FI20085443A - Kretsmodul och förfarande för tillverkning av en kretsmodul - Google Patents
Kretsmodul och förfarande för tillverkning av en kretsmodul Download PDFInfo
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- FI20085443A FI20085443A FI20085443A FI20085443A FI20085443A FI 20085443 A FI20085443 A FI 20085443A FI 20085443 A FI20085443 A FI 20085443A FI 20085443 A FI20085443 A FI 20085443A FI 20085443 A FI20085443 A FI 20085443A
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- circuit module
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- module
- circuit
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- H—ELECTRICITY
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- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20085443A FI123205B (sv) | 2008-05-12 | 2008-05-12 | Kretsmodul och förfarande för tillverkning av en kretsmodul |
US12/990,785 US8699233B2 (en) | 2008-05-12 | 2009-05-11 | Circuit module and method of manufacturing the same |
PCT/FI2009/050383 WO2009138560A1 (en) | 2008-05-12 | 2009-05-11 | Circuit module and method of manufacturing the same |
KR1020107025126A KR20110011614A (ko) | 2008-05-12 | 2009-05-11 | 회로모듈 및 제조방법 |
GB1021002A GB2472953A (en) | 2008-05-12 | 2009-05-11 | Circuit module and method of manufacturing the same |
CN2009801172483A CN102027585B (zh) | 2008-05-12 | 2009-05-11 | 电路模块及其制造方法 |
JP2011508961A JP2011523773A (ja) | 2008-05-12 | 2009-05-11 | 回路モジュールおよびその製造方法 |
US14/231,758 US9107324B2 (en) | 2008-05-12 | 2014-04-01 | Circuit module and method of manufacturing the same |
US14/821,818 US9324647B2 (en) | 2008-05-12 | 2015-08-10 | Circuit module and method of manufacturing the same |
US15/084,530 US9883587B2 (en) | 2008-05-12 | 2016-03-30 | Circuit module and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20085443 | 2008-05-12 | ||
FI20085443A FI123205B (sv) | 2008-05-12 | 2008-05-12 | Kretsmodul och förfarande för tillverkning av en kretsmodul |
Publications (3)
Publication Number | Publication Date |
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FI20085443A0 FI20085443A0 (sv) | 2008-05-12 |
FI20085443A true FI20085443A (sv) | 2009-11-13 |
FI123205B FI123205B (sv) | 2012-12-31 |
Family
ID=39523098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20085443A FI123205B (sv) | 2008-05-12 | 2008-05-12 | Kretsmodul och förfarande för tillverkning av en kretsmodul |
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US (4) | US8699233B2 (sv) |
JP (1) | JP2011523773A (sv) |
KR (1) | KR20110011614A (sv) |
CN (1) | CN102027585B (sv) |
FI (1) | FI123205B (sv) |
GB (1) | GB2472953A (sv) |
WO (1) | WO2009138560A1 (sv) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI123205B (sv) | 2008-05-12 | 2012-12-31 | Imbera Electronics Oy | Kretsmodul och förfarande för tillverkning av en kretsmodul |
FI122217B (sv) * | 2008-07-22 | 2011-10-14 | Imbera Electronics Oy | Multichippaket och framställningsförfarande |
JP2012124397A (ja) * | 2010-12-10 | 2012-06-28 | Cmk Corp | 部品内蔵型多層プリント配線板 |
US8923008B2 (en) * | 2011-03-08 | 2014-12-30 | Ibiden Co., Ltd. | Circuit board and method for manufacturing circuit board |
DE102011107958B4 (de) * | 2011-07-20 | 2020-09-24 | Wilo Se | Überschlagsschutz für eine Anordnung eines Halbleiterbauelements auf einem Substrat |
CN104025728A (zh) * | 2011-10-31 | 2014-09-03 | 名幸电子有限公司 | 元器件内置基板的制造方法及使用该方法制造的元器件内置基板 |
CN103918356A (zh) * | 2011-11-08 | 2014-07-09 | 名幸电子有限公司 | 元器件内置基板的制造方法以及使用该方法制成的元器件内置基板 |
JP6073339B2 (ja) * | 2012-09-11 | 2017-02-01 | 株式会社メイコー | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
WO2014042620A1 (en) * | 2012-09-12 | 2014-03-20 | Hewlett-Packard Development Company, L.P. | Latch for a computer case |
CN104584207A (zh) | 2012-12-21 | 2015-04-29 | 松下知识产权经营株式会社 | 电子部件封装以及其制造方法 |
CN104603932A (zh) | 2012-12-21 | 2015-05-06 | 松下知识产权经营株式会社 | 电子部件封装件及其制造方法 |
WO2014097642A1 (ja) * | 2012-12-21 | 2014-06-26 | パナソニック株式会社 | 電子部品パッケージおよびその製造方法 |
US9825209B2 (en) | 2012-12-21 | 2017-11-21 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component package and method for manufacturing the same |
US20150206819A1 (en) * | 2012-12-21 | 2015-07-23 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component package and method for manufacturing the same |
