CN116197811A - 用于结合cmp工艺的追踪数据与3d打印的cmp耗材的技术 - Google Patents

用于结合cmp工艺的追踪数据与3d打印的cmp耗材的技术 Download PDF

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CN116197811A
CN116197811A CN202310301737.6A CN202310301737A CN116197811A CN 116197811 A CN116197811 A CN 116197811A CN 202310301737 A CN202310301737 A CN 202310301737A CN 116197811 A CN116197811 A CN 116197811A
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polishing
features
wireless communication
rfid tag
substrate
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J·G·方
R·巴贾杰
D·莱德菲尔德
A·康纳
M·科尔内霍
G·E·孟克
J·沃特金斯
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Applied Materials Inc
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Abstract

本文涉及用于结合CMP工艺的追踪数据与3D打印的CMP耗材的技术。本文提供化学机械抛光(CMP)设备及用于制造CMP设备的方法。CMP设备可包括抛光衬垫、抛光头保持环及抛光头膜等等，且可经由诸如三维(3D)打印工艺的增材制造工艺制造CMP设备。CMP设备可包括整合于其中的无线通信设备组件。制造CMP设备的方法包括将无线通信设备3D打印至抛光衬垫中且使抛光衬垫打印有经配置以接收预成型无线通信设备的凹部。

Description

用于结合CMP工艺的追踪数据与3D打印的CMP耗材的技术
本申请是申请日为2016年10月19日、申请号为201680070545.7、名称为“用于结合CMP工艺的追踪数据与3D打印的CMP耗材的技术”的中国专利申请(PCT申请号为PCT/US2016/057669)的分案申请。
技术领域
本公开的实施例一般而言是关于一种化学机械抛光(chemical mechanicalpolishing；CMP)设备及制作且使用此CMP设备的方法。更特定而言，本文所述的实施例关于用于收集CMP设备中的数据的技术，诸如收集关于CMP工艺的数据和/或关于在CMP抛光设备中找到的组件的数据的技术。
背景技术
化学机械抛光(chemical mechanical polishing；CMP)是常用于在半导体器件的制作期间平坦化基板的技术。在CMP工艺期间，将正处理的基板安装于载架头上，其中装置表面抵靠着旋转抛光衬垫定位。载架头将可控制负载提供至基板以推动装置表面抵靠着抛光衬垫。通常将抛光液(诸如，具有磨料颗粒的浆料)供应至抛光衬垫的表面。抛光衬垫是在抛光一定数目的基板之后通常变得磨损的耗材组件。因此，需要偶尔替换衬垫及其他CMP耗材组件以维持一致且适合的抛光性能。
通常通过模制、浇铸或烧结聚氨酯材料来制作抛光衬垫。在模制的情形中，可(例如通过注射模制)一次一个地制作抛光衬垫。在浇铸的情形中，将液体前体浇铸且固化成饼状物，随后将此饼状物切片成个别衬垫件。接着，可将衬垫件用机器加工至最终厚度。可将凹槽用机器加工至抛光表面中或作为注射模制工艺的部分形成凹槽。这些制造抛光衬垫的方法昂贵且耗时。此外，通过这些方法制造的抛光衬垫通常产生不均匀的抛光结果。例如，在CMP期间，可以不同速率抛光基板上的不同区域从而导致在一些区域中移除过多材料(“抛光过度”)或在其他区域中移除过少材料(“抛光不足”)。
