CN103918356A - 元器件内置基板的制造方法以及使用该方法制成的元器件内置基板 - Google Patents

元器件内置基板的制造方法以及使用该方法制成的元器件内置基板 Download PDF

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Publication number
CN103918356A
CN103918356A CN201180074702.9A CN201180074702A CN103918356A CN 103918356 A CN103918356 A CN 103918356A CN 201180074702 A CN201180074702 A CN 201180074702A CN 103918356 A CN103918356 A CN 103918356A
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China
Prior art keywords
components
substrate
mark
hole
forms
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CN201180074702.9A
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English (en)
Inventor
今村圭男
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Meiko Electronics Co Ltd
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Meiko Electronics Co Ltd
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Publication of CN103918356A publication Critical patent/CN103918356A/zh
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    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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    • H05K13/0469—Surface mounting by applying a glue or viscous material
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
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Abstract

本发明的元器件内置基板的制造方法在金属层(4)上形成主标记(A、B)以及要与电子元器件(14)的端子(20)相对的圆环状的基座(60)，接着，以主标记(A、B)为基准将电子元器件(14)定位于搭载预定区域(S)并经由粘接层(18)进行搭载，之后，将电子元器件(14)以及主标记(A、B)埋设于绝缘基板(34)内，之后，去除金属层(4)的一部分，形成分别使主标记(A、B)以及基座(60)露出的第一及第二窗口(W1、W2)，以所露出的主标记(A、B)为基准对基座(60)的中央贯通孔(62)内的粘接层(18)照射激光，形成到达端子(20)的激光过孔(46)，将经由对该激光过孔(46)填充铜而形成的导通孔(47)与端子(20)电连接的金属层(4)形成为布线图案(50)。

