FI20050646A - Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion - Google Patents

Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion Download PDF

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Publication number
FI20050646A
FI20050646A FI20050646A FI20050646A FI20050646A FI 20050646 A FI20050646 A FI 20050646A FI 20050646 A FI20050646 A FI 20050646A FI 20050646 A FI20050646 A FI 20050646A FI 20050646 A FI20050646 A FI 20050646A
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Finland
Prior art keywords
circuit board
board structure
manufacturing
circuit
board
Prior art date
Application number
FI20050646A
Other languages
English (en)
Finnish (fi)
Other versions
FI119714B (sv
FI20050646A0 (sv
Inventor
Risto Tuominen
Antti Iihola
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Publication of FI20050646A0 publication Critical patent/FI20050646A0/sv
Priority to FI20050646A priority Critical patent/FI119714B/sv
Priority to US11/917,737 priority patent/US8581109B2/en
Priority to PCT/FI2006/000207 priority patent/WO2006134216A2/en
Priority to KR1020087000597A priority patent/KR101090423B1/ko
Priority to EP06764433.6A priority patent/EP1891845B1/en
Priority to JP2008516355A priority patent/JP5025644B2/ja
Priority to CN200680021055A priority patent/CN100596258C/zh
Priority to GB0724097.1A priority patent/GB2441265B/en
Priority to DE112006001506T priority patent/DE112006001506T5/de
Priority to CN2006800210573A priority patent/CN101199244B/zh
Priority to PCT/FI2006/000211 priority patent/WO2006134220A1/en
Priority to US11/917,724 priority patent/US8225499B2/en
Priority to JP2008516357A priority patent/JP2008544512A/ja
Publication of FI20050646A publication Critical patent/FI20050646A/sv
Application granted granted Critical
Publication of FI119714B publication Critical patent/FI119714B/sv
Priority to US14/076,292 priority patent/US9622354B2/en
Priority to US15/355,096 priority patent/US11134572B2/en
Priority to US17/460,458 priority patent/US11792941B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/22—Secondary treatment of printed circuits
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FI20050646A 2005-06-16 2005-06-16 Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion FI119714B (sv)

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FI20050646A FI119714B (sv) 2005-06-16 2005-06-16 Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
US11/917,737 US8581109B2 (en) 2005-06-16 2006-06-15 Method for manufacturing a circuit board structure
PCT/FI2006/000207 WO2006134216A2 (en) 2005-06-16 2006-06-15 Circuit board structure and method for manufacturing a circuit board structure
KR1020087000597A KR101090423B1 (ko) 2005-06-16 2006-06-15 회로 보드 구조체 및 회로 보드 구조체 제조 방법
EP06764433.6A EP1891845B1 (en) 2005-06-16 2006-06-15 Method for manufacturing a circuit board structure
JP2008516355A JP5025644B2 (ja) 2005-06-16 2006-06-15 回路基板構造および回路基板構造の製造方法
CN200680021055A CN100596258C (zh) 2005-06-16 2006-06-15 电路板结构的制造方法和电路板结构
DE112006001506T DE112006001506T5 (de) 2005-06-16 2006-06-16 Platinenstruktur und Verfahren zu ihrer Herstellung
GB0724097.1A GB2441265B (en) 2005-06-16 2006-06-16 Method for manufacturing a circuit board structure, and a circuit board structure
CN2006800210573A CN101199244B (zh) 2005-06-16 2006-06-16 电路板结构的制造方法和电路板结构
PCT/FI2006/000211 WO2006134220A1 (en) 2005-06-16 2006-06-16 Method for manufacturing a circuit board structure, and a circuit board structure
US11/917,724 US8225499B2 (en) 2005-06-16 2006-06-16 Method for manufacturing a circuit board structure, and a circuit board structure
JP2008516357A JP2008544512A (ja) 2005-06-16 2006-06-16 回路基板構造体およびその製造方法
US14/076,292 US9622354B2 (en) 2005-06-16 2013-11-11 Method for manufacturing a circuit board structure
US15/355,096 US11134572B2 (en) 2005-06-16 2016-11-18 Circuit board structure and method for manufacturing a circuit board structure
US17/460,458 US11792941B2 (en) 2005-06-16 2021-08-30 Circuit board structure and method for manufacturing a circuit board structure

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US9622354B2 (en) 2017-04-11
KR101090423B1 (ko) 2011-12-07
US20210392752A1 (en) 2021-12-16
FI119714B (sv) 2009-02-13
EP1891845B1 (en) 2016-08-10
CN100596258C (zh) 2010-03-24
JP5025644B2 (ja) 2012-09-12
EP1891845A2 (en) 2008-02-27
KR20080038124A (ko) 2008-05-02
CN101199246A (zh) 2008-06-11
US11134572B2 (en) 2021-09-28
US11792941B2 (en) 2023-10-17
US20170071061A1 (en) 2017-03-09
US20140059851A1 (en) 2014-03-06
JP2008544510A (ja) 2008-12-04
FI20050646A0 (sv) 2005-06-16
US20080202801A1 (en) 2008-08-28
WO2006134216A2 (en) 2006-12-21
WO2006134216A3 (en) 2007-07-05
US8581109B2 (en) 2013-11-12

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