FI123205B - Kretsmodul och förfarande för tillverkning av en kretsmodul - Google Patents

Kretsmodul och förfarande för tillverkning av en kretsmodul Download PDF

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Publication number
FI123205B
FI123205B FI20085443A FI20085443A FI123205B FI 123205 B FI123205 B FI 123205B FI 20085443 A FI20085443 A FI 20085443A FI 20085443 A FI20085443 A FI 20085443A FI 123205 B FI123205 B FI 123205B
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FI
Finland
Prior art keywords
layer
contact
component
copper
circuit module
Prior art date
Application number
FI20085443A
Other languages
English (en)
Finnish (fi)
Other versions
FI20085443A (sv
FI20085443A0 (sv
Inventor
Antti Iihola
Risto Tuominen
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39523098&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI123205(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20085443A priority Critical patent/FI123205B/sv
Publication of FI20085443A0 publication Critical patent/FI20085443A0/sv
Priority to JP2011508961A priority patent/JP2011523773A/ja
Priority to US12/990,785 priority patent/US8699233B2/en
Priority to PCT/FI2009/050383 priority patent/WO2009138560A1/en
Priority to CN2009801172483A priority patent/CN102027585B/zh
Priority to KR1020107025126A priority patent/KR20110011614A/ko
Priority to GB1021002A priority patent/GB2472953A/en
Publication of FI20085443A publication Critical patent/FI20085443A/sv
Publication of FI123205B publication Critical patent/FI123205B/sv
Application granted granted Critical
Priority to US14/231,758 priority patent/US9107324B2/en
Priority to US14/821,818 priority patent/US9324647B2/en
Priority to US15/084,530 priority patent/US9883587B2/en

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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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Claims (34)

1. Förfarande för tillverkning av en kretsmodul, vid vilket förfarande en ledarfilm (12) väljs, en komponent (6) väljs, som omfattar kontaktomräden (7), vilkas material in-5 nehäller en första metall, komponenten (6) fästs vid ledarfilmen (12) medelst ett polymerskikt (25), ett isoleringsskikt (1) tili verkas kring den vid ledarfilmen (12) fästa komponenten (6), kontakthäl (18, 28) upptas i polymerskiktet (25) vid positionema för kontakt-10 omrädena (7) pä sä sätt, att kontaktytan (Acont i) mellan varjc kontakthäl (18, 28) och motsvarande kontaktomrade (7) är mindre än kontaktomrädets (7) yta (Apad), och ett mellanskikt (2) odlas ätminstone pä ytan av kontaktomrädena (7) i kon-takthälen (18, 28), vilket mellanskikt innehäller ätminstone en tredje metall, 15 ett skikt (32) av en andra metall odlas, vilket skikt (32) är i kontakt med mellanskiktets (2) yta och sträcker sig utmed de ledare (22) som tillverkas, och ledare (22) bildas genom konfiguration av ledarfilmen (12) och, sävida det cm behövs, även mellanskiktet (2) pä ytan av ledarfilmen (12) och/eller skiktet (32) av cm en andra metall, o cl, 20 kännetecknatavatt g i ledarfilmen (12) utformas kontaktöppningar (8) för tillverkning av kontakt- co element, och m o kontakthälets djup (H) är lägre eller det samma som kontakthälets maximala ^ bredd (WMax)· 25
2. Förfarande i enlighet med patentkrav 1, kännetecknat av att 44 kontaktöppningama (8) utformas innan komponenten (6) fästs, komponenten (6) fästs vid ledarfilmen (12), som är försedd med kontakt-öppningar (8), och efter fästningen av komponenten (6) öppnas kontakthälen (18, 28) via kon-5 taktöppningama (8).
3. Förfarande i enlighet med patentkrav 2, kännetecknat avatt kontakthälen (18, 28) öppnas via kontaktöppningama (8) medelst en CXVlaser, varvid ledarfilmen (12) används som en mask.
