HK1259005A1 - 曝光設備、曝光方法以及裝置製造方法 - Google Patents
曝光設備、曝光方法以及裝置製造方法Info
- Publication number
- HK1259005A1 HK1259005A1 HK19101492.0A HK19101492A HK1259005A1 HK 1259005 A1 HK1259005 A1 HK 1259005A1 HK 19101492 A HK19101492 A HK 19101492A HK 1259005 A1 HK1259005 A1 HK 1259005A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- device manufacturing
- exposure apparatus
- exposure method
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006237045 | 2006-08-31 | ||
JP2006237606 | 2006-09-01 | ||
JP2006237491 | 2006-09-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1259005A1 true HK1259005A1 (zh) | 2019-11-22 |
Family
ID=39136023
Family Applications (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09108556.0A HK1130944A1 (zh) | 2006-08-31 | 2009-09-18 | 曝光裝置、曝光方法、以及設備製造方法 |
HK12109422.5A HK1168662A1 (zh) | 2006-08-31 | 2012-09-25 | 曝光方法和裝置、以及組件製造方法 |
HK12110558.9A HK1169863A1 (zh) | 2006-08-31 | 2012-10-24 | 移動體驅動方法和移動體驅動系統、以及曝光方法和裝置 |
HK14107076.6A HK1193879A1 (zh) | 2006-08-31 | 2014-07-11 | 曝光設備和曝光方法 |
HK16106083.7A HK1218184A1 (zh) | 2006-08-31 | 2016-05-30 | 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及組件製造方法 |
HK16106141.7A HK1218187A1 (zh) | 2006-08-31 | 2016-05-31 | 可移動體驅動方法和可移動體驅動系統、模式形成方法和裝置、曝光方法和裝置以及設備製造方法 |
HK16112134.4A HK1224021A1 (zh) | 2006-08-31 | 2016-10-20 | 曝光裝置,曝光方法和器件製造方法 |
HK16112168.3A HK1224022A1 (zh) | 2006-08-31 | 2016-10-24 | 曝光裝置、曝光方法和設備製造方法 |
HK18107772.9A HK1248325B (zh) | 2006-08-31 | 2018-06-15 | 曝光設備、曝光方法以及裝置製造方法 |
HK19101492.0A HK1259005A1 (zh) | 2006-08-31 | 2019-01-29 | 曝光設備、曝光方法以及裝置製造方法 |
Family Applications Before (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09108556.0A HK1130944A1 (zh) | 2006-08-31 | 2009-09-18 | 曝光裝置、曝光方法、以及設備製造方法 |
HK12109422.5A HK1168662A1 (zh) | 2006-08-31 | 2012-09-25 | 曝光方法和裝置、以及組件製造方法 |
HK12110558.9A HK1169863A1 (zh) | 2006-08-31 | 2012-10-24 | 移動體驅動方法和移動體驅動系統、以及曝光方法和裝置 |
HK14107076.6A HK1193879A1 (zh) | 2006-08-31 | 2014-07-11 | 曝光設備和曝光方法 |
HK16106083.7A HK1218184A1 (zh) | 2006-08-31 | 2016-05-30 | 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及組件製造方法 |
HK16106141.7A HK1218187A1 (zh) | 2006-08-31 | 2016-05-31 | 可移動體驅動方法和可移動體驅動系統、模式形成方法和裝置、曝光方法和裝置以及設備製造方法 |
HK16112134.4A HK1224021A1 (zh) | 2006-08-31 | 2016-10-20 | 曝光裝置,曝光方法和器件製造方法 |
HK16112168.3A HK1224022A1 (zh) | 2006-08-31 | 2016-10-24 | 曝光裝置、曝光方法和設備製造方法 |
HK18107772.9A HK1248325B (zh) | 2006-08-31 | 2018-06-15 | 曝光設備、曝光方法以及裝置製造方法 |
Country Status (9)
Country | Link |
---|---|
US (6) | US20080094592A1 (zh) |
EP (8) | EP3064999B1 (zh) |
JP (13) | JP5035245B2 (zh) |
KR (14) | KR101824374B1 (zh) |
CN (3) | CN101405840B (zh) |
HK (10) | HK1130944A1 (zh) |
SG (2) | SG10201407395SA (zh) |
TW (8) | TWI653511B (zh) |
WO (1) | WO2008026742A1 (zh) |
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CN104656377B (zh) * | 2006-08-31 | 2017-07-07 | 株式会社尼康 | 曝光方法、曝光装置、及组件制造方法 |
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- 2012-04-20 JP JP2012096250A patent/JP5522489B2/ja active Active
- 2012-09-25 HK HK12109422.5A patent/HK1168662A1/zh not_active IP Right Cessation
- 2012-10-24 HK HK12110558.9A patent/HK1169863A1/zh not_active IP Right Cessation
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2013
- 2013-08-01 JP JP2013160145A patent/JP5686164B2/ja not_active Expired - Fee Related
- 2013-10-30 US US14/067,503 patent/US9983486B2/en not_active Expired - Fee Related
- 2013-10-30 US US14/067,110 patent/US9958792B2/en not_active Expired - Fee Related
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2014
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- 2014-07-11 HK HK14107076.6A patent/HK1193879A1/zh not_active IP Right Cessation
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2015
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2016
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2017
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2018
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2019
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