Description

元器件内置基板的制造方法以及使用该方法制成的元器件内置基板
技术领域
本发明涉及一种将电气或电子元器件嵌入基板内的元器件内置基板的制造方法以及使用该方法制成的元器件内置基板。
背景技术
近年来，随着在电路基板上表面安装的元器件的高密度化、即电路基板的高性能化，采用将电子元器件嵌入作为绝缘层的绝缘基板内的结构的元器件内置基板受到注目。通过在该元器件内置基板的绝缘基板的表面形成布线图案，并且在该布线图案规定位置表面安装其它各种电子元器件，从而元器件内置基板能用作为模块基板。另外，元器件内置基板也可以用作为通过增层法制造元器件内置多层电路基板时的核心基板。
已知在上述元器件内置基板上需要将所述布线图案与所述绝缘基板内的电子元器件的端子电连接，该连接需要使用焊料(例如参照专利文献1)。
在模块基板或多层电路基板的制造过程中，对各种电子元器件进行多次的表面安装。通常，电子元器件的表面安装采用回流方式的焊接，因此每次进行表面安装时，均将元器件内置基板投入到回流炉中，并加热至焊料熔化的温度。因此，专利文献1的元器件内置基板的所述绝缘基板内的连接部由于被多次加热至焊料的熔融温度，因此可能会导致所述连接部的可靠性降低。
因此，为了提高元器件内置基板中的所述连接部的可靠性，已知有通过铜镀来使绝缘基板内的连接部电连接，而不使用焊料的方法(例如参照专利文献2)。即，由于铜的熔点比焊料的熔点要高，因此即使将元器件内置基板投入到回流炉中连接部也不会熔化，由此维持了所述连接部的可靠性。
具体而言，专利文献2的制造方法如下。
首先，在铜箔等金属层上层叠绝缘层，形成层状体。在该层状体上形成导孔，此外，以该导孔为基准在所述层状体上形成连接孔。该连接孔形成于要配置在所述绝缘层上的基板内元器件的区域。在后续工序中在该连接孔内填充铜，所填充的铜形成将基板内部的端子与布线图案电连接的金属接头。之后，在所述区域涂布粘接剂，利用该粘接剂将基板内元器件固定于绝缘层上。通过所述连接孔对此时的基板内元器件进行定位。此处，所述基板内元器件被定位成其端子与所述连接孔相对应。此外，所述连接孔中流入所述粘接剂。
接下来，在层状体的绝缘层上层叠要成为绝缘基板的预浸渍体等绝缘基材，此时，在绝缘基材内埋设有基板内元器件的绝缘基板得以形成。所获得的绝缘基板的一个面上存在所述层状体的所述金属层，且在该金属层的外表面开设了所述连接孔。对于该状态的绝缘基板，从所述金属层的外表面侧去除所述连接孔内的粘接剂以使所述基板内元器件的端子在连接孔内露出，然后，包含所述连接孔，对所述金属层的整个外表面实施镀铜处理。由此，在所述连接孔内，铜进行生长并填充，从而定位于绝缘基板表面的金属层与基板内元器件的端子电连接。之后，通过对绝缘基板表面的一部分金属层进行蚀刻来形成布线图案，由此形成元器件内置基板。
现有技术文献
专利文献
专利文献1：日本专利特开2010－027917号公报
专利文献2：日本专利特表2008-522396号公报
发明内容
发明所要解决的技术问题
在上述制造方法中，固定所述基板内元器件的粘接剂在涂布到所述区域时，如上述那样一部分会流入所述连接孔内。其结果是，粘接层的厚度变薄，从而可能产生以下问题。
首先，粘接剂为了维持固化后粘接层的强度，通常使用含有填料的粘接剂。但是，在粘接层的厚度变得比填料的尺寸还薄时，填料容易从粘接层脱落从而无法获得所需的强度。
此外，粘接层也作为绝缘层使用，因此若其厚度过薄则难以确保所需的绝缘性。
因此，在上述制造方法中，不适用易于流入粘接孔内的低粘度型的粘接剂、或低触变性的粘接剂，对于能使用的粘接剂有所限定。