4. Förfarande i enlighet med nägot av patentkraven 1-3, kännetecknat 10 av att den första metallen utgörs av aluminium, den andra metallen av koppar och den tredje metallen innehäller ätminstone en av metalleina zink och nickel.
5. Förfarande i enlighet med nägot av patentkraven 1-3, kännetecknat av att den första metallen utgörs av guld, den andra metallen av koppar och den tredje metallen av nickel. 15
6. Förfarande i enlighet med nägot av patentkraven 1-4, kännetecknat av att mellanskiktet (2) omfattar ett zinkinnehällande skikt (33), som tillverkas medelst en dubbel zinkatprocess.
7. Förfarande i enlighet med nägot av patentkraven 1-6, kännetecknat (M av att mellanskiktet (2) omfattar ett nickelinnehällande skikt (34), som tillverkas ^ 20 medelst ett kemiskt nickelodlingsförfarande. cp (-J)
8. Förfarande i enlighet med nägot av patentkraven 1-7, kännetecknat x av att mellanskiktet (2) omfattar ett kopparinnehällande skikt (35), som tillverkas cc medelst ett kemiskt kopparodlingsförfarande. CO g
9. Förfarande i enlighet med nägot av patentkraven 1-8, kännetecknat o 25 av att isoleringsskiktet (1) tillverkas pä sä sätt, att 45 ätminstone en isoleringsfilm (11) innehällande ett fibermaterial (19) och en förhärdad polymer väljs, ett hai för komponenten (6) upptas i varjc isoleringsfilm (11) innehällande ett fibermaterial (19), och 5 isoleringsfilmen (11) eller isoleringsfilmema (11) lamineras samman med ledarfilmen (12) och därtill anslutna strukturer.
10. Förfarande i enlighet med nägot av patentkraven 1-9, kännetecknat av att ledarfilmens (12) yta, vid vilken komponenten (6) fasts, omfattar ett enhetligt isoleringsskikt (13). 10
11. Förfarande i enlighet med nägot av patentkraven 1-10, kännetecknat av att en avständsbricka (15) anordnas mellan komponenten (6) och ledarfilmen (12).
12. Förfarande i enlighet med nägot av patentkraven 1-11, kännetecknat av att, förutom komponenten (6), ätminstone en annan komponent (16) anordnas i kretsmodulen pä sä sätt, att den första och den andra komponentens fästningssätt 15 avviker ffän varandra i fräga om ätminstone en egenskap hos polymerskikten (25).
13. Förfarande i enlighet med nägot av patentkraven 1-12, kännetecknat av att den komponent (6) som skall fästas utgörs av en komponent utan knottror.
14. Kretsmodul, omfattande (M 5 ett isoleringsskikt (1), CM o 20 ätminstone en komponent (6) inne i isoleringsskiktet (1), vilken komponent ^ omfattar kontaktomräden (7), vilkas material innehäller en första metall, X tr ledare (22) pä ytan av isoleringsskiktet (1), vilka omfattar ätminstone ett CO ^ första skikt (12) och ett andra skikt (32) pä sä sätt, att ätminstone det andra skiktet m o (32) innehäller en andra metall, och o CM 46 kontaktelement mellan kontaktomrädena (7) och ledama (22) för att bilda elektriska kontakter, vilka kontaktelement omfattar ett mellanskikt (2), som inne-häller en tredje metall, pä ytan av kontaktomrädets (7) material, varvid den första, den andra och den tredje metallen utgörs av olika metaller, 5 och kontaktytan (Acont i) mellan mellanskiktet (2) och kontaktomrädet (7) är mindre än kontaktomrädets (7) yta (Apad), kännetecknad av att kontaktelementets höjd (H) är lägre än eller den samma som kontaktelementets maximala bredd ( Wmax).
15. Kretsmodul i enlighet med patentkrav 14, kännetecknad av att den första metallen utgörs av aluminium, den andra metallen av koppar och den tredje metallen innehäller ätminstone en av metallema zink och nickel.
