FI115285B - Förfarande för insänkning av en komponent i ett basmaterial och för bildning av en kontakt - Google Patents

Förfarande för insänkning av en komponent i ett basmaterial och för bildning av en kontakt Download PDF

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Publication number
FI115285B
FI115285B FI20020190A FI20020190A FI115285B FI 115285 B FI115285 B FI 115285B FI 20020190 A FI20020190 A FI 20020190A FI 20020190 A FI20020190 A FI 20020190A FI 115285 B FI115285 B FI 115285B
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Finland
Prior art keywords
component
substrate
base plate
film
tape
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FI20020190A
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English (en)
Finnish (fi)
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FI20020190A0 (sv
FI20020190A (sv
Inventor
Risto Tuominen
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Imbera Electronics Oy
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Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Publication of FI20020190A0 publication Critical patent/FI20020190A0/sv
Priority to FI20020190A priority Critical patent/FI115285B/sv
Priority to KR1020047011833A priority patent/KR101013325B1/ko
Priority to PCT/FI2003/000064 priority patent/WO2003065778A1/en
Priority to CNB038031353A priority patent/CN100566511C/zh
Priority to RU2004126137/09A priority patent/RU2297736C2/ru
Priority to DE60300619T priority patent/DE60300619T2/de
Priority to EP03700815A priority patent/EP1474959B1/en
Priority to KR1020107023652A priority patent/KR20100126546A/ko
Priority to AT03700815T priority patent/ATE295064T1/de
Priority to US10/502,340 priority patent/US6991966B2/en
Priority to JP2003565216A priority patent/JP2005517287A/ja
Priority to BRPI0307364A priority patent/BRPI0307364B1/pt
Publication of FI20020190A publication Critical patent/FI20020190A/sv
Priority to IL163238A priority patent/IL163238A/en
Application granted granted Critical
Publication of FI115285B publication Critical patent/FI115285B/sv
Priority to HK05108993.5A priority patent/HK1077151A1/xx

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Reverberation, Karaoke And Other Acoustics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Claims (19)