另外，通过传统技术制造的抛光衬垫及其他CMP设备通常缺乏用于执行各种追踪、感测、监控及工艺计量功能的装置及方法。传统CMP系统通常依赖于系统级感测技术，这些感测技术通常不提供充足数据以适当地控制平坦化在进阶技术集成电路节点中形成的装置所需的CMP工艺。
因此，需要提供改良抛光性能及所期望工艺感测能力的CMP系统、抛光衬垫及其他CMP设备。另外，需要用于制造此设备的方法。
发明内容
在一个实施例中，提供一种抛光衬垫设备。此设备包括经打印的聚合主体，此经打印的聚合主体包括具有经配置以接触基板的上表面的一或多个抛光特征。经打印的聚合主体包括：第一区，其包括第一材料；以及第二区，其包括第二材料。RFID标签可整体地安置于经打印的聚合主体内且RFID标签定位于距上表面的一距离处。
在另一实施例中，提供一种化学机械抛光系统。此系统包括：平台，其具有支撑表面；以及经打印的抛光衬垫，其具有安置于其中的RFID标签。可将经打印的抛光衬垫安置于平台的支撑表面上方且亦可将询问器耦合至平台。询问器及RFID标签经配置以使用无线通信技术相互通信。亦可与平台相对地定位抛光头且抛光头可经配置以推动基板抵靠着经打印的抛光衬垫的抛光表面。
在又一实施例中，提供一种制造抛光衬垫的方法。此方法包括通过自打印头的第一喷嘴分配一或多种第一聚合材料而沉积抛光衬垫的经打印的第一部分。一或多种第一聚合材料可以是非导电的且可通过自打印头的第二喷嘴在抛光头的经打印的第一部分上分配一或多种第二聚合材料而沉积经打印的RFID标签。一或多种第二聚合材料可包括至少一种导电或半导电聚合材料。可通过自打印头的第一喷嘴分配一或多种第一聚合材料而在经打印的RFID标签及经打印的第一部分上方沉积抛光衬垫的经打印的第二部分。
在又一实施例中，提供一种使用经打印的抛光头的方法。此方法包括藉助安置于经打印的抛光衬垫内的RFID标签感测一或多个处理参数且经由询问器自RFID标签接收一或多个信号。此方法亦包括将一或多个信号传达至经调适以控制抛光工艺的控制器。
在又一实施例中，提供一种无线通信方法。此方法包括在抛光系统中执行基板抛光工艺。抛光系统可包括：平台；抛光衬垫，其耦合至平台；以及抛光头，其包括可移除地耦合至抛光头的一或多个组件。可将RFID标签耦合至一或多个组件且可经由可固定地安置于平台中的询问器自RFID接收一或多个无线通信信号。可分析一或多个无线通信信号且可自抛光头移除一或多个组件。
在又一实施例中，提供一种体现于在设计过程中使用的机器可读介质中的结构。此结构包括经打印的聚合主体，此经打印的聚合主体包括具有经配置以接触基板的上表面的一或多个抛光特征。经打印的聚合主体包括：一或多种实质上非导电第一材料；以及经打印的RFID标签，其包括可整体地安置于经打印的聚合主体内的一或多种第二材料。一或多种第二材料可以是导电的或半导电的。
在又一实施例中，提供一种非瞬态计算机可读介质。此计算机可读介质可存储指令，这些指令在由处理器执行时导致计算机系统通过执行以下操作而实施基板抛光工艺：导致基板抛光工艺的发起且接收对应于一或多个处理参数的信号。这些信号可由安置于经打印的抛光衬垫内的无线通信设备产生。可分析信号以确定处理条件且可响应于处理条件而改变一或多个处理参数中的至少一者。
在一些实施例中，可将RFID标签安置于抛光衬垫内或耦合至抛光衬垫且可将读取器安置于平台或抛光头内。在另一实施例中，可将RFID标签安置于保持环内或耦合至保持环且可将读取器安置于平台内。在另一实施例中，可将RFID标签安置于膜内或耦合至膜且可将读取器安置于平台内。可将各种传感器耦合至RFID标签以提供现场监控、感测及计量功能性。
附图说明
尽管下文简要概述其中可详细地理解本公开的上述特征的方式，但可参考附图中图示其中的一些的实施例更具体描述本公开。然而，应注意，附图仅图示示例性实施例且因此不应视为对其范围的限制，可承认其他同样有效的实施例。
图1A图示根据本文所述的实施例的抛光设备的示意性剖视图。
图1B图示根据本文所述的实施例的图1A的抛光设备的载架头的更详细横截面图。
图2是根据本文所述的实施例的抛光衬垫的示意性透视剖视图。
图3是根据本文所述的实施例的抛光衬垫的示意性横截面图。