16. Kretsmodul i enlighet med patentkrav 14, kännetecknad av att den första metallen utgörs av guld, den andra metallen av koppar och den tredje metallen 15 av nickel.
17. Kretsmodul i enlighet med patentkrav 14 eller 15, kännetecknad av att kontaktomrädenas (7) material utgörs huvudsakligen av aluminium.
18. Kretsmodul i enlighet med patentkrav 14, 15 eller 17, kännetecknad cm av att mellanskiktet (2) omfattar ett zinkinnehällande skikt (33). δ CM 4 20
19. Kretsmodul i enlighet med patentkrav 18, kännetecknad av att o o) mellanskiktet (2) omfattar, förutom det zinkinnehällande skiktet (33), ätminstone ett x andra mellanmetallskikt (34, 35). cc CL co
20. Kretsmodul i enlighet med patentkrav 19, kännetecknad av att det ät- g minstone ena andra mellanmetallskiktet (35) utgörs av koppar odlad medelst ett o o 25 kemiskt odlingsförfarande. 47
21. Kretsmodul i enlighet med patentkrav 20, kännetecknad av att mellanmetallskiktet (2) omfattar ätminstone ett skikt (34) av nickel och/eller en blandning av nickel och aluminium mellan det zinkinnehallande skiktet (33) och kopparskiktet (35).
22. Kretsmodul i enlighet med nägot av patentkraven 18-21, känne tecknad av att det zinkinnehallande skiktet innehäller zink, koppar, nickel och jam.
23. Kretsmodul i enlighet med nägot av patentkraven 14-22, kännetecknad av att en del av mellanskiktet (2) sträcker sig utmed kontaktelementens 10 sidoväggar mellan kontaktomradena (7) och ledama (22).
24. Kretsmodul i enlighet med patentkrav 23, kännetecknad avatt kontaktelementen omfattar en medelst ett elektrokemiskt odlingsforfarande tillverkad kopparkäma (29), som i riktningen för sidoväggama och komponenten (6) begränsas av mellanskiktet (2), och i riktningen för ledaren (22) ansluts kontinuerligt, d.v.s. 15 utan gränsyta, till materialet hos ledarens (22) andra skikt (32).
25. Kretsmodul i enlighet med patentkrav 23 eller 24, kännetecknad av att den del (37) av mellanskiktet (2) som sträcker sig utmed kontaktelementens sidoväggar innehäller koppar odlad medelst ett kemiskt odlingsforfarande eller nickel odlad medelst ett kemiskt odlingsforfarande. ^ 20
26. Kretsmodul i enlighet med nägot av patentkraven 14 - 25, känne- S w tecknadavatt ledama (32) omfattar o en ett första skikt (12) av koppar pä ytan av isoleringsskiktet (1), och £ ett andra skikt (32) av koppar pä ytan av det första kopparskiktet. co
^ 27. Kretsmodul i enlighet med nägot av patentkraven 14-25, känne in o 25 t e c k n a d av att ledama (32) omfattar o (M ett första skikt (12) av koppar pä ytan av isoleringsskiktet (1), 48 ett mellanskikt (2) pä ytan av det första kopparskiktet, och ett andra skikt (32) av koppar pä ytan av mellanskiktet.
28. Kretsmodul i enlighet med patentkrav 27, k ä n n e t e e k n a d av att mellanskiktets (2) del mellan det första och andra kopparskiktet omfattar koppar 5 odlad medelst ett kemiskt odlingsförfarande eller nickel odlad medelst ett kemiskt odlingsförfarande.
29. Kretsmodul i enlighet med nagot av patentkraven 14-28, k ä n n βίε e k n a d av att bredden ( Wcont) av kontaktytan mellan kontaktelementet och komponentens kontaktomräde (7) är 0-20 % mindre än kontaktelementets maximala 10 bredd ( Wmax) i samma riktning.
