CN1627522A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN1627522A CN1627522A CNA200410042472XA CN200410042472A CN1627522A CN 1627522 A CN1627522 A CN 1627522A CN A200410042472X A CNA200410042472X A CN A200410042472XA CN 200410042472 A CN200410042472 A CN 200410042472A CN 1627522 A CN1627522 A CN 1627522A
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- film
- semiconductor device
- barrier layer
- interlayer dielectric
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Images
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N3/00—Arrangements or adaptations of other passenger fittings, not otherwise provided for
- B60N3/02—Arrangements or adaptations of other passenger fittings, not otherwise provided for of hand grips or straps
- B60N3/023—Arrangements or adaptations of other passenger fittings, not otherwise provided for of hand grips or straps movable
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- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
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- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60Y2304/07—Facilitating assembling or mounting
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP413199/2003 | 2003-12-11 | ||
JP2003413199A JP4659355B2 (ja) | 2003-12-11 | 2003-12-11 | 半導体装置およびその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710000712A Division CN100585860C (zh) | 2003-12-11 | 2004-05-21 | 半导体器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1627522A true CN1627522A (zh) | 2005-06-15 |
CN1329993C CN1329993C (zh) | 2007-08-01 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CNB200410042472XA Expired - Fee Related CN1329993C (zh) | 2003-12-11 | 2004-05-21 | 半导体器件及其制造方法 |
CN200710000712A Expired - Fee Related CN100585860C (zh) | 2003-12-11 | 2004-05-21 | 半导体器件及其制造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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CN200710000712A Expired - Fee Related CN100585860C (zh) | 2003-12-11 | 2004-05-21 | 半导体器件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7288799B2 (zh) |
JP (1) | JP4659355B2 (zh) |
KR (1) | KR100732132B1 (zh) |
CN (2) | CN1329993C (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101617399B (zh) * | 2007-02-27 | 2011-05-18 | 富士通半导体股份有限公司 | 半导体存储器件及其制造、测试方法、封装树脂形成方法 |
CN101213667B (zh) * | 2005-07-04 | 2012-05-30 | 富士通半导体股份有限公司 | 半导体器件及其制造方法 |
CN102881660A (zh) * | 2011-07-11 | 2013-01-16 | 富士通半导体股份有限公司 | 半导体器件及测试方法 |
CN103872041A (zh) * | 2012-12-14 | 2014-06-18 | 爱思开海力士有限公司 | 用于阻变存储装置的高压发生电路 |
CN103985696A (zh) * | 2013-02-11 | 2014-08-13 | 台湾积体电路制造股份有限公司 | 具有金属-绝缘体-金属电容器的封装件及其制造方法 |
CN111430324A (zh) * | 2020-04-09 | 2020-07-17 | 中国科学院微电子研究所 | 一种半导体结构及其形成方法、半导体器件、芯片 |
CN112750839A (zh) * | 2019-10-30 | 2021-05-04 | 铠侠股份有限公司 | 半导体装置 |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2213763A3 (en) * | 2003-08-11 | 2010-08-18 | Honeywell International Inc. | Target/backing plate constructions, and methods of forming target/backing plate constructions |
JP4357289B2 (ja) * | 2003-12-26 | 2009-11-04 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法及び半導体装置 |
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- 2004-05-21 CN CNB200410042472XA patent/CN1329993C/zh not_active Expired - Fee Related
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CN111430324A (zh) * | 2020-04-09 | 2020-07-17 | 中国科学院微电子研究所 | 一种半导体结构及其形成方法、半导体器件、芯片 |
Also Published As
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CN100585860C (zh) | 2010-01-27 |
JP4659355B2 (ja) | 2011-03-30 |
KR20050058182A (ko) | 2005-06-16 |
CN1983603A (zh) | 2007-06-20 |
US20050127395A1 (en) | 2005-06-16 |
KR100732132B1 (ko) | 2007-06-27 |
JP2005175204A (ja) | 2005-06-30 |
US7288799B2 (en) | 2007-10-30 |
CN1329993C (zh) | 2007-08-01 |
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