IL145333A0 - Dopant pastes for the production of p,p+and n, n+regions in semiconductors - Google Patents
Dopant pastes for the production of p,p+and n, n+regions in semiconductorsInfo
- Publication number
- IL145333A0 IL145333A0 IL14533300A IL14533300A IL145333A0 IL 145333 A0 IL145333 A0 IL 145333A0 IL 14533300 A IL14533300 A IL 14533300A IL 14533300 A IL14533300 A IL 14533300A IL 145333 A0 IL145333 A0 IL 145333A0
- Authority
- IL
- Israel
- Prior art keywords
- semiconductors
- regions
- production
- ppb
- dopant pastes
- Prior art date
Links
- 239000002019 doping agent Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000002562 thickening agent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/02—Polysilicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2225—Diffusion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/228—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
- H01L31/0288—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S252/00—Compositions
- Y10S252/95—Doping agent source material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/923—Diffusion through a layer
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sustainable Development (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Die Bonding (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19910816A DE19910816A1 (de) | 1999-03-11 | 1999-03-11 | Dotierpasten zur Erzeugung von p,p+ und n,n+ Bereichen in Halbleitern |
PCT/EP2000/001694 WO2000054341A1 (de) | 1999-03-11 | 2000-02-29 | Dotierpasten zur erzeugung von p, p+ und n, n+ bereichen in halbleitern |
Publications (1)
Publication Number | Publication Date |
---|---|
IL145333A0 true IL145333A0 (en) | 2002-06-30 |
Family
ID=7900579
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14533300A IL145333A0 (en) | 1999-03-11 | 2000-02-29 | Dopant pastes for the production of p,p+and n, n+regions in semiconductors |
IL145333A IL145333A (en) | 1999-03-11 | 2001-09-09 | Dopant pastes for the production of p,p+and n, n+ regions in semiconductors |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL145333A IL145333A (en) | 1999-03-11 | 2001-09-09 | Dopant pastes for the production of p,p+and n, n+ regions in semiconductors |
Country Status (16)
Country | Link |
---|---|
US (1) | US6695903B1 (ja) |
EP (2) | EP1166366B1 (ja) |
JP (1) | JP2002539615A (ja) |
KR (1) | KR100697439B1 (ja) |
CN (1) | CN1343376A (ja) |
AT (1) | ATE535943T1 (ja) |
AU (1) | AU766807B2 (ja) |
CA (1) | CA2367137A1 (ja) |
DE (1) | DE19910816A1 (ja) |
IL (2) | IL145333A0 (ja) |
IN (1) | IN2001KO01049A (ja) |
MX (1) | MXPA01009113A (ja) |
NO (1) | NO20014384D0 (ja) |
PL (1) | PL350966A1 (ja) |
TW (1) | TW492081B (ja) |
WO (1) | WO2000054341A1 (ja) |
Families Citing this family (146)
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AU2001242510B2 (en) * | 2000-04-28 | 2006-02-23 | Merck Patent Gmbh | Etching pastes for inorganic surfaces |
JP3922334B2 (ja) * | 2000-07-12 | 2007-05-30 | サンケン電気株式会社 | 半導体装置の製造方法 |
JP3922337B2 (ja) * | 2000-08-28 | 2007-05-30 | サンケン電気株式会社 | 液状不純物源材料及びこれを使用した半導体装置の製造方法 |
DE10058031B4 (de) * | 2000-11-23 | 2007-11-22 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Bildung leicht dotierter Halogebiete und Erweiterungsgebiete in einem Halbleiterbauelement |