图4是根据本文所述的实施例的具有一或多个观察窗的抛光衬垫的示意性横截面图。
图5是根据本文所述的实施例的包括支撑层的抛光衬垫的示意性横截面图。
图6图示根据本文所述的实施例的分别将RFID标签及读取器并入于其中的抛光衬垫及平台的部分示意性横截面图。
图7图示根据本文所述的实施例的RFID标签的电组件示意图。
图8图示根据本文所述的实施例的并入有近场通信组件的抛光头保持环及平台的部分横截面图。
图9图示根据本文所述的实施例的并入有近场通信组件的抛光头膜及平台的部分横截面图。
图10图示根据本文所述的一个实施例的制造具有RFID标签的抛光衬垫的方法。
图11图示根据本文所述的一个实施例的制造具有RFID标签的抛光衬垫的方法。
图12是根据本文所述的实施例的用于制造抛光衬垫的设备的示意性截面图。
为促进理解，在可能的情况下已使用相同组件符号来指定图中所共用的相同要素。应预期，可在不进一步赘述的情况下将一个实施例的要素及特征有益地并入于其他实施例中。
具体实施方式
本公开的实施例一般而言包括CMP设备及用于制造且使用该CMP设备的方法。CMP设备可包括抛光衬垫、抛光头保持环及抛光头膜等等，且可经由诸如三维(3D)打印工艺或2.5维(2.5D)打印工艺的增材制造工艺制造CMP设备。CMP设备可包括无线通信设备，诸如整合于其中的射频识别(radio frequency identification；RFID)或其他组件。制造CMP设备的方法包括将RFID标签3D打印至抛光衬垫中或3D打印至抛光衬垫上且使抛光衬垫打印有经配置以接收RFID标签的凹部。
图1A图示根据本文所述的实施例的抛光设备100的示意性截面图。可在抛光系统中利用抛光设备100来执行基板抛光。抛光台100包括平台102，此平台可绕中心轴104旋转。平台102的形状是大体圆形，但应预期，可有利地利用其他形状。可将抛光衬垫106耦合至平台102。尽管图示为耦合至平台102的单个抛光衬垫106，但应预期，也可取决于所期望的抛光特性而将多个抛光衬垫耦合至平台。根据本公开的实施例，抛光衬垫106可包括单材料层主体或复合材料主体。抛光衬垫106包括抛光表面112，其经配置以接触基板且通过自基板移除至少一些材料来处理基板。平台102支撑抛光衬垫106且在抛光期间旋转抛光衬垫106。
载架头108可紧固且固持抵靠着抛光衬垫106的抛光表面112处理的基板110。载架头108可绕中心轴114旋转和/或在划扫运动中移动以产生基板110与抛光衬垫106之间的相对运动。在抛光期间，可通过递送臂118将抛光流体116(诸如，磨料浆料)供应至抛光表面112。抛光液116可含有磨料颗粒、pH调整剂和/或化学活性组分以达成基板110的化学机械抛光。
一或多个无线通信设备600可安置于抛光衬垫106内或以其他方式耦合至抛光衬垫106。一或多个询问器601可安置于平台102内或以其他方式耦合至平台102。无线通信设备600及询问器601经配置以经由通信链路607通信。在一个实施例中，通信链路607可以是无线通信协议。在另一实施例中，通信链路607可以是有线连接。询问器以通信方式耦合至控制器612，此控制器可经由询问器601自无线通信设备600接收输入。参考图6更详细地讨论无线通信设备600、询问器601及控制器。
一般而言，无线通信设备600经配置以感测各种处理参数及系统组件。无线通信设备600可定位于抛光衬垫106内的各个位置处且可提供整个抛光表面112上方的经改良数据收集，可由控制器112分析数据以改良抛光工艺的控制。经由无线通信设备600收集的数据可用于实时工艺控制和/或用于确保兼容系统组件的利用，诸如适合的保持环120或柔性膜(未示出)以及其他系统组件。在这些实施例中，其他适合系统组件亦可采用无线通信设备以与询问器601通信。
图1B图示根据本文所述的实施例的图1A的抛光设备100的载架头108的更详细横截面图。如上文所述，载架头108经配置以在抛光或其他处理期间固持基板110。载架头108可抵靠着由可旋转平台102支撑的抛光衬垫106固持基板110且跨越基板110的背部表面136朝向抛光衬垫106分配压力。
