JP6084283B2 - 部品内蔵基板及びその製造方法 - Google Patents
部品内蔵基板及びその製造方法 Download PDFInfo
- Publication number
- JP6084283B2 JP6084283B2 JP2015500019A JP2015500019A JP6084283B2 JP 6084283 B2 JP6084283 B2 JP 6084283B2 JP 2015500019 A JP2015500019 A JP 2015500019A JP 2015500019 A JP2015500019 A JP 2015500019A JP 6084283 B2 JP6084283 B2 JP 6084283B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- metal film
- substrate
- insulating
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
図1及び図2に示すように、搭載工程を行う。まずは図1に示すように、剛性を有する支持板1上に導体箔2を貼付ける。導体箔2は将来導電層となるべきものである。支持板1はプロセス条件にて必要とされる程度の剛性を有するものを用いる。例えば、剛性のあるSUS(ステンレス)板又はアルミ板等で形成される。導体箔2は、支持板1がSUS板であれば銅めっきを析出させて形成でき、アルミ板であれば銅箔を貼り付けて形成できる。そして図2に示すように、導体箔2上に絶縁材料からなる接着剤3を例えばディスペンサーや印刷等で塗布する。この接着剤3上に電気又は電子的な部品4を搭載する。なお、部品4の搭載は半田ペーストを用いて導体箔2上に行ってもよい。
Claims (1)
- 剛性を有する支持板上に導体箔を貼り付け、少なくとも一方の面を覆う金属膜を備える電気又は電子的な部品を該導体箔上に搭載する搭載工程と、
前記部品に対して第1の絶縁基材を積層し、前記部品を前記第1の絶縁基材内に埋設する第1の積層工程と、
前記第1の絶縁基材の一部を除去して前記金属膜の少なくとも一部を露出させる露出工程と、
該露出した金属膜を粗化処理する粗化工程と、
前記金属膜に対して第2の絶縁基材を積層し、前記第1の絶縁基材とともに前記絶縁層を形成して前記部品を埋設する第2の積層工程と
を備えたことを特徴とする部品内蔵基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/053255 WO2014125567A1 (ja) | 2013-02-12 | 2013-02-12 | 部品内蔵基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014125567A1 JPWO2014125567A1 (ja) | 2017-02-02 |
JP6084283B2 true JP6084283B2 (ja) | 2017-02-22 |
Family
ID=51353602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015500019A Expired - Fee Related JP6084283B2 (ja) | 2013-02-12 | 2013-02-12 | 部品内蔵基板及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150382478A1 (ja) |
EP (1) | EP2958408A4 (ja) |
JP (1) | JP6084283B2 (ja) |
CN (1) | CN104982097A (ja) |
TW (1) | TWI578864B (ja) |
WO (1) | WO2014125567A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102194718B1 (ko) * | 2014-10-13 | 2020-12-23 | 삼성전기주식회사 | 임베디드 기판 및 임베디드 기판의 제조 방법 |
JP6423313B2 (ja) * | 2015-05-26 | 2018-11-14 | 新光電気工業株式会社 | 電子部品内蔵基板及びその製造方法と電子装置 |
JP7365759B2 (ja) * | 2018-02-27 | 2023-10-20 | Tdk株式会社 | 回路モジュール |
JP7056226B2 (ja) * | 2018-02-27 | 2022-04-19 | Tdk株式会社 | 回路モジュール |
CN113163572A (zh) | 2020-01-22 | 2021-07-23 | 奥特斯(中国)有限公司 | 具有覆盖有超薄过渡层的部件的部件承载件 |
Family Cites Families (27)
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US6545364B2 (en) * | 2000-09-04 | 2003-04-08 | Sanyo Electric Co., Ltd. | Circuit device and method of manufacturing the same |
JP3639514B2 (ja) * | 2000-09-04 | 2005-04-20 | 三洋電機株式会社 | 回路装置の製造方法 |
JP2002237683A (ja) * | 2001-02-08 | 2002-08-23 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
JP4346333B2 (ja) * | 2003-03-26 | 2009-10-21 | 新光電気工業株式会社 | 半導体素子を内蔵した多層回路基板の製造方法 |
JP2005191156A (ja) * | 2003-12-25 | 2005-07-14 | Mitsubishi Electric Corp | 電気部品内蔵配線板およびその製造方法 |
KR100598275B1 (ko) * | 2004-09-15 | 2006-07-10 | 삼성전기주식회사 | 수동소자 내장형 인쇄회로기판 및 그 제조 방법 |
TWI275149B (en) * | 2005-05-09 | 2007-03-01 | Phoenix Prec Technology Corp | Surface roughing method for embedded semiconductor chip structure |
US7932471B2 (en) * | 2005-08-05 | 2011-04-26 | Ngk Spark Plug Co., Ltd. | Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment |
