GB2451908B - Mems package - Google Patents

Mems package

Info

Publication number
GB2451908B
GB2451908B GB0716187A GB0716187A GB2451908B GB 2451908 B GB2451908 B GB 2451908B GB 0716187 A GB0716187 A GB 0716187A GB 0716187 A GB0716187 A GB 0716187A GB 2451908 B GB2451908 B GB 2451908B
Authority
GB
United Kingdom
Prior art keywords
mems package
mems
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0716187A
Other versions
GB0716187D0 (en
GB2451908A (en
Inventor
Mark Gillson Hesketh
Richard Ian Laming
Tsjerk Hans Hoekstra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cirrus Logic International UK Ltd
Original Assignee
Wolfson Microelectronics PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfson Microelectronics PLC filed Critical Wolfson Microelectronics PLC
Priority to GB0716187A priority Critical patent/GB2451908B/en
Publication of GB0716187D0 publication Critical patent/GB0716187D0/en
Priority to GB0807926A priority patent/GB2451921A/en
Priority to PCT/GB2008/002783 priority patent/WO2009024764A2/en
Priority to US12/673,930 priority patent/US20110042762A1/en
Priority to TW097131380A priority patent/TW200920686A/en
Publication of GB2451908A publication Critical patent/GB2451908A/en
Application granted granted Critical
Publication of GB2451908B publication Critical patent/GB2451908B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
GB0716187A 2007-08-17 2007-08-17 Mems package Expired - Fee Related GB2451908B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB0716187A GB2451908B (en) 2007-08-17 2007-08-17 Mems package
GB0807926A GB2451921A (en) 2007-08-17 2008-04-30 MEMS package
PCT/GB2008/002783 WO2009024764A2 (en) 2007-08-17 2008-08-15 Mems package
US12/673,930 US20110042762A1 (en) 2007-08-17 2008-08-15 Mems package
TW097131380A TW200920686A (en) 2007-08-17 2008-08-18 MEMS package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0716187A GB2451908B (en) 2007-08-17 2007-08-17 Mems package

Publications (3)

Publication Number Publication Date
GB0716187D0 GB0716187D0 (en) 2007-09-26
GB2451908A GB2451908A (en) 2009-02-18
GB2451908B true GB2451908B (en) 2009-12-02

Family

ID=38566648

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0716187A Expired - Fee Related GB2451908B (en) 2007-08-17 2007-08-17 Mems package

Country Status (1)

Country Link
GB (1) GB2451908B (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324067B1 (en) * 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US20020043706A1 (en) * 2000-06-28 2002-04-18 Institut National D'optique Miniature Microdevice Package and Process for Making Thereof
US20020056898A1 (en) * 2000-11-16 2002-05-16 Lopes Vincent C. Package with environmental control material carrier
US20030000737A1 (en) * 2001-06-30 2003-01-02 Liu Jwei Wien Masking layer in substrate cavity
US6603182B1 (en) * 2002-03-12 2003-08-05 Lucent Technologies Inc. Packaging micromechanical devices
US20040183177A1 (en) * 2003-03-20 2004-09-23 Curtis Harlan L. Methods and apparatus for attaching getters to MEMS device housings
US20040214373A1 (en) * 2003-04-22 2004-10-28 Tongbi Jiang Packaged microelectronic devices and methods for packaging microelectronic devices
US20050161753A1 (en) * 2001-05-18 2005-07-28 Corporation For National Research Initiatives Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US20050185248A1 (en) * 2003-05-22 2005-08-25 Terry Tarn Microelectromechanical device packages with integral heaters
US6986199B2 (en) * 2003-06-11 2006-01-17 The United States Of America As Represented By The Secretary Of The Navy Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
US6998533B2 (en) * 2002-04-11 2006-02-14 Koninklijke Philips Electronics N.V. Electronic device and method of manufacturing same
WO2006134216A2 (en) * 2005-06-16 2006-12-21 Imbera Electronics Oy Circuit board structure and method for manufacturing a circuit board structure
EP1795498A2 (en) * 2005-12-06 2007-06-13 Yamaha Corporation Package for a semiconductor device
EP1886969A2 (en) * 2006-08-07 2008-02-13 Honeywell Inc. Methods of fabrication of wafer-level vacuum packaged devices

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324067B1 (en) * 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US20020043706A1 (en) * 2000-06-28 2002-04-18 Institut National D'optique Miniature Microdevice Package and Process for Making Thereof
US20020056898A1 (en) * 2000-11-16 2002-05-16 Lopes Vincent C. Package with environmental control material carrier
US20050161753A1 (en) * 2001-05-18 2005-07-28 Corporation For National Research Initiatives Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US20030000737A1 (en) * 2001-06-30 2003-01-02 Liu Jwei Wien Masking layer in substrate cavity
US6603182B1 (en) * 2002-03-12 2003-08-05 Lucent Technologies Inc. Packaging micromechanical devices
US6998533B2 (en) * 2002-04-11 2006-02-14 Koninklijke Philips Electronics N.V. Electronic device and method of manufacturing same
US20040183177A1 (en) * 2003-03-20 2004-09-23 Curtis Harlan L. Methods and apparatus for attaching getters to MEMS device housings
US20040214373A1 (en) * 2003-04-22 2004-10-28 Tongbi Jiang Packaged microelectronic devices and methods for packaging microelectronic devices
US20050185248A1 (en) * 2003-05-22 2005-08-25 Terry Tarn Microelectromechanical device packages with integral heaters
US6986199B2 (en) * 2003-06-11 2006-01-17 The United States Of America As Represented By The Secretary Of The Navy Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
WO2006134216A2 (en) * 2005-06-16 2006-12-21 Imbera Electronics Oy Circuit board structure and method for manufacturing a circuit board structure
EP1795498A2 (en) * 2005-12-06 2007-06-13 Yamaha Corporation Package for a semiconductor device
EP1886969A2 (en) * 2006-08-07 2008-02-13 Honeywell Inc. Methods of fabrication of wafer-level vacuum packaged devices

Also Published As

Publication number Publication date
GB0716187D0 (en) 2007-09-26
GB2451908A (en) 2009-02-18

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20150820 AND 20150826

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20230817