TW201412218A - 零件內藏基板的製造方法及用此的零件內藏基板 - Google Patents

零件內藏基板的製造方法及用此的零件內藏基板 Download PDF

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TW201412218A
TW201412218A TW102122096A TW102122096A TW201412218A TW 201412218 A TW201412218 A TW 201412218A TW 102122096 A TW102122096 A TW 102122096A TW 102122096 A TW102122096 A TW 102122096A TW 201412218 A TW201412218 A TW 201412218A
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component
bonding
bonding layer
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metal layer
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Tohru Matsumoto
Masaru Ogasawara
Mitsuaki Toda
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Meiko Electronics Co Ltd
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Abstract

零件內藏基板的製造方法，包括接合層形成步驟，支持板(11)上形成的金屬層(12)上，形成絕緣材料構成的接合層(10)；以及零件裝載步驟，裝載電氣或電子零件(3)至上述接合層(10)；其中，上述零件(3)由零件本體(3a)以及從上述零件本體(3a)突出的端子(3b)所形成，上述接合層(10)由接合上述金屬層(12)的第1接合體(10a)、以及接合上述零件(3)的第2接合體(10b)構成，上述第1接合體(10a)以平面所視大致沿著上述零件(3)的外緣形成，上述第2接合體(10b)以平面所視在與上述端子(3b)的外緣相等或比外緣小的範圍內形成，上述接合層形成步驟中，使上述第1接合體(10a)硬化後，在上述第1接合體(10a)上形成上述第2接合體(10b)。