载架头108包括基底总成140(其可直接或间接耦合至可旋转驱动轴件130)、保持环120及柔性膜132。柔性膜132在基底总成140下方延伸且与基底总成140耦合以提供多个可加压腔室，包括非圆形内腔室122a及毗邻外腔室122b。通路124a及124b穿过基底总成140形成以将腔室122a及122b分别流体地耦合至抛光设备100中的压力调节器。尽管图1B图示两个可加压腔室，但载架头108可具有任何数目的腔室，例如，三、四、五或更多个腔室。
尽管未示出，但载架头108可包括其他元件，诸如，可紧固至驱动轴件130且基底总成140可移动地自其悬吊的外壳、允许基底总成140枢转的万向节机构(其可视为基底总成140的部分)、基底总成140与外壳之间的加载腔室、腔室122a及122b内部的一或多个支撑结构或接触柔性膜132的内表面以将补充压力施加至基板110的一或多个内部膜。
柔性膜132可以是疏水性、耐用性且关于抛光工艺有化学惰性的。柔性膜132可包括经配置以接触基板110的背部表面136的安装部分138。一或多个活页134可经由夹环126、128将安装部分138耦合至基底总成140。一或多个活页134可分割腔室122a、122b以提供跨越基板110的区域压力控制。
保持环120可自柔性膜132径向向外地耦合至基底总成140。一般而言，保持环120经配置以防止基板110相对于柔性膜132过度移动且防止基板110的横向移动。保持环可由对抛光工艺中所用的化学组合物有惰性的材料制成。应预期，取决于所期望应用，保持环120可由诸如聚合物、陶瓷及金属的适合材料制成。
进阶衬垫配置及设计示例
图2是根据本文所述的实施例的抛光衬垫200的示意性透视剖视图。可在抛光台(诸如，抛光台100)中使用抛光衬垫200以通过化学机械抛光来抛光半导体基板。应预期，其他工业可使用可利用根据本文所述的实施例的抛光衬垫有利地处理的其他类型的基板。例如，光学工业可利用本文所述的衬垫及其他相关联的设备抛光各种透镜或镜片。
在所图示的实施例中，抛光衬垫200包括复合衬垫主体202。尽管未图示，但应预期，抛光衬垫主体202可由单种材料而非多种材料形成。复合衬垫主体202包括一或多个第一特征204及一或多个第二特征206。第一特征204及第二特征206是离散特征，这些离散特征在其边界处接合在一起以形成复合衬垫主体202。在一个实施例中，第一特征204可具有约40肖氏D级至约90肖氏D级的硬度。第二特征206可具有约26肖氏A级至约95肖氏A级之间的硬度值。
复合衬垫主体202可通过增材制造(例如，3D打印或2.5D打印)或其他适合技术(诸如浇铸或模制技术)形成。复合衬垫主体202可包括多个层，根据复合衬垫主体202的设计，每一层包括第二特征206的区和/或第一特征204的区。在一个实施例中，包括第一特征204和/或第二特征206的每一区可在同时或顺序打印工艺中由3D打印机沉积。例如，多个层可通过UV光或通过热源固化以凝固且达成目标硬度。在沉积且固化之后，形成整体复合衬垫主体202，包括耦合或接合在一起的第一特征204及第二特征206。固化工艺在关于非复合抛光衬垫的实施例中可以是必要的或可以不是必要的。
可针对第二特征206及第一特征204选择具有不同机械性质的材料以达成目标抛光工艺。可通过选择不同材料和/或挑选在特征形成工艺期间所用的不同固化工艺达成第二特征206及第一特征204的动态机械性质。在一个实施例中，第二特征206可具有较低硬度值及较低弹性模量值，而第一特征204可具有较高硬度值及较高弹性模量值。在另一实施例中，可在每一特征内和/或通过第二特征206及第一特征204在抛光衬垫200的抛光表面内或跨越此抛光表面的实体布局、图案或结合来调整或控制动态机械性质，诸如，弹性模量(或存储模量)及损耗模量。