1. Förfarande för insänkning av en komponent (8) i ett basmaterial och för bildning av elektriska kontakter med komponenten (8), vid vilket förfarande - en basplatta (1) väljs som basmaterial, 5. ett häl (6) utformas i basplattan (1), - komponenten (8) anordnas i hälet (6), varvid en första yta hos komponenten uppvisar kontaktomräden eller kontaktutspräng för att bilda elektriska kontakter, - komponenten (8) fasts pä plats i hälet (6), som utformats i basplattan (1), 10. ett isoleringsskikt (10) tillverkas pä ätminstone en yta av basmaterialet pä sä sätt, att isoleringsskiktet (10) täcker komponenten (8), - i isoleringsskiktet (10) utformas kontaktöppningar (12) för komponenten (8), och , ·. - i kontaktöppningarna (12) och pä isoleringskiktet (10) tillverkas ledare (13) . ·. 15 för att bilda elektriska kontakter med komponenten (8), kännetecknat av att ;' : - pä basplattan (1) tillverkas ledarmönster (4), # - en position för hälet (6) väljs och komponenten (8) inpassas i förhällande tili , de pä basplattan (1) tillverkade ledarmönstren (4), > · ’: 20 och efter tillverkningen av hälet (6) - lamineras tejp (7) eller en tejpaktig film pä basplattans (1) andra yta (1 b), 1 » » · » · / . - komponenten (8) anordnas i hälet (6) utformat i basplattan (1) frän bas- , ’ _, plattans (1) första yta (la) pä sä sätt, att mikrokretsens (8) första yta kommer * t 1 1 5 2 8 F att ligga mot tejpen (7) eller den tejpaktiga filmen och väsentligen i samma plan som basplattans (1) andra yta (Ib), - komponenten (8) fästs pä plats i hälet (6) utformat i kretskortet genom att fylla hälet (6) med fyllnadsmaterial (9), och 5. efter att komponenten (8) fästs avlägsnas den tejp (7) eller tejpaktiga film som laminerats pä basplattans (1) andra yta (Ib),
2. Förfarande i enlighet med patentkrav 1, kännetecknat avattpä sidoväggama av hälet (6) utformat för komponenten (8) odlas ledarmaterial för att 10 utbilda ett stömingsskydd runt komponenten (8).
3. Förfarande i enlighet med patentkrav 1 eller 2, kännetecknat av att den komponent (8) som skall anordnas i hälet (6) utgörs av en mikrokrets. 15
4. Förfarande i enlighet med patentkrav 3, kännetecknat av att efter ·.· avlägsnande av den tejp (7) eller tejpaktiga film som laminerats pä basplattans (1) : andra yta (Ib) » f - lamineras en RCC-film (10, 11) pä basplattans (1) andra yta (1 b), och » - i RCC-filmen (10, 11) tillverkas ledarmönster (13) samt kontaktöppningar ...: * 20 (12) för komponenten (8).
5. Förfarande i enlighet med patentkrav 3, kännetecknat av att i .:. basmaterialet utformas häl (3) för genomföringar, och efter avlägsnande av den tejp ; ‘ . (7) eller tejpaktiga film som laminerats pä basplattans (1) andra yta (Ib) • · I 1 1 5 2 8 F - lamineras RCC-filmer (10, 11) pä basplattans (1) första och andra yta (la, Ib), ledarmönster (13) samt kontaktöppningar (12) för komponenten (8) och genomföringama tillverkas i RCC-filmen (10, 11), som är laminerad pä den 5 andra ytan (1 b) av basplattan (1), och - ledarmönster (13) samt kontaktöppningar (12) för genomföringama tili-verkas i RCC-filmen (10, 11), som är laminerad pä basplattans (1) första yta (la). 10
6. Förfarande i enlighet med patentkrav 3, kännetecknat avatt efiter avlägsnande av den tejp (7) eller tejpaktiga film som laminerats pä basplattans (1) andra yta (Ib) - tillverkas en pre-preg-epoxifilm (10) pä basplattans (1) andra yta (1 b), *, - kontaktöppningar (12) för komponenten (8) tillverkas i epoxifilmen (10), 15 och - ledarmönster (13) tillverkas pä epoxifilmen (10).
7. Förfarande i enlighet med patentkrav 3, kännetecknat avatti basmaterialet utformas häl (3) för genomföringar, och efter avlägsnande av den tejp ’ -! 20 (7) eller tejpaktiga film som laminerats pä basplattans (1) andra yta (Ib) : - lamineras pre-preg-epoxifilmer (10) pä basplattans (1) första och andra yta ·:· : (la, Ib), ..!:" - kontaktöppningar (12) för komponenten (8) och genomföringama tillverkas .. · i epoxifilmen (10) pä basplattans (1) andra yta (Ib), och 1 1 5 2 8 F kontaktöppningar för genomföringama (12) tillverkas i epoxifilmen (10) pä basplattans (1) första yta (la).
8. Förfarande i enlighet med nagot av patentkraven 3-7, kännetecknat av 5 att i mikrokretsen (8) bildas en elektrisk kontakt i riktningen frän basplattans (1) andra yta (Ib) efter att mikrokretsen (8) är anordnad i hälet (6) utformat i basplattan (1).
9. Förfarande i enlighet med nagot av patentkraven 3-8, kännetecknat av 10 att i mikrokretsen (8) bildas en elektrisk kontakt genom att pä mikrokretsens (8) kontaktomräden eller kontaktutspräng odla ett ledande material.
10. Förfarande i enlighet med nagot av patentkraven 3-9, kännetecknat av att den elektriska kontakten med mikrokretsen (8) bildas utan lod medelst en . 15 kretskortstillverkningsteknik. » t
» » , 11. Förfarande i enlighet med nagot av patentkraven 1-10, kännetecknat av att i basmaterialet insänks pä motsvarande sätt flera än en komponent (8). 20
12. Förfarande i enlighet med patentkrav 11, kännetecknat av att i • * · 'll; basplattan (1) utformas ett eget häl (6) för varje komponent (8) som skall insänkas i ’ · ‘ basmaterialet, och varje komponent (8) som skall insänkas i basmaterialet anordnas i • I ' · '; ett eget häl (6). » ♦ · f # » * « • i » * · : ” ; 25
13. Förfarande i enlighet med nägot av patentkraven 1-12, kännetecknat av att i basmaterialet insänks ätminstone tvä mikrokretsar (8), och av att ett 1 1 5 2 8 F ledarskikt ¢13) odlas, som är direkt anslutet tili kontaktomrädena eller kontakt-utsprängen i ätminstone tvä mikrokretsar (8) för att elektriskt sammankoppla mikrokretsema (8) tili en funktionell helhet. 5
14. Förfarandeienlighetmednägotavpatentkraven 1-13, kännetecknat av att en multiskiktsstruktur med ätminstone fyra pä varandra liggande ledarskikt (4,13) tillverkas.
15. Förfarande i enlighet med nägot av patentkraven 1-14, kännetecknat 10 av att ett första basmaterial och ätminstone ett andra basmaterial tillverkas, och bas- materialen staplas och fasts ovanpä varandra pä sä sätt, att basmaterialen inpassas i förhällande tili varandra.
16. Förfarande i enlighet med nägot av patentkraven 1-14, kännetecknat av 15 att - ett första och andra basmaterial samt ett mellanskikt (21) tillverkas, ' - det andra basmaterialet anordnas ovanpä det första, och det andra basmaterialet inpassas i förhällande tili det första basmaterialet, » » - mellanskiktet (21) bringas mellan det första och andra basmaterialet, och 20. det första och andra basmaterialet lamineras tili varandra med hjälp av mellanskiktet (21).
17. Förfarande i enlighet med patentkrav 16, kännetecknat av att · , - ätminstone ett tredje basmaterial samt ett mellanskikt (21) för vart tredje 25 basmaterial tillverkas, 115285 vart tredje basmaterial anordnas i sin tur ovanför det första och andra basmaterialet, och vart tredje basmaterial inpassas i förhällande till ett undre basmaterial, - ett mellanskikt (21) bringas under vart tredje basmaterial, och 5. det första, andra och vart tredje basmaterial lamineras till varandra med hjälp av mellanskikten (21).
18. Förfarande i enlighet med nägot av patentkraven 15-17, kännetecknat av att genom de pä varandra fästa basmaterialen borras häl (23) för genomföringar, 10 och i de borrade hälen (23) utbildas ledare för att koppia elektronikkretsama pä vaije basmaterial tili varandra för att bilda en funktionell helhet.
19. Förfarande i enlighet med nägot av patentkraven 1-18, kännetecknat av att temperaturen av basplattan (4), komponenten (8) och ledarskiktet (13) i direkt 15 anslutning tili komponenten (8) under processen uppgär till under 200 °C, och :': företrädesvis tili mellan 20 och 85 °C. » 1 »
FI20020190A 2002-01-31 2002-01-31 Förfarande för insänkning av en komponent i ett basmaterial och för bildning av en kontakt FI115285B (sv)