本发明是基于上述情况而完成的，其目的在于提供如下的元器件内置基板的制造方法及使用该方法制成的元器件内置基板，能够高精度地对用于使所内置的元器件的端子与布线图案电连接的连接孔进行定位，并且能扩大固定元器件的粘接剂的选择范围。
解决技术问题所采用的技术方案
为了达成上述目的，根据本发明，涉及一种元器件内置基板的制造方法，该元器件内置基板包含内置于表面具有布线图案的绝缘基板内的电气或电子元器件，该元器件的端子与所述布线图案电连接，该元器件内置基板的制造方法的特征在于，包括如下工序：金属层形成工序，在该金属层形成工序中，在支承板上形成金属层，包含该金属层与所述支承部相接的第一面以及与该第一面相反侧的第二面，该第二面具有用于所述元器件的搭载预定区域以及该搭载预定区域以外的非搭载区域；标记形成工序，在该标记形成工序中，在所述第二面的所述非搭载区域形成金属的主标记；基座形成工序，在该基座形成工序中，在所述第二面的所述搭载预定区域形成所述主标记的同时形成具有中央贯通孔的金属的基座；粘接剂涂布工序，在该粘接剂涂布工序中，将绝缘性的粘接剂涂布于所述搭载预定区域以及所述基座，形成粘接层，该粘接层具有在所述基座的所述中央贯通孔的位置上由所述粘接剂填满所述中央贯通孔内的填充区域；元器件搭载工序，在该元器件搭载工序中，以所述主标记为基准对所述元器件进行定位，在所述元器件的所述端子与所述填充区域相接的状态下，将所述元器件搭载于所述粘接层上；埋设层形成工序，该埋设层形成工序中，形成作为埋设所述元器件以及所述主标记的所述绝缘基板的埋设层；剥离工序，在该剥离工序中，从所述金属层剥离所述支承板，通过该剥离露出所述金属层的第一面；窗口形成工序，在该窗口形成工序中，从露出的第一面侧去除所述金属层的一部分，在所述金属层中分别形成至少使所述主标记露出的第一窗口以及至少使所述基座的所述中央贯通孔露出的第二窗口；过孔形成工序，在该过孔形成工序中，以露出的所述主标记为基准确定所述元器件的端子的位置，将填满所露出的所述基座的所述贯通孔内的所述填充区域的所述粘接剂去除，在所述填充区域形成到达所述端子为止的过孔；导通孔形成工序，在该导通孔形成工序中，对所述过孔实施镀覆处理，之后，通过将金属填充于所述过孔以及所述第二窗口内来形成使所述端子与所述金属层电连接的导通孔；以及图案形成工序，在该图案形成工序中，将所述金属层形成为所述布线图案。
此处，所述元器件内置基板的制造方法优选如下方式，在所述标记形成工序中，在形成所述主标记的同时也在所述第二面的非搭载区域上形成金属的子标记，并且在所述剥离工序与所述窗口形成工序之间还包括贯通孔标记形成工序，在该贯通孔标记形成工序中，利用X射线来确定所述子标记，并形成一并贯通所述金属层、所述子标记、以及所述埋设层的贯通孔标记，所述窗口形成工序以所述贯通孔标记为基准来形成所述第一窗口及第二窗口。
另外，还优选采用如下方式：所述主标记、子标记以及所述基座通过利用了阻镀膜的图案镀覆来形成。
根据本发明，提供一种利用上述元器件内置基板的制造方法而制成的元器件内置基板。
此处，所述元器件内置基板优选还具备所述子标记以及所述贯通孔标记。
发明效果
本发明所涉及的元器件内置基板的制造方法中，利用形成于金属层的主标记来对电气或电子元器件进行定位，在后续工序中形成的过孔通过去除与所述主标记同时形成的所述基座的所述中央贯通孔的树脂来形成。因此，所形成的过孔的位置由所述基座的所述中央贯通孔来决定。也就是说，利用与所述基座同时形成的主标记来对所述元器件进行的定位是朝向所述基座的位置即过孔的位置进行的，因此能以极高的位置精度应对所述元器件和与所述元器件的端子进行电连接的过孔的定位。