第一特征204可由一或多种聚合物材料形成。用于形成第一特征204的材料可包括单种聚合物材料或两种或更多种聚合物的混合物以达成目标机械、表面、化学或热性质。在一个实施例中，第一特征204可由一或多种热塑性聚合物形成。第一特征204可由热塑性聚合物形成，诸如，聚氨酯、聚丙烯、聚苯乙烯、聚丙烯腈、聚甲基丙烯酸甲酯、聚氯三氟乙烯、聚四氟乙烯、聚甲醛、聚碳酸酯、聚酰亚胺、聚醚醚酮、聚苯硫醚、聚醚砜、丙烯腈丁二烯苯乙烯(acrylonitrile butadiene styrene；ABS)、聚醚酰亚胺、聚酰胺、三聚氰胺、聚酯、聚砜、聚乙酸乙烯酯、氟化烃及类似物，及丙烯酸酯、上述的共聚物、接枝物及混合物。在一个实施例中，第一特征204可由丙烯酸酯形成。例如，第一特征204可以是聚氨酯丙烯酸酯、聚醚丙烯酸酯或聚酯丙烯酸酯。在另一实施例中，第一特征204可包括一或多种热固性聚合物，诸如，环氧树脂、酚类、胺、聚酯、胺甲酸乙酯、硅及丙烯酸酯、上述的混合物、共聚物及接枝物。
在一个实施例中，第一特征204可由仿真塑料3D打印材料形成。在另一实施例中，第一特征204可由聚合材料形成，此聚合材料可以是单种聚合物或聚合物的组合或热塑性材料(诸如，热塑性聚合物)。在一个实施例中，可将磨料颗粒嵌入于第一特征204中以增强抛光工艺。包括磨料颗粒的材料可以是金属氧化物(诸如二氧化铈、氧化铝、二氧化硅或其组合)、聚合物、金属间化合物或陶瓷。
用于形成第二特征206的材料可包括一或多种聚合物材料。第二特征206可由单种聚合物材料或两种或更多种聚合物的混合物形成以达成目标性质。在一个实施例中，第二特征206可由一或多种热塑性聚合物形成。例如，第二特征206可由热塑性聚合物形成，诸如，聚氨酯、聚丙烯、聚苯乙烯、聚丙烯腈、聚甲基丙烯酸甲酯、聚氯三氟乙烯、聚四氟乙烯、聚甲醛、聚碳酸酯、聚酰亚胺、聚醚醚酮、聚苯硫醚、聚醚砜、丙烯腈丁二烯苯乙烯(acrylonitrile butadiene styrene；ABS)、聚醚酰亚胺、聚酰胺、三聚氰胺、聚酯、聚砜、聚乙酸乙烯酯、氟化烃及类似物，及丙烯酸酯、上述的共聚物、接枝物及混合物。在一个实施例中，第二特征206可由丙烯酸酯形成。例如，第二特征206可以是聚氨酯丙烯酸酯、聚醚丙烯酸酯或聚酯丙烯酸酯。在另一实施例中，第二特征206可由热塑性弹性体形成。在一个实施例中，第二特征206可由类橡胶3D打印材料形成。
在一些实施例中，第一特征204相对于第二特征206较硬且较刚性，而第二特征206相对于第一特征204较软且较柔性。可选择第一特征204及第二特征206的材料及图案以达成抛光衬垫200的“经调谐”块体材料。用此“经调谐”块体材料形成的抛光衬垫200具有各种优点，诸如改良的抛光结果、降低的制造成本、延长的衬垫寿命。在一个实施例中，“经调谐”块体材料或抛光衬垫作为整体可具有约65肖氏A至约75肖氏D之间的硬度。抛光衬垫的抗张强度可以是在5MPa至约75MPa之间。抛光衬垫可具有约5％至约350％的断裂伸长率。抛光衬垫可具有高于约10MPa的抗剪强度。抛光衬垫可具有约5MPa至约2000MPa之间的存储模量。抛光衬垫可在约25℃至约90℃之间的温度范围内具有稳定存储模量以使得E30/E90下的存储模量比落入约6至约30之间的范围内，其中E30是30℃下的存储模量且E90是90℃下的存储模量。
在一个实施例中，第一特征204及第二特征206的材料在化学上耐受来自抛光浆料的攻击。在另一实施例中，第一特征204及第二特征206的材料是亲水性的。
一般而言，第一特征204及第二特征206可以是交替的同心环，这些同心环交替地排列以形成圆形复合衬垫主体202。在其他实施例中，第一特征206及第二特征106可以是交替或其他适合排列中的自主体202延伸的离散柱。应预期，对于本文所述的实施例，亦可有利地利用各种其他抛光衬垫表面设计。在一个实施例中，第一特征204的高度210高于第二特征206的高度212以使得第一特征204的上表面208自第二特征206凸出。在第一特征204与第二特征206之间形成凹槽218或通道。在抛光期间，第一特征204的上表面208形成接触基板的抛光表面，而凹槽218保持抛光流体。在一个实施例中，第一特征204经形成在垂直于与复合衬垫主体202平行的平面的方向上具有一厚度，该厚度大于第二特征206的厚度，以使得凹槽218和/或通道形成于复合衬垫主体202的顶部表面上。