30. Kretsmodul i enlighet med nagot av patentkraven 14-29, k ä n n e -tecknad av att isoleringsskiktet (1) innehäller ätminstone ett skikt fibermaterial (19), väri fibermaterialet (19) uppvisar en öppning for komponenten (6), samt ett enhetligt polymerskikt, som är fäst vid fibermaterialet (19) och komponenten (6).
31. Kretsmodul i enlighet med nagot av patentkraven 14-30, känne- tecknad av att den omfattar ett polymerskikt (25) mellan ledama (22) och komponenten (6), vilket polymerskikt uppvisar kontakthäl (18, 28) för kontakt-elementen, och väri kontaktelementen fiillständigt fyller kontakthälen (18, 28).
32. Kretsmodul i enlighet med patentkrav 31, kännetecknad av att CM o 20 polymerskiktet (25) mellan ledama (22) och komponenten (6) omfattar ett första (15) CM 4 och ett andra polymerskikt (5), väri det första polymerskiktet (15) utgörs av en första O 05 polymer och det andra polymerskiktet (5) utgörs av härdat lim. x
£ 33. Kretsmodul i enlighet med patentkrav 32, kännetecknad av att det pj första polymerskiktet (15) och det andra polymerskiktet (5) är lokala pä sä sätt, att de g 25 existerar väsentligen endast vid komponenten (6). o o
34. Kretsmodul i enlighet med nägot av patentkraven 14 - 33, kännetecknad av att komponenten omfattar ett passiveringsskikt (9) pä ytan av 49 komponenten och kontaktomrädena (7) är belägna inne i öppningar i passiverings-skiktet (9), varvid mellanskiktet (2) sträcker sig genom öppningen i passiverings-skiktet (9). (M δ (M o σ> X cn CL CO sj- sj- in oo o o (M
FI20085443A 2008-05-12 2008-05-12 Kretsmodul och förfarande för tillverkning av en kretsmodul FI123205B (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20085443A FI123205B (sv) 2008-05-12 2008-05-12 Kretsmodul och förfarande för tillverkning av en kretsmodul
GB1021002A GB2472953A (en) 2008-05-12 2009-05-11 Circuit module and method of manufacturing the same
JP2011508961A JP2011523773A (ja) 2008-05-12 2009-05-11 回路モジュールおよびその製造方法
US12/990,785 US8699233B2 (en) 2008-05-12 2009-05-11 Circuit module and method of manufacturing the same
PCT/FI2009/050383 WO2009138560A1 (en) 2008-05-12 2009-05-11 Circuit module and method of manufacturing the same
CN2009801172483A CN102027585B (zh) 2008-05-12 2009-05-11 电路模块及其制造方法
KR1020107025126A KR20110011614A (ko) 2008-05-12 2009-05-11 회로모듈 및 제조방법
US14/231,758 US9107324B2 (en) 2008-05-12 2014-04-01 Circuit module and method of manufacturing the same
US14/821,818 US9324647B2 (en) 2008-05-12 2015-08-10 Circuit module and method of manufacturing the same
US15/084,530 US9883587B2 (en) 2008-05-12 2016-03-30 Circuit module and method of manufacturing the same

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JP2011523773A (ja) 2011-08-18
CN102027585B (zh) 2013-07-10
GB201021002D0 (en) 2011-01-26
US20150348878A1 (en) 2015-12-03
FI20085443A (sv) 2009-11-13
GB2472953A (en) 2011-02-23
US20140210090A1 (en) 2014-07-31
US8699233B2 (en) 2014-04-15
US9107324B2 (en) 2015-08-11
US9324647B2 (en) 2016-04-26
US20110061909A1 (en) 2011-03-17
KR20110011614A (ko) 2011-02-08
CN102027585A (zh) 2011-04-20
US20160212855A1 (en) 2016-07-21
FI20085443A0 (sv) 2008-05-12
WO2009138560A1 (en) 2009-11-19
US9883587B2 (en) 2018-01-30

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