JPWO2014118916A1 (ja) * | 2013-01-30 | 2017-01-26 | 株式会社メイコー | 部品内蔵基板の製造方法 |
CN106104801A (zh) * | 2014-03-13 | 2016-11-09 | 飞利浦照明控股有限公司 | 照明装置及制造照明装置的方法 |
GB2524791B (en) * | 2014-04-02 | 2018-10-03 | At & S Austria Tech & Systemtechnik Ag | Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate |
KR101640751B1 (ko) | 2014-09-05 | 2016-07-20 | 대덕전자 주식회사 | 인쇄회로기판 및 제조방법 |
JP6862087B2 (ja) * | 2015-12-11 | 2021-04-21 | 株式会社アムコー・テクノロジー・ジャパン | 配線基板、配線基板を有する半導体パッケージ、およびその製造方法 |
CN109425814B (zh) * | 2017-09-01 | 2021-09-10 | 中华精测科技股份有限公司 | 探针组件及其探针结构 |
US10181449B1 (en) * | 2017-09-28 | 2019-01-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure |
US11150701B1 (en) | 2021-04-05 | 2021-10-19 | Ibenzer Inc. | Case for a computing device |
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US4246595A (en) * | 1977-03-08 | 1981-01-20 | Matsushita Electric Industrial Co., Ltd. | Electronics circuit device and method of making the same |
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JPH0632367B2 (ja) * | 1989-01-24 | 1994-04-27 | 富士通株式会社 | セラミック基板のi/oパッドの形成方法 |
US4894115A (en) | 1989-02-14 | 1990-01-16 | General Electric Company | Laser beam scanning method for forming via holes in polymer materials |
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US6242282B1 (en) * | 1999-10-04 | 2001-06-05 | General Electric Company | Circuit chip package and fabrication method |
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JP3813402B2 (ja) * | 2000-01-31 | 2006-08-23 | 新光電気工業株式会社 | 半導体装置の製造方法 |
US6396148B1 (en) * | 2000-02-10 | 2002-05-28 | Epic Technologies, Inc. | Electroless metal connection structures and methods |
EP1259103B1 (en) * | 2000-02-25 | 2007-05-30 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for producing multilayer printed wiring board |
CN101098588B (zh) * | 2000-02-25 | 2011-01-26 | 揖斐电株式会社 | 多层印刷电路板 |
US6350633B1 (en) | 2000-08-22 | 2002-02-26 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
US6562657B1 (en) | 2000-08-22 | 2003-05-13 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint |
JP3711343B2 (ja) * | 2002-06-26 | 2005-11-02 | 株式会社トッパンNecサーキットソリューションズ | 印刷配線板及びその製造方法並びに半導体装置 |
CN2736848Y (zh) * | 2004-09-15 | 2005-10-26 | 鸿富锦精密工业(深圳)有限公司 | 风扇固定装置 |
FI117369B (sv) * | 2004-11-26 | 2006-09-15 | Imbera Electronics Oy | Förfarande för tillverkning av en elektronikmodul |
FI122128B (sv) | 2005-06-16 | 2011-08-31 | Imbera Electronics Oy | Förfarande för tillverkning av kretskortskonstruktion |
FI123205B (sv) | 2008-05-12 | 2012-12-31 | Imbera Electronics Oy | Kretsmodul och förfarande för tillverkning av en kretsmodul |
-
2008
- 2008-05-12 FI FI20085443A patent/FI123205B/sv active IP Right Grant
-
2009
- 2009-05-11 CN CN2009801172483A patent/CN102027585B/zh active Active
- 2009-05-11 JP JP2011508961A patent/JP2011523773A/ja not_active Withdrawn
- 2009-05-11 WO PCT/FI2009/050383 patent/WO2009138560A1/en active Application Filing
- 2009-05-11 GB GB1021002A patent/GB2472953A/en not_active Withdrawn
- 2009-05-11 KR KR1020107025126A patent/KR20110011614A/ko not_active Application Discontinuation
- 2009-05-11 US US12/990,785 patent/US8699233B2/en active Active
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2014
- 2014-04-01 US US14/231,758 patent/US9107324B2/en active Active
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2015
- 2015-08-10 US US14/821,818 patent/US9324647B2/en active Active
-
2016
- 2016-03-30 US US15/084,530 patent/US9883587B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20110011614A (ko) | 2011-02-08 |
US20140210090A1 (en) | 2014-07-31 |
CN102027585A (zh) | 2011-04-20 |
US20110061909A1 (en) | 2011-03-17 |
FI20085443A0 (sv) | 2008-05-12 |
FI123205B (sv) | 2012-12-31 |
WO2009138560A1 (en) | 2009-11-19 |
JP2011523773A (ja) | 2011-08-18 |
US9883587B2 (en) | 2018-01-30 |
US20160212855A1 (en) | 2016-07-21 |
US9107324B2 (en) | 2015-08-11 |
US8699233B2 (en) | 2014-04-15 |
US20150348878A1 (en) | 2015-12-03 |
US9324647B2 (en) | 2016-04-26 |
GB201021002D0 (en) | 2011-01-26 |
CN102027585B (zh) | 2013-07-10 |
GB2472953A (en) | 2011-02-23 |
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