在一个实施例中，第一特征204的宽度214可在约250微米至约2毫米之间。第一特征204之间的节距216可在约0.5毫米至约5毫米之间。每一第一特征204可具有在约250微米至约2毫米之间的范围内的宽度214。宽度214和/或节距216可跨越抛光衬垫200的半径至硬度不同的区带变化。
与传统抛光衬垫相比，本公开的复合抛光衬垫200具有数个优点。传统抛光衬垫一般而言包括抛光层，此抛光层具有由软材料(诸如，发泡体)形成的子衬垫支撑的带纹理抛光表面和/或磨料材料以获得用于抛光基板的目标硬度或弹性模量。通过选择具有诸如帕松比(Poisson's ratio)、弹性模量及损耗模量等各种机械性质的材料且调整特征的尺寸及间距或变化不同特征的排列，可在不使用子衬垫的情况下在复合衬垫主体202中达成所期望硬度、动态性质和/或机械性质。因此，抛光衬垫200通过消除子衬垫降低持有成本。另外，可通过混合具有不同硬度及研磨性的特征来调谐抛光衬垫200的硬度及研磨性，因此，改良抛光性能。
根据本公开的复合抛光衬垫可通过调整图案变化和/或特征大小变化跨越表面特征(诸如，第一特征204)及基底材料(诸如，第二特征206)具有不同机械性质，诸如弹性模量(杨氏模量)及损耗模量。跨越抛光衬垫的机械性质可以是对称或不对称、均匀或不均匀的，以达成目标性质。表面特征的图案可以是径向、同心、矩形或随机的以跨越抛光衬垫达成目标性质，诸如预定机械性质，诸如弹性模量及损耗模量。在一些实施例中，第一特征及第二特征可经互锁以改良复合抛光衬垫的强度且改良复合抛光衬垫的实体完整性。第一特征及第二特征的互锁可增加抛光衬垫的抗剪强度、压缩强度和/或抗张强度。
当在抛光衬垫中并入有各种感测设备时，诸如3D打印的增材制造工艺可提供优点。下文将关于图6及7更详细地讨论诸如RFID标签及计量传感器的感测设备。
图3是根据本文所述的实施例的抛光衬垫300的示意性横截面图。抛光衬垫300包括基底层302，类似于抛光衬垫200的第二特征206的实施例，此基底层是软且弹性的。类似于第二特征206，基底层302可由一或多种弹性体聚合物形成。抛光衬垫300包括自基底层302延伸的多个表面特征306。表面特征306的外表面308可由软材料或软材料的复合物形成。在一个实施例中，表面特征306的外表面308可由与基底层302相同的材料或材料的相同复合物形成。表面特征306亦可包括嵌入于其中的第一特征304。第一特征304可由比表面特征306更硬的材料或材料的复合物形成。第一特征304可由类似于抛光衬垫200的第一特征204的材料或多种材料的材料形成。经嵌入的第一特征304变更表面特征306的有效机械性质，且因此可提供具有所期望机械和/或动态性质的衬垫供用于抛光。外表面308的软聚合层可用于减少正被抛光的基板上的缺陷且改良基板上的平坦化。替代地，可在含有本公开的抛光衬垫的其他较硬材料的表面上打印软聚合物材料以提供类似益处。
抛光衬垫300亦可包括安置于其中的无线通信设备600。除由第一特征304提供的机械性质以外，第一特征304亦可耦合至无线通信设备600，以使得可通过无线通信设备600中的组件收集某种形式的电数据(例如，电容、电阻等)。第一特征304可经由可在抛光衬垫制造工艺期间打印的导线310或类似物耦合至无线通信设备600。在一个实施例中，导线310可由与用于打印抛光衬垫300的材料兼容的一或多种导电材料打印。
在一个实施例中，第一特征304可包括充当磨损指示器的导电元件。在一些实施例中，在抛光期间，表面特征306可最终磨损掉且暴露第一特征304。可在移除表面特征306且暴露第一特征304时发起由无线通信设备600接收的各种信号(声学、电、压力等)。响应于第一特征304的暴露改变和/或产生信号可导致无线通信设备600与询问器601(未示出)通信且将处理数据提供至控制器612。因此，处理系统的操作者可接收关于使用及抛光参数的实时数据。在一个实施例中，第一特征304的暴露可指示抛光衬垫磨损且可替换抛光衬垫300以确保基板的适当抛光。