Description

零件內藏基板的製造方法及用此的零件內藏基板
本發明係關於零件內藏基板的製造方法及使用此的零件內藏基板。
零件內藏基板的製造方法，有各種方法(例如參照專利文件1)。此方法係在銅箔上以配料機或印刷法形成接合層，其上裝載應內藏的零件，硬化接合層再固定零件。於是，以堆疊加壓，絕緣材內埋入零件，以雷射加工形成從外側到達零件端子的介層洞。於是，對此介層洞施加電鍍加工，成為導通孔，以求與端子電氣連接。
不過，使用上述的方法時，接合層內部常產生空洞(void)。此空洞在其後的圓滑熱處理中成為膨脹或剝離的原因、或是成為短路的原因。特別是，零件與接合層接觸的面有左凹凸形狀時，空洞的產生變得顯著。由於如此的空洞產生，擔心對導通孔的形成性、連接可靠性、或絕緣性的影響。特別是，內藏具有複數電極的主動零件之基板的情況下，即使執行空洞的真空處理也往往不能除去空洞。相當於電極間位置的基板表面上，往往形成配線圖案，如此的電極間產生空洞時，電極與配線圖案之間也有產生短路、遷移的問題。
[先行技術文件]
[專利文件1]日本專利第2010-27917號公開公報
本發明考慮了上述習知技術，目的在於提供即使產生空洞也可以確保絕緣性的零件內藏基板的製造方法及使用此的零件內藏基板。
為了達成上述目的，本發明中，提供零件內藏基板的製造方法，包括接合層形成步驟，支持板上形成的金屬層上，形成絕緣材料構成的接合層；以及零件裝載步驟，裝載電氣或電子零件至上述接合層；其特徵在於：上述零件由零件本體以及從上述零件本體突出的端子所形成，上述接合層由接合上述金屬層的第1接合體、以及接合上述零件的第2接合體構成，上述第1接合體以平面所視大致沿著上述零件的外緣形成，上述第2接合體以平面所視在與上述端子的外緣相等或比外緣小的範圍內形成，上述接合層形成步驟中，使上述第1接合體硬化後，在上述第1接合體上形成上述第2接合體。
在上述接合層形成步驟中，最好上述第2接合體以平面所視比上述端子的外緣小地塗佈形成。
本發明的零件內藏基板的製造方法，最好更包括堆疊步驟，在上述零件裝載步驟後執行，對於上述零件，堆疊應成為絕緣層的絕緣材，上述絕緣材內埋設上述零件；介層洞形成步驟，除去上述支持板，貫通上述金屬層及上述接合層， 形成到達上述端子的介層洞；電鍍步驟，在上述介層洞表面上沉積電鍍；以及圖案形成步驟，形成包含上述金屬層的導體圖案。
又，本發明中，也提供零件內藏基板，特徵在於：使用上述零件內藏基板的製造方法，上述第1接合體介於上述導體圖案與上述零件之間。
上述第2接合體內最好產生空洞。
根據本發明，基板表面上形成導體圖案時，由於絕緣材料構成的第1接合體介於此導體圖案與第2接合體之間，導體圖案與第2接合體之間產生的距離只有第1接合體的厚度。因此，導體圖案與第2接合體之間得到充分的絕緣特性及絕緣惡化特性。即，即使第2接合體中產生空洞，由於第1接合體中也確保絕緣性，可以防止電極與配線圖案之間產生短路、遷移。第1接合體，由於以平面所視大致沿著零件的外緣形成，可以確實防止第2接合體中產生的空洞的影響。又，接合層形成步驟中，由於預先硬化第1接合體，第1接合體中維持產生空洞的狀態下，可以防止進行下一步驟，可以確實得到由於第1接合體產生的絕緣性效果。
又，以平面所視與端子外緣相等或比外緣小地塗佈第2接合體的話，由於可以以少量的第2接合體實行零件裝載，難以產生空洞，也更降低短路、遷移的問題。
1‧‧‧零件內藏基板
2‧‧‧絕緣層
3‧‧‧電氣或電子零件
3a‧‧‧零件本體
3b‧‧‧端子
6‧‧‧導體圖案
7‧‧‧導通孔
10‧‧‧接合層
10a‧‧‧第1接合體
10b‧‧‧第2接合體
11‧‧‧支持板
12‧‧‧金屬層
13‧‧‧介層洞
14‧‧‧空洞
[第1圖]係用以依序說明根據本發明的零件內藏基板的製造方法之概略圖；[第2圖]係用以依序說明根據本發明的零件內藏基板的製造方法之概略圖；[第3圖]係用以依序說明根據本發明的零件內藏基板的製造方法之概略圖；[第4圖]係用以依序說明根據本發明的零件內藏基板的製造方法之概略圖；[第5圖]係根據本發明的零件內藏基板的概略圖；[第6圖]係裝載被動零件時的概略平面圖；[第7圖]係裝載主動零件時的概略平面圖；以及[第8圖]係顯示零件裝載步驟中產生空洞的狀態之概略圖。
根據本發明的零件內藏基板的製造方法，首先，如第1圖到第3圖所示，執行接合層形成步驟。此步驟，首先，如第1圖所示，例如準備在支持板11上形成金屬層12。又，支持板11，具有在製程條件中必要程度的剛性。支持板11，由具有剛性的SUS(不銹鋼)板或鋁板等作為支持器材料形成。金屬層12，例如支持板11是SUS板的話，係貼上既定厚度的銅箔或沉積鍍銅箔。或是，金屬層12，如果支持板11是鋁板的話，係貼上既定厚度的銅箔。
於是，如第2圖所示，金屬層12上例如以配料機、印刷等塗佈第1接合體10a。即，第1接合體10a與金屬層12 接合。於是使第1接合體10a硬化後，如第3圖所示，在第1接合體10a上塗佈第2接合體10b。此第2接合體10b也以配料機、印刷等塗佈。以此第1接合體10a與第2接合體10b形成接合層10。於是，在支持板11上形成的金屬層12上形成絕緣材料構成的接合層10的步驟，係接合層形成步驟。
於是，如第4圖所示，進行零件裝載步驟。此零件裝載步驟係接合層10上裝載電子或電氣零件3的步驟。裝載的零件3也包含主動零件、被動元件。零件3具有零件本體3a以及從此零件本體3a突出的端子3b。又，第4圖顯示被動元件。接合體10b與零件3的設置同時擴展，接合不只是端子3b還有零件本體3a。即，零件裝載步驟中，端子3b配合第2接合體10b的位置，裝載零件3。
於是，進行堆疊步驟、介層洞形成步驟、電鍍步驟、圖案形成步驟。這些步驟在第5圖中總結說明。堆疊步驟，係對零件3堆疊應成為絕緣層2的絕緣材，用以在絕緣材內埋設零件3。此步驟，對零件3，在配置金屬層12側的反對側鋪疊膠片(Prepreg)等的絕緣材，在真空下加熱此絕緣材的同時，進行加壓。此加壓，例如使用真空加壓式的加壓機實行。又，最好使用熱膨脹係數接近零件3的絕緣材。
之後，進行介層洞形成步驟。此步驟，首先除去支持板11。因此，在絕緣層2的一面露出金屬層12。又，在絕緣層2另一面形成另外的金屬層。於是，使用雷射等進行開孔，形成介層洞13。具體而言，介層洞13係從金屬層12通過接合層10到達端子3b而形成。又，根據構造，為了得到各層 間或表裏面的電氣連接，貫通導通孔或其他的導通介層洞在此時間點形成也可以。介層洞形成後，實施去膠(desmear)處理，除去介層洞形成之際殘留的樹脂。之後，實施電鍍處理(導通處理)，介層洞13內沉積電鍍，形成導通孔7。實行此電鍍處理係電鍍步驟。
於是，進行圖案形成。此步驟係使用蝕刻等，在絕緣層2的兩面形成導體圖案6。經由如此的步驟得到的零件內藏基板1，如第5圖所示，包括絕緣層2、零件3、導體圖案6、接合層10以及導通孔7。絕緣層2係上述絕緣材(膠片等)硬化之物，零件3係經由接合層10與導體圖案6連接。導體圖案6在絕緣層2的表面上形成。
根據上述，在基板表面上形成導體圖案6時，由於絕緣材料構成的第1接合體10a介於此導體圖案6與第2接合體10b之間，導體圖案6與第2接合體10b之間產生的距離只有第1接合體10a的厚度。因此，導體圖案6與第2接合體10b之間得到充分的絕緣特性及絕緣惡化特性。即，上述裝載步驟中，即使如第8圖所示地第2接合體中產生空洞14，由於第1接合體10a中也確保絕緣性，可以防止端子3b(電極)與配線圖案6之間產生短路、遷移。為了確實確保第1接合體10a產生的絕緣特性，第1接合體10a最好具有30μm(微米)左右的厚度。
又，由於第1接合體10a以平面所視係沿著零件3的外緣形成，可以確實防止第2接合體10b中產生的空洞14的影響。即，零件3的下側，空洞14即使在任何位置產生， 因為零件3的下側全體以第1接合體10a覆蓋，也保持了導體圖案6與端子3b的絕緣性。
又，接合形成步驟中，因為預先使第1接合體10a硬化，第1接合體10a中維持產生空洞的狀態下，可以防止進行下一步驟，可以確實得到第1接合體10a產生的絕緣性效果。
又，雖然第2接合體10b的塗佈以平面所視只要在端子3b的外緣以內即可，比外緣小的話，由於可以以少量的第2接合體10b執行零件裝載，難以產生空洞14，也更降低短路、遷移的問題。最適當的塗佈法係端子為Φ200μm的話，第2接合體10b為150μm，端子為Φ400μm的話，第2接合體10b為350μm。主動零件且端子為四角形的情況下，一邊為200μm的話，第2接合體10b也為四角形150μm且一邊為150μm。又，第2接合體10b的厚度為20μm~40μm。
3‧‧‧電氣或電子零件
3a‧‧‧零件本體
3b‧‧‧端子
10‧‧‧接合層
10a‧‧‧第1接合體
10b‧‧‧第2接合體
11‧‧‧支持板
12‧‧‧金屬層

