JP6073339B2 - 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 - Google Patents
部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 Download PDFInfo
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- JP6073339B2 JP6073339B2 JP2014535252A JP2014535252A JP6073339B2 JP 6073339 B2 JP6073339 B2 JP 6073339B2 JP 2014535252 A JP2014535252 A JP 2014535252A JP 2014535252 A JP2014535252 A JP 2014535252A JP 6073339 B2 JP6073339 B2 JP 6073339B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
2 絶縁層
3 電気又は電子的な部品
3a 部品本体
3b 端子
6 導体パターン
7 導通ビア
10 接着層
10a 第1の接着体
10b 第2の接着体
11 支持板
12 金属層
13 ビア
14 ボイド
Claims (4)
- 支持板上に形成された金属層に絶縁材料からなる接着層を形成する接着層形成工程と、
前記接着層に電気又は電子的な部品を搭載する部品搭載工程と
を含む部品内蔵基板の製造方法において、
前記部品は部品本体と該部品本体から突出している端子とで形成されていて、
前記接着層は前記金属層と接着される第1の接着体、及び前記部品と接着される第2の接着体からなり、
前記第1の接着体は平面視で前記部品の外縁に略沿って形成され、
前記第2の接着体は平面視で前記端子の外縁と同等あるいは外縁より小さい範囲に塗布形成され、
前記接着層形成工程にて、前記第1の接着体を硬化させた後、前記第2の接着体を前記第1の接着体上に形成することを特徴とする部品内蔵基板の製造方法。 - 前記接着層形成工程にて、前記第2の接着体は平面視で前記端子の外縁より小さく塗布形成されることを特徴とする請求項1に記載の部品内蔵基板の製造方法。
- 前記部品搭載工程の後に行われ、前記部品に対して絶縁層となるべき絶縁材を積層して前記絶縁材内に前記部品を埋設する積層工程と、
前記支持板を除去し、前記金属層及び前記接着層を貫通し前記端子まで到達するビアを形成するビア形成工程と、
前記ビアの表面にめっきを析出させるめっき工程と、
前記金属層を含む導体パターンを形成するパターン形成工程と
をさらに備えたことを特徴とする請求項1に記載の部品内蔵基板の製造方法。 - 部品内蔵基板であって、
支持板上に形成された金属層と、
絶縁材料からなり、前記金属層上に形成される接着層と、
前記接着層に搭載され、部品本体と前記部品本体から突出している端子とで形成される電気又は電子的な部品と、を備え、
前記接着層は、前記金属層と接着される第1の接着体、及び前記部品と接着される第2の接着体とを含み、
前記第1の接着体は、平面視で前記部品の外縁に略沿って形成され、
前記第2の接着体は、硬化した前記第1の接着体上に、平面視で前記端子の外縁と同等あるいは外縁より小さい範囲に形成されていることを特徴とする部品内蔵基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/073205 WO2014041602A1 (ja) | 2012-09-11 | 2012-09-11 | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014041602A1 JPWO2014041602A1 (ja) | 2016-08-12 |
JP6073339B2 true JP6073339B2 (ja) | 2017-02-01 |
Family
ID=50277760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014535252A Active JP6073339B2 (ja) | 2012-09-11 | 2012-09-11 | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9355990B2 (ja) |
EP (1) | EP2897446B1 (ja) |
JP (1) | JP6073339B2 (ja) |
TW (1) | TW201412218A (ja) |
WO (1) | WO2014041602A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2552377A (en) * | 1945-02-08 | 1951-05-08 | Bendix Aviat Corp | Altimeter |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002190661A (ja) * | 2000-10-10 | 2002-07-05 | Matsushita Electric Ind Co Ltd | 電子部品の実装体および実装体のリペアー方法 |
FI20041525A (fi) * | 2004-11-26 | 2006-03-17 | Imbera Electronics Oy | Elektroniikkamoduuli ja menetelmä sen valmistamiseksi |
US8024858B2 (en) * | 2008-02-14 | 2011-09-27 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board with built-in electronic component |
FI123205B (fi) * | 2008-05-12 | 2012-12-31 | Imbera Electronics Oy | Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi |
JP4874305B2 (ja) | 2008-07-22 | 2012-02-15 | 株式会社メイコー | 電気・電子部品内蔵回路基板とその製造方法 |
FI122216B (fi) * | 2009-01-05 | 2011-10-14 | Imbera Electronics Oy | Rigid-flex moduuli |
US20100212946A1 (en) * | 2009-02-20 | 2010-08-26 | Ibiden Co., Ltd | Wiring board and method for manufacturing the same |
JPWO2011087119A1 (ja) * | 2010-01-18 | 2013-05-20 | ローム株式会社 | 半導体装置およびその製造方法 |
JP5659234B2 (ja) * | 2010-09-10 | 2015-01-28 | 株式会社メイコー | 部品内蔵基板 |
CN103650082B (zh) * | 2011-07-11 | 2016-08-17 | 株式会社村田制作所 | 电子部件 |
-
2012
- 2012-09-11 EP EP12884539.3A patent/EP2897446B1/en active Active
- 2012-09-11 US US14/423,990 patent/US9355990B2/en active Active
- 2012-09-11 JP JP2014535252A patent/JP6073339B2/ja active Active
- 2012-09-11 WO PCT/JP2012/073205 patent/WO2014041602A1/ja active Application Filing
-
2013
- 2013-06-21 TW TW102122096A patent/TW201412218A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP2897446B1 (en) | 2022-03-30 |
US20150243628A1 (en) | 2015-08-27 |
US9355990B2 (en) | 2016-05-31 |
JPWO2014041602A1 (ja) | 2016-08-12 |
TW201412218A (zh) | 2014-03-16 |
EP2897446A1 (en) | 2015-07-22 |
WO2014041602A1 (ja) | 2014-03-20 |
EP2897446A4 (en) | 2016-08-03 |
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