板を所定の厚さにする工程、
をさらに含むことを特徴とする半導体装置の製造方法。 - 請求項9記載の半導体装置の製造方法において、前記(i)工程の後に、
(k)前記第1電極にバンプを接続する工程、
をさらに含むことを特徴とする半導体装置の製造方法。 - 請求項1、6または9のいずれか1項に記載の半導体装置の製造方法において、前記リング状の溝部の内部を完全に前記第2絶縁膜により埋め込むことを特徴とする半導体装置の製造方法。
- 請求項1、6または9のいずれか1項に記載の半導体装置の製造方法において、前記リング状の溝部の内部に空洞が形成されることを特徴とする半導体装置の製造方法。
- 請求項1、6または9のいずれか1項に記載の半導体装置の製造方法において、前記リング状の溝部の幅は2〜10μmであることを特徴とする半導体装置の製造方法。
- 請求項1、6または9のいずれか1項に記載の半導体装置の製造方法において、前記貫通孔の内径は5〜40μmであることを特徴とする半導体装置の製造方法。
- 請求項6または9に記載の半導体装置の製造方法において、前記複数の孔の内径は1〜2μmであることを特徴とする半導体装置の製造方法。
- 半導体基板の第1面から、前記第1面の反対側の第2面へ貫通する貫通孔と、
前記半導体基板の前記第1面に形成された半導体素子を覆う第1絶縁膜と、
前記第1絶縁膜の上層に形成されて、外部電極と接続する第1電極と、
前記貫通孔と前記第1電極との間の前記第1絶縁膜に形成された開口部と、
前記貫通孔および前記開口部の内壁、ならびに前記貫通孔の周囲の前記半導体基板の前記第2面に、前記第1電極と接続して形成されたシード層と、
前記貫通孔の周囲の前記半導体基板の前記第2面に前記シード層を介して形成された第2電極と、前記貫通孔および前記開口部の内壁に前記シード層を介して形成された第3電極とを備える半導体装置であって、さらに、
前記貫通孔の周囲の前記半導体基板に、前記貫通孔から所定の距離を有して形成されたリング状の溝部と、
前記リング状の溝部の内部、および前記半導体基板の前記第2面と前記第2電極下の前記シード層との間に形成された第2絶縁膜とを有することを特徴とする半導体装置。 - 請求項17記載の半導体装置において、前記貫通孔の内径と前記開口部の内径とが同じであることを特徴とする半導体装置。
- 半導体基板の第1面から、前記第1面の反対側の第2面へ貫通する貫通孔と、
前記半導体基板の前記第1面に形成された半導体素子を覆う第1絶縁膜と、
前記第1絶縁膜の上層に形成されて、外部電極と接続する第1電極と、
前記貫通孔と前記第1電極との間の前記第1絶縁膜に形成された複数の孔と、
前記複数の孔の内部に埋め込まれて、前記第1電極と接続する導電性材料からなる複数のコンタクトプラグと、
前記貫通孔の内壁、および前記貫通孔の周囲の前記半導体基板の前記第2面に、前記複数のコンタクトプラグと接続して形成されたシード層と、
前記貫通孔の周囲の前記半導体基板の前記第2面に前記シード層を介して形成された第2電極と、前記貫通孔の内壁に前記シード層を介して形成された第3電極とを備える半導体装置であって、さらに、
前記貫通孔の周囲の前記半導体基板に、前記貫通孔から所定の距離を有して形成されたリング状の溝部と、
前記リング状の溝部の内部、および前記半導体基板の前記第2面と前記第2電極下の前記シード層との間に形成された第2絶縁膜とを有することを特徴とする半導体装置。 - 半導体基板の第1面から、前記第1面の反対側の第2面へ貫通する貫通孔と、
前記半導体基板の前記第1面に形成された半導体素子、および前記貫通孔と繋がる第4電極と、
前記半導体素子および前記第4電極を覆う第1絶縁膜と、
前記半導体基板の前記第1面の前記第1絶縁膜の下層に形成された第4電極と、
前記第1絶縁膜の上層に形成されて、外部電極と接続する第1電極と、
前記第1電極と前記第4電極との間の前記第1絶縁膜に形成された複数の孔と、
前記複数の孔の内部に埋め込まれて、前記第1および第4電極と接続する導電性材料からなる複数のコンタクトプラグと、
前記貫通孔の内壁、および前記貫通孔の周囲の前記半導体基板の前記第2面に、前記第4電極と接続して形成されたシード層と、
前記貫通孔の周囲の前記半導体基板の前記第2面に前記シード層を介して形成された第2電極と、前記貫通孔の内壁に前記シード層を介して形成された第3電極とを備える半導体装置であって、さらに、
前記貫通孔の周囲の前記半導体基板に、前記貫通孔から所定の距離を有して形成されたリング状の溝部と、
前記リング状の溝部の内部および前記半導体基板の前記第2面と前記第2電極下の前記シード層との間に形成された第2絶縁膜とを有することを特徴とする半導体装置。 - 請求項17、19または20のいずれか1項に記載の半導体装置において、前記リング状の溝部の内部に前記第2絶縁膜が完全に埋め込まれていることを特徴とする半導体装置。
- 請求項17、19または20のいずれか1項に記載の半導体装置において、前記リング状の溝部の内部に空洞を有することを特徴とする半導体装置。
- 請求項17、19または20のいずれか1項に記載の半導体装置において、前記リング状の溝部の幅は2〜10μmであることを特徴とする半導体装置。
- 請求項17、19または20のいずれか1項に記載の半導体装置において、前記貫通孔の内径は5〜40μmであることを特徴とする半導体装置。
- 請求項17、19または20のいずれか1項に記載の半導体装置において、前記第2絶縁膜は酸化シリコン膜であることを特徴とする半導体装置。
- 請求項17、19または20のいずれか1項に記載の半導体装置において、前記第2および第3電極は金膜からなることを特徴とする半導体装置。
- 請求項19または20記載の半導体装置において、前記複数の孔の内径は1〜2μmであることを特徴とする半導体装置。
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US20090189256A1 (en) | 2009-07-30 |
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