另外，本发明中，与主标记同时形成的基座起到确保所述元器件与所述金属层(布线图案)之间的空间的间隔件的作用，因此能使所述元器件与所述金属层之间的粘接层的厚度保持固定。其结果是，能稳定地获得具有优异的粘接强度及绝缘性的粘接层。并且，该基座具有中央贯通孔，该中央贯通孔与搭载的所述元器件的端子的位置相一致，因次，通过去除中央贯通孔内的粘接层的填充区域，能在所设计的正确的位置上形成过孔。
另外，本发明所涉及的元器件内置基板的制造方法在经由粘接剂将所述元器件搭载于所述金属层之后，获得使该粘接剂固化后的粘接层。由于不对所述金属层预先开孔，因此未固化的粘接剂不会从孔流入金属层。因此，能使所得到的粘接层的厚度成为所需要的厚度，并能确保所设计的粘接强度以及绝缘性。也就是说，根据本发明，粘接剂的选择范围变宽。
此外，在本发明中，在标记形成工序，将子标记与所述主标记同时形成，在所述窗口形成工序之前，利用X射线确定所述子标记，并形成一并贯通所述金属层、所述子标记以及所述埋设层的贯通孔标记。若以该贯通孔标记为基准，则被金属层挡住的主标记的位置以及与所述元器件的端子相对应的位置能简单地确定，因此能容易地形成所述第一窗口以及第二窗口。
另外，在本发明中，通过利用了阻镀膜的图案镀覆来形成所述主标记、子标记以及所述基座，因此，能够利用以往常用的印刷基板制造设备来简单地形成所述主标记、子标记以及所述基座。因此，本发明有助于提高元器件内置基板整体的生产效率。
另外，本发明的元器件内置基板通过上述制造方法得到，因此所内置的元器件与布线图案的定位精度极高，不良品的发生率较低。
附图说明
图1是简要表示本发明的实施方式所涉及的元器件内置基板的制造方法中、到支承板的金属层上形成标记和基座为止的步骤的剖视图。
图2是简要表示图1的基座的立体图。
图3是简要表示在图1(e)的金属层上提供了粘接剂的状态的剖视图。
图4是简要表示在图3的粘接剂上搭载有电子元器件的状态的剖视图。
图5是简要表示在搭载有电子元器件的金属层上层叠绝缘基材及铜箔的状态的剖视图。
图6是简要表示在搭载有电子元器件的金属层上层叠了绝缘基材及铜箔并一体化的状态的剖视图。
图7是简要表示将支承板从金属层剥离的状态的剖视图。
图8是简要表示对中间体实施X射线孔加工的状态的剖视图。
图9是简要表示在图8的中间体上形成有窗口的状态的剖视图。
图10是简要表示在图9的中间体中形成有激光过孔的状态的剖视图。
图11是简要表示对图9的中间体照射激光的状态的剖视图。
图12是简要表示对图10的中间体实施镀覆处理的状态的剖视图。
图13是简要表示本发明的实施方式所涉及的元器件内置基板的剖视图。
具体实施方式
关于在绝缘基板内内置了电子元器件(以下称作为基板内元器件)14的元器件内置基板，以下对使用本发明所涉及的元器件内置基板的制造方法来进行制造的工序进行说明。
在本发明中，首先在支承板上形成金属层(金属层形成工序)。
在本工序中，如图1(a)所示，准备支承板2。该支承板2例如是不锈钢制的薄板。然后，如图1(b)所示，在支承板2上形成由薄膜构成的第一金属层4。该第一金属层4例如由通过电解镀覆而获得的镀铜膜构成。由此获得包铜钢板6。此处，将第一金属层4中与支承板2相接的面记为第一面3，将该第一面3相反侧的面记为第二面5。另外，该第二面5具有用于基板内元器件14的搭载预定区域S以及该搭载预定区域以外的非搭载区域N。
接下来，在包铜钢板6上形成由铜制的柱状体形成的用于定位的标记(标记形成工序)，与此同时，形成由铜制的环状体形成的基座(基座形成工序)。