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FI20020190A FI115285B (sv) 2002-01-31 2002-01-31 Förfarande för insänkning av en komponent i ett basmaterial och för bildning av en kontakt
EP03700815A EP1474959B1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
AT03700815T ATE295064T1 (de) 2002-01-31 2003-01-28 Verfahren zum einbetten einer komponente in eine basis und zur bildung eines kontakts
CNB038031353A CN100566511C (zh) 2002-01-31 2003-01-28 用于将元件置入于基座中并且形成接触的方法
RU2004126137/09A RU2297736C2 (ru) 2002-01-31 2003-01-28 Способ встраивания компонента в основание и формирования электрического контакта с компонентом
DE60300619T DE60300619T2 (de) 2002-01-31 2003-01-28 Verfahren zum einbetten einer komponente in eine basis und zur bildung eines kontakts
KR1020047011833A KR101013325B1 (ko) 2002-01-31 2003-01-28 베이스에 부품을 삽입하고 콘택을 형성하는 방법
KR1020107023652A KR20100126546A (ko) 2002-01-31 2003-01-28 베이스에 부품을 삽입하고 콘택을 형성하는 방법
PCT/FI2003/000064 WO2003065778A1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
US10/502,340 US6991966B2 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact
JP2003565216A JP2005517287A (ja) 2002-01-31 2003-01-28 構成要素をベースに埋め込み接触を形成する方法
BRPI0307364A BRPI0307364B1 (pt) 2002-01-31 2003-01-28 método para embutir um componente em uma base e produzir um contato, e módulo eletrônico fabricado usando o referido método
IL163238A IL163238A (en) 2002-01-31 2004-07-27 Method for embedding a component in a base and forming a contact
HK05108993.5A HK1077151A1 (en) 2002-01-31 2005-10-12 Method for embedding a component in a base and forming a contact

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EP1474959A1 (en) 2004-11-10
DE60300619D1 (de) 2005-06-09
KR101013325B1 (ko) 2011-02-09
DE60300619T2 (de) 2006-01-19
FI20020190A0 (sv) 2002-01-31
US6991966B2 (en) 2006-01-31
WO2003065778A1 (en) 2003-08-07
US20050124148A1 (en) 2005-06-09
BRPI0307364B1 (pt) 2017-02-21
RU2004126137A (ru) 2005-06-10
JP2005517287A (ja) 2005-06-09
HK1077151A1 (en) 2006-02-03
FI20020190A (sv) 2003-08-01
KR20040073606A (ko) 2004-08-19
KR20100126546A (ko) 2010-12-01
BR0307364A (pt) 2004-12-14
IL163238A (en) 2009-06-15
ATE295064T1 (de) 2005-05-15
EP1474959B1 (en) 2005-05-04
RU2297736C2 (ru) 2007-04-20
CN100566511C (zh) 2009-12-02
CN1625927A (zh) 2005-06-08

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