DE10104726A1 (de) | 2001-02-02 | 2002-08-08 | Siemens Solar Gmbh | Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht |
JP2002299274A (ja) * | 2001-04-02 | 2002-10-11 | Sanken Electric Co Ltd | 半導体装置の製造方法 |
JP4726354B2 (ja) * | 2001-08-22 | 2011-07-20 | 東洋アルミニウム株式会社 | ペースト組成物およびそれを用いた太陽電池 |
JP2003179243A (ja) * | 2001-08-31 | 2003-06-27 | Basf Ag | 光電池活性材料およびこれを含む電池 |
DE10150040A1 (de) * | 2001-10-10 | 2003-04-17 | Merck Patent Gmbh | Kombinierte Ätz- und Dotiermedien |
JP3910072B2 (ja) | 2002-01-30 | 2007-04-25 | 東洋アルミニウム株式会社 | ペースト組成物およびそれを用いた太陽電池 |
JP4549655B2 (ja) * | 2003-11-18 | 2010-09-22 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 機能性塗料 |
JP4368230B2 (ja) * | 2004-03-30 | 2009-11-18 | 電気化学工業株式会社 | ホウ素化合物の固定方法及びホウ素拡散源 |
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JP2006310368A (ja) * | 2005-04-26 | 2006-11-09 | Shin Etsu Handotai Co Ltd | 太陽電池の製造方法及び太陽電池 |
DE102005025933B3 (de) * | 2005-06-06 | 2006-07-13 | Centrotherm Photovoltaics Gmbh + Co. Kg | Dotiergermisch für die Dotierung von Halbleitern |
JP4541243B2 (ja) * | 2005-07-22 | 2010-09-08 | 日本合成化学工業株式会社 | ホウ素拡散用塗布液 |
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JP5283824B2 (ja) * | 2006-01-18 | 2013-09-04 | 東京応化工業株式会社 | 膜形成組成物 |
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- 2000-02-29 WO PCT/EP2000/001694 patent/WO2000054341A1/de active IP Right Grant
- 2000-02-29 EP EP00918752A patent/EP1166366B1/de not_active Expired - Lifetime
- 2000-02-29 IL IL14533300A patent/IL145333A0/xx unknown
- 2000-02-29 CN CN00804875A patent/CN1343376A/zh active Pending
- 2000-02-29 AU AU39601/00A patent/AU766807B2/en not_active Ceased
- 2000-02-29 US US09/936,285 patent/US6695903B1/en not_active Expired - Lifetime
- 2000-02-29 CA CA002367137A patent/CA2367137A1/en not_active Abandoned
- 2000-02-29 JP JP2000604469A patent/JP2002539615A/ja active Pending
- 2000-02-29 EP EP10182228.6A patent/EP2276058B1/de not_active Expired - Lifetime
- 2000-02-29 PL PL00350966A patent/PL350966A1/xx unknown
- 2000-02-29 AT AT00918752T patent/ATE535943T1/de active
- 2000-03-07 TW TW089104087A patent/TW492081B/zh not_active IP Right Cessation
-
2001
- 2001-09-09 IL IL145333A patent/IL145333A/en not_active IP Right Cessation
- 2001-09-10 NO NO20014384A patent/NO20014384D0/no not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
---|---|
KR100697439B1 (ko) | 2007-03-20 |
EP2276058B1 (de) | 2016-02-17 |
NO20014384L (no) | 2001-09-10 |
PL350966A1 (en) | 2003-02-24 |
WO2000054341A1 (de) | 2000-09-14 |
JP2002539615A (ja) | 2002-11-19 |
TW492081B (en) | 2002-06-21 |
AU766807B2 (en) | 2003-10-23 |
EP1166366A1 (de) | 2002-01-02 |
ATE535943T1 (de) | 2011-12-15 |
CA2367137A1 (en) | 2000-09-14 |
AU3960100A (en) | 2000-09-28 |
MXPA01009113A (es) | 2002-02-28 |
US6695903B1 (en) | 2004-02-24 |
IN2001KO01049A (ja) | 2006-03-17 |
NO20014384D0 (no) | 2001-09-10 |
EP1166366B1 (de) | 2011-11-30 |
KR20010112313A (ko) | 2001-12-20 |
CN1343376A (zh) | 2002-04-03 |
IL145333A (en) | 2009-06-15 |
EP2276058A1 (de) | 2011-01-19 |
DE19910816A1 (de) | 2000-10-05 |
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