Claims (5)

  1. 一種零件內藏基板的製造方法，包括下列步驟：接合層形成步驟，支持板上形成的金屬層上，形成絕緣材料構成的接合層；以及零件裝載步驟，裝載電氣或電子零件至上述接合層；其特徵在於：上述零件由零件本體以及從上述零件本體突出的端子所形成，上述接合層由接合上述金屬層的第1接合體、以及接合上述零件的第2接合體構成，上述第1接合體以平面所視大致沿著上述零件的外緣形成，上述第2接合體以平面所視在與上述端子的外緣相等或比外緣小的範圍內塗佈形成，以及上述接合層形成步驟中，使上述第1接合體硬化後，在上述第1接合體上形成上述第2接合體。
  2. 如申請專利範圍第1項所述的零件內藏基板的製造方法，其中，上述接合層形成步驟中，上述第2接合體以平面所視係比外緣小地塗佈形成。
  3. 如申請專利範圍第1項所述的零件內藏基板的製造方法，更包括下列步驟：堆疊步驟，在上述零件裝載步驟後執行，對於上述零件，堆疊應成為絕緣層的絕緣材，上述絕緣材內埋設上述零件；介層洞形成步驟，除去上述支持板，貫通上述金屬層及上述接合層，形成到達上述端子的介層洞； 電鍍步驟，在上述介層洞表面上沉積電鍍；以及圖案形成步驟，形成包含上述金屬層的導體圖案。
  4. 一種零件內藏基板，使用申請專利範圍第3項所述的零件內藏基板的製造方法，其特徵在於：上述第1接合體介於上述導體圖案與上述零件之間。
  5. 如申請專利範圍第4項所述的零件內藏基板，其中，上述第2接合體內產生空洞。
TW102122096A 2012-09-11 2013-06-21 零件內藏基板的製造方法及用此的零件內藏基板 TW201412218A (zh)

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