具体而言，如图1(c)所示，在准备好的包铜钢板6的第一金属层4上形成掩模层8。该掩模层8例如是由规定厚度的干膜构成的阻镀膜，在规定位置上设有规定形状的开口10，金属层4从该开口10中露出。然后，对具有这样的掩模层8的包铜钢板6实施铜的电解镀覆，从而在所述露出部分优先析出铜7(图1(d))。之后，通过去除作为掩模层8的干膜，从而在第一金属层4的第二面5上的规定位置形成铜柱(图1(e))。作为该铜柱，形成呈圆柱状的用于定位的标记12以及呈圆环状的基座60。此处，具体而言，基座60如图2所示，呈现为在扁平的圆柱体的中央具有中央贯通孔62的形状。此外，这些铜柱以与干膜的高度相同的高度形成，至少基座60的高度被设定为与在后续工序中形成的粘接层18所要求的厚度相同的尺寸。
虽然能在非搭载区域N任意选定该标记12的设置位置，但优选设置在对要内置于绝缘基板内的基板内元器件14进行定位的光学系统定位装置(未图示)的光学系统传感器容易识别的位置。本实施方式中，如图1(e)所示，在包铜钢板6的两端部的非搭载区域N分别形成2个标记12，以夹着预定的搭载基板内元器件14的搭载预定区域S。此处，关于各个标记，图1(e)中位于搭载预定区域S附近一侧的标记称为内部标记(主标记)A、B，夹着这些内部标记A、B而位于搭载预定区域S相反侧的标记称为外部标记(子标记)C、D。
另一方面，基座60的设置位置为如下位置：定位成位于搭载预定区域S内，且使得中央贯通孔62与要对基板内元器件14的端子20进行定位的端子位置t相对。
接下来，对搭载预定区域S提供粘接剂16(粘接剂涂布工序)。
首先，如图3所示，向金属层4上的元器件的搭载预定区域S提供要成为绝缘性粘接层的粘接剂16。此时，对于所提供的粘接剂16的形态并没有特别限定，可以采用以规定厚度对低粘度型或高粘度型的糊料状的粘接剂16进行涂布的形态。在本实施方式中，使用低粘度型的粘接剂16，如图3所示，以稍许覆盖基座60的程度的厚度进行涂布，以覆盖整个搭载预定区域S。此处，基座60的中央贯通口62内也导入有粘接剂16，中央贯通孔62处于由粘接剂16填满的状态。由此，粘接层具有由粘接剂填满中央贯通孔62内的填充区域63。
由图3可知，中央贯通孔62的一端(图3中的下侧)被金属层4塞住，因此粘接剂16留在中央贯通孔62内。此处，粘接剂16覆盖整个搭载预定区域S即可，粘接剂16的定位精度可以较低。另外，在进行粘接剂16的定位时，以内部标记A、B为基准来确定搭载预定区域S，若在所确定的位置上涂布粘接剂16则粘接剂16的定位精度得以提高，因此较为理想。
上述粘接剂16发生固化从而成为规定厚度的粘接层18。所获得的粘接层18将基板内元器件14固定在规定位置上，并且具有规定的绝缘性。只要在固化后会发挥规定的粘接强度以及规定的绝缘性，粘接剂16并无特别限定，可使用例如在紫外线固化型的环氧类树脂或者聚酰亚胺类树脂中加入填料的粘接剂、或者在热固化型的环氧类树脂或者聚酰亚胺类树脂中加入填料的粘接剂等。该填料可以使用例如二氧化硅、玻璃纤维等的微粉末。本实施方式中，使用在热固化型的环氧类树脂中添加了二氧化硅微粉末的低粘度型粘接剂。
接着，在包铜钢板6上经由粘接剂16搭载基板内元器件14(元器件搭载工序)。
首先，如图4所示，在涂布于搭载预定区域S的粘接剂16上搭载基板内元器件14。此处，根据图4可知，基板内元器件14是IC芯片等(未图示)被树脂所覆盖的长方体封装元器件，在该封装元器件的下部设置有多个端子20。该基板内元器件14以内部标记A、B为基准被定位于搭载预定区域S。具体而言，基板内元器件14被定位在如下位置：该位置配置于基板内元器件14的端子20与基座60的中央贯通孔62相对的位置上，处于端子20与填充区域63相接的状态。然后，基板内元器件14被压至第一金属层4一侧，其下表面15与基座60的上端部相抵接。由此，在第一金属层4的第二面5与基板内元器件14的下表面15之间，确保了规定厚度的空间。之后，粘接剂16被加热至规定温度，固化，成为粘接层18。由此，粘接层18的厚度成为所设计的厚度，确保了所需的粘接强度与绝缘性。其结果是，基板内元器件14被固定于规定位置。