TWI296910B (en) * | 2005-12-27 | 2008-05-11 | Phoenix Prec Technology Corp | Substrate structure with capacitance component embedded therein and method for fabricating the same |
CN101690434B (zh) * | 2007-06-26 | 2011-08-17 | 株式会社村田制作所 | 元器件内置基板的制造方法 |
JP4722954B2 (ja) * | 2008-03-17 | 2011-07-13 | イビデン株式会社 | プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法 |
TWI363585B (en) * | 2008-04-02 | 2012-05-01 | Advanced Semiconductor Eng | Method for manufacturing a substrate having embedded component therein |
US8083954B2 (en) * | 2008-06-03 | 2011-12-27 | Kinsus Interconnect Technology Corp. | Method for fabricating component-embedded printed circuit board |
JP4874305B2 (ja) | 2008-07-22 | 2012-02-15 | 株式会社メイコー | 電気・電子部品内蔵回路基板とその製造方法 |
JP5766387B2 (ja) * | 2008-09-11 | 2015-08-19 | 大日本印刷株式会社 | 電子部品内蔵型の2層配線基板の製造方法及び電子部品内蔵型の2層配線基板 |
KR101055509B1 (ko) * | 2009-03-19 | 2011-08-08 | 삼성전기주식회사 | 전자부품 내장형 인쇄회로기판 |
US20110048777A1 (en) * | 2009-08-25 | 2011-03-03 | Chien-Wei Chang | Component-Embedded Printed Circuit Board |
JP2011210892A (ja) * | 2010-03-29 | 2011-10-20 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
EP2624672A4 (en) * | 2010-10-01 | 2014-11-26 | Meiko Electronics Co Ltd | METHOD FOR PRODUCING A SUBSTRATE WITH INTEGRATED COMPONENT AND SUBSTRATE PRODUCED BY THIS PROCESS WITH INTEGRATED COMPONENT |
KR101204233B1 (ko) * | 2010-12-22 | 2012-11-26 | 삼성전기주식회사 | 전자부품 내장형 인쇄회로기판 및 그 제조방법 |
JP5725152B2 (ja) * | 2011-03-10 | 2015-05-27 | 株式会社村田製作所 | 電気素子内蔵型多層基板およびその製造方法 |
EP2897447A4 (en) * | 2012-09-11 | 2016-05-25 | Meiko Electronics Co Ltd | METHOD FOR PRODUCING A SUBSTRATE WITH AN EMBEDDED COMPONENT AND SUBSTRATE PRODUCED IN THIS METHOD WITH AN EMBEDDED COMPONENT |
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KR101452079B1 (ko) * | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
KR101442423B1 (ko) * | 2013-08-14 | 2014-09-17 | 삼성전기주식회사 | 전자부품 내장기판 제조 방법 및 전자부품 내장기판 |
KR101452131B1 (ko) * | 2013-08-30 | 2014-10-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
TWI602482B (zh) * | 2015-06-30 | 2017-10-11 | To solder paste embedded electronic components within the circuit board manufacturing method |
-
2013
- 2013-02-12 JP JP2015500019A patent/JP6084283B2/ja not_active Expired - Fee Related
- 2013-02-12 US US14/767,536 patent/US20150382478A1/en not_active Abandoned
- 2013-02-12 CN CN201380072727.4A patent/CN104982097A/zh active Pending
- 2013-02-12 WO PCT/JP2013/053255 patent/WO2014125567A1/ja active Application Filing
- 2013-02-12 EP EP13874923.9A patent/EP2958408A4/en not_active Withdrawn
- 2013-12-23 TW TW102147712A patent/TWI578864B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN104982097A (zh) | 2015-10-14 |
EP2958408A4 (en) | 2016-11-30 |
TW201448693A (zh) | 2014-12-16 |
EP2958408A1 (en) | 2015-12-23 |
US20150382478A1 (en) | 2015-12-31 |
TWI578864B (zh) | 2017-04-11 |
JPWO2014125567A1 (ja) | 2017-02-02 |
WO2014125567A1 (ja) | 2014-08-21 |
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