接着，层叠绝缘基材，进行基板内元器件14、内部标记A、B、以及外部标记C、D的埋设(埋设层形成工序)。
首先，如图5所示，准备支承板22。这些绝缘基材22、24均为树脂制。此处，绝缘基材22、24优选使用在玻璃纤维中浸渍未固化状态的热固化性树脂而构成的片状即所谓的预浸渍体。绝缘基材22具有贯通孔30。该贯通孔30形成为能让基板内元器件14贯通的大小。以使得基板内元器件14贯通该贯通孔30的方式在第一金属层4上层叠绝缘基材22，在其上侧重叠绝缘基材24，并在其更上侧重叠要成为第二金属层28的铜箔，之后对整体进行热压。
由此，在预浸渍体的未固化状态的热固化性树脂被加压并填充至贯通孔30等的间隙中后，利用热压的热量进行固化。其结果是，如图6所示，形成由绝缘基材22、24构成的绝缘基板34，并在绝缘基板34内埋设基板内元器件14。此处，绝缘基材22中预先设置有贯通孔30(参照图5)，因此能够缓和进行热压时对基板内元器件14施加的压力。因此，即使是大型的基板内元器件14也能埋设于绝缘基板内。
接着，如图7所示，剥离支承板2(剥离工序)。
本工序中，从第一金属层4剥离支承板2，通过该剥离露出第一金属层4的第一面3。由此，能获得元器件内置基板的中间体40。该中间体40包括：绝缘基板34，该绝缘基板34的内部包含基板内元器件14；第一金属层4，该第一金属层4形成于该绝缘基板34的一个面(下表面)36上；以及第二金属层28，该第二金属层28形成于另一个面(上表面)38上。
接着，对于获得的中间体40，去除第一金属层4的规定部位，从而形成窗口(窗口形成工序)。
首先，如图8所示，检测出外侧标记C、D的位置，利用钻孔机形成一并贯通两个金属层4、28、绝缘基板34以及外侧标记C、D的基准孔(贯通孔标记)42、42。此处，外侧标记C、D的位置检测利用在通常的X射线孔加工时所使用的X射线照射装置(未图示)来进行。
之后，将基准孔42作为基准，确定存在内侧标记A、B的部分以及基座60存在的部分(以下称为基座存在部)T，对于所确定的位置，通过常用的蚀刻法来从第一金属层4的第一面3一侧去除第一金属层4的一部分。由此，形成使内侧标记A、B与绝缘基板34一起局部露出的第一窗口W1、以及使包含基座存在部T的粘接层18的部位露出的第二窗口W2。此时，如图9所示，第一窗口W1形成得比这些内侧标记A、B要大。由此，能在第一窗口W1容易地识别出整个内侧标记A、B。另一方面，在第二窗口W2，只要基座60的中央贯通孔62的填充区域63完全露出即可，也可以不露出整个基座60。此外，在本实施方式中，第一窗口W1及第二窗口W2均形成得较大，使得整个内侧标记A、B以及整个基座60露出。该情况下，无需提高形成窗口时的定位精度，从而有助于提高生产效率，因此较为优选。
接下来，去除基座60的中央贯通孔62内的粘接层18的填充区域63，在该填充区域63形成过孔(过孔形成工序)。
首先，利用光学系统定位装置(未图示)的光学系统传感器来识别露出的内侧标记A、B。然后，将内侧标记A、B的位置作为基准，来确定被粘接层18遮住的基板内元器件14的端子20的位置。之后，对确定的端子位置照射出激光、例如照射出二氧化碳激光，去除要使基板内元器件14的端子20露出的粘接层18的填充区域63。能够以一定程度宽度的照射范围R照射出所述激光，去除照射范围R内的粘接层18。
本发明中，基板内元器件14的端子20的位置与基座60的中央贯通孔62相一致，因此朝向包含中央贯通孔62的基座60的下端面照射激光。由此，中央贯通孔62内的粘接层18的填充区域63被去除，中央贯通孔62形成为到达端子20为止的激光过孔(以下记作LVH)46(图10)。此处，预先准确地将基座60的中央贯通孔62的位置、与基板内元器件14的端子20的位置对准，因此若去除中央贯通孔62内的粘接层18的填充区域63，则能在所设计的准确的位置形成LVH46。此处，在本发明中，即使激光的照射范围R如图11中的箭头标记X所示那样多少有所偏差，由于金属制的基座60为标记，因此能防止预先设定的位置以外的粘接层18被去除，而优先去除中央贯通孔62内的粘接层18的填充区域63。由此，本发明能更稳定地在准确的位置上形成LVH46。此外，由图11中的参考标记P所表示的点划线表示激光的照射范围的中心轴线。
由上述方式可知，本发明的特征在于，在形成LVH46时会再次使用基板内元器件14定位时所使用的内侧标记A、B。因此，能发挥出极高定位精度，并且能够对于被粘接层18遮住的端子20，在准确的位置上形成LVH46。
接下来，对形成有LVH46的中间体40实施镀覆处理之后，将铜填充于LVH46内，形成将基板内元器件14的端子20与第一金属层4电连接的导通孔(导通孔形成工序)。
首先，包含LHV36在内，对第一窗口W1及第二窗口W2内实施铜的无电解镀覆处理。由此，利用铜将在第一窗口W1及第二窗口W2局部露出的绝缘基板34以及粘接层18的表面、LVH46的内壁面以及基板内元器件14的端子20的表面覆盖。之后，实施铜的电解镀覆处理，如图12所示那样，使包含LVH46在内而覆盖整个第一金属层4的铜的镀覆层48成长。由此，LVH46内由铜填充，导通孔47得以形成，该导通孔47与第一金属层4形成为一体，基板内元器件14的端子20与第一金属层4电连接。
接下来，绝缘基板34的表面的第一金属层4以及第二金属层38的一部分被去除，形成规定的布线图案50(图案形成工序)。
利用通常的蚀刻法来去除两个金属层4、28的一部分。由此，如图13所示那样，获得在表面具有规定的布线图案50的绝缘基板34内内置有基板内元器件14的元器件内置基板1，该基板内元器件14具有与该布线图案50电连接的端子20。
本发明中，不预先对搭载预定区域S的金属层4开孔，因此粘接剂不会流到金属层4的下侧。由此，能使用粘度较低的类型的粘接剂。
如上述那样得到的元器件内置基板1能在表面安装其他电子元器件从而作为模块基板。另外，还能将该元器件内置基板1作为核心基板，利用常用的增层法来形成多层电路基板。
此外，在上述实施方式中，作为基板内元器件14的定位及LVH的定位的标记，使用内侧标记A及内侧标记B这两个标记，但本发明并不局限于该实施方式，在对基板内元器件14及LVH进行定位时，也可以采用仅使用内侧标记A及内侧标记B中的某一个的方式。本发明的特征在于，在对基板内元器件进行定位以及对设置LVH时的端子的位置进行确定时，使用同一个标记，即使仅使用内侧标记A及内侧标记B中的某一个，也能发挥出足够高的定位精度。在上述实施方式中，作为进一步提高定位精度的优选实施方式，对使用内侧标记A及内侧标记B这两个标记的方式进行了说明。
另外，本发明并不局限于将定位用的标记设置于搭载预定区域S附近的方式，也可以在离开搭载预定区域S的部分设置定位用的标记。由此，离开搭载预定区域S的部分设置定位用的标记的方式例如在大尺寸工件上形成多个元器件内置基板(零件)时采用。具体而言，该大尺寸工件是在边缘具备大框部的基板，在该大框部的内侧形成有多个片材。各片材在各自的边缘具有小框部，该小框部的内侧形成有多个零件。然后，最终切取下各零件，得到各个元器件内置基板。在上述工件上，例如在所述小框部形成主标记(内侧标记)，在所述大框部形成子标记(外侧标记)。由此，在大尺寸工件上，在上述被称作大框部及小框部的远离零件(搭载预定区域S)的部分形成主标记以及子标记(定位用标记)，以这些标记为基准，对元器件进行定位，并对设置LVH时的端子的位置进行确定。
此外，本实施方式中，作为内置于绝缘基板内的元器件，并不限于封装元器件，也能将贴片元器件等其它各种电子元器件作为对象。
标号说明
1 元器件内置基板
2 支承板
3 第一面
4 第一金属层
5 第二面
6 包铜钢板
8 掩模层
12 标记
14 电子元器件(基板内元器件)
16 粘接剂
18 粘接层
20 端子
34 绝缘基板
40 中间体
46 激光过孔(LVH)
47 导通孔
50 布线图案
60 基座
63 填充区域
N 非搭载区域
S 搭载预定区域

Claims (5)

1.一种元器件内置基板的制造方法，包含内置于表面具有布线图案的绝缘基板内的电气或电子元器件，该元器件的端子与所述布线图案电连接，该元器件内置基板的制造方法的特征在于，包括如下工序：
金属层形成工序，在该金属层形成工序中，在支承板上形成金属层，包含该金属层与所述支承部相接的第一面以及与该第一面相反侧的第二面，该第二面具有用于所述元器件的搭载预定区域以及该搭载预定区域以外的非搭载区域；
标记形成工序，在该标记形成工序中，在所述第二面的所述非搭载区域形成金属的主标记；
基座形成工序，在该基座形成工序中，在所述第二面的所述搭载预定区域形成所述主标记的同时形成具有中央贯通孔的金属的基座；
粘接剂涂布工序，在该粘接剂涂布工序中，将绝缘性的粘接剂涂布于所述搭载预定区域以及所述基座，形成粘接层，该粘接层具有在所述基座的所述中央贯通孔的位置上由所述粘接剂填满所述中央贯通孔内的填充区域；
元器件搭载工序，在该元器件搭载工序中，以所述主标记为基准对所述元器件进行定位，在所述元器件的所述端子与所述填充区域相接的状态下，将所述元器件搭载于所述粘接层上；
埋设层形成工序，该埋设层形成工序中，形成作为埋设所述元器件以及所述主标记的所述绝缘基板的埋设层；
剥离工序，在该剥离工序中，从所述金属层剥离所述支承板，通过该剥离露出所述金属层的第一面；
窗口形成工序，在该窗口形成工序中，从露出的第一面侧去除所述金属层的一部分，在所述金属层中分别形成至少使所述主标记露出的第一窗口以及至少使所述基座的所述中央贯通孔露出的第二窗口；
过孔形成工序，在该过孔形成工序中，以露出的所述主标记为基准确定所述元器件的端子的位置，将填满所露出的所述基座的所述贯通孔内的所述填充区域的所述粘接剂去除，在所述填充区域形成到达所述端子为止的过孔；
导通孔形成工序，在该导通孔形成工序中，对所述过孔实施镀覆处理，之后，通过将金属填充于所述过孔以及所述第二窗口内来形成使所述端子与所述金属层电连接的导通孔；以及
图案形成工序，在该图案形成工序中，将所述金属层形成为所述布线图案。
2.如权利要求1所述的元器件内置基板的制造方法，其特征在于，
在所述标记形成工序中，在形成所述主标记的同时也在所述第二面的非搭载区域上形成金属的子标记，
在所述剥离工序与所述窗口形成工序之间还包括贯通孔标记形成工序，在该贯通孔标记形成工序中，利用X射线来确定所述子标记，并形成一并贯通所述金属层、所述子标记、以及所述埋设层的贯通孔标记，
所述窗口形成工序以所述贯通孔标记为基准来形成所述第一窗口及第二窗口。
3.如权利要求1或2所述的元器件内置基板的制造方法，其特征在于，
所述主标记、子标记以及所述基座通过利用了阻镀膜的图案镀覆来形成。
4.一种元器件内置基板，其特征在于，
利用权利要求1所述的制造方法而制成。
5.如权利要求4所述的元器件内置基板，其特征在于，
还具备权利要求2的所述子标记以及所述贯通孔标记。
CN201180074702.9A 2011-11-08 2011-11-08 元器件内置基板的制造方法以及使用该方法制成的元器件内置基板 Pending CN103918356A (zh)

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