图4是根据本文所述的实施例的具有形成于其中的一或多个观察窗410的抛光衬垫400的示意性横截面图。抛光衬垫400可具有类似于抛光衬垫200的衬垫主体402。衬垫主体402可包括一或多个第二特征406及自第二特征406延伸供用于抛光的多个第一特征404。第二特征406及第一特征404可由类似于用于抛光衬垫200的第二特征206及第一特征204的材料的材料形成。可根据本公开以任何适合图案排列第一特征404。
抛光衬垫400亦含有一或多个观察窗410，这些观察窗可由透明材料形成以允许在抛光期间观察基板。观察窗410可穿过第二特征406或第一特征404形成和/或邻接第二特征406或第一特征404的部分。可在正通过使用增材制造工艺形成第一特征402及第二特征406时形成观察窗410。在一些实施例中，观察窗410可由实质上透明的材料形成，且因此能够透射自供在CMP光学端点检测系统中使用的激光器和/或白光源发射的光。在一个实施例中，观察窗410可由透明3D打印光聚合物形成。例如，观察窗410可由聚甲基丙烯酸甲酯(polymethylmethacrylate；PMMA)形成。在一些实施例中，观察窗410由以下材料形成：具有低折射率(相对于抛光浆料的折射率)且具有高光学透明度以减少自空气/窗/水界面的反射且改良穿过观察窗410往返于基板的光的透射。选择材料的光学透明度以在由端点检测系统的光学检测器使用的光束的波长范围内提供至少约25％(例如，至少约50％、至少约80％、至少约90％、至少约95％)光透射。典型的光学端点检测波长范围包括可见光谱(例如，自约400nm至约800nm)、紫外线(ultraviolet；UV)光谱(例如，自约300nm至约400nm)和/或红外线光谱(例如，自约800nm至约1550nm)。
图5是包括背托层506的抛光衬垫500的示意性透视截面图。抛光衬垫500包括基底材料层504及自基底材料层504凸出的多个表面特征502。抛光衬垫500可类似于上文所述的抛光衬垫200、300、400，除背托层506附接至基底材料层504以外。背托层506可以向抛光衬垫500提供所期望可压缩性。背托层506亦可用于变更抛光衬垫500的总体机械性质以达成所期望硬度和/或具有所期望动态材料性质(例如，弹性模量及损耗模量)。背托层506可具有小于80肖氏A级的硬度值。
在一个实施例中，背托层506可由开放巢孔式或闭合巢孔式发泡体(诸如，具有空隙的聚氨酯或多聚硅氧)形成，以使得当施加压力时巢孔(cell)/空隙坍塌且背托层506以可预测方式压缩。在另一实施例中，背托层506可由天然橡胶、乙烯丙烯二烯单体(ethylenepropylene diene monomer；EPDM)橡胶、腈或聚氯丙烯(氯丁橡胶)等等形成。
在一个实施例中，可通过使用增材制造工艺(诸如，3D打印工艺)形成背托层506。在此配置中，背托层506可由单种聚合物材料或两种或更多种聚合物的混合物形成以达成所期望机械及动态材料性质。在一个配置中，表面特征502及基底材料层504直接形成于背托层506上。在一个实施例中，背托层506可由一或多种热塑性聚合物形成，且因此可包括上文连同第一特征204和/或第二特征206所述的材料中的一或多者。
在某些实施例中，无线通信设备600可安置于抛光衬垫500中或耦合至抛光衬垫500。在一个实施例中，无线通信设备600可安置于基底材料层504或表面特征502中。在所图示的实施例中，无线通信设备600可安置于背托层506中。不管无线通信设备600的位置如何，无线通信设备600可经确定大小以跨越多个表面特征502感测一或多个处理参数。例如，可由无线通信设备600同时感测两个或更多个表面特征502。因此，可跨越抛光表面的较大区域感测各种处理参数(温度、压力、电导率等)而非感测单个表面特征502。通过感测抛光表面的较大区域，可由无线通信设备600检测经区域平均的信号。在利用多个无线通信设备600的实施例中，可通过结合来自个别无线通信设备600的数据来确定经全局平均的信号。
信息收集系统配置示例
图6图示根据本文所述的实施例的其中分别并入有无线通信设备600及询问器601的抛光衬垫200及平台102的部分示意性横截面图。抛光衬垫200意欲表示经配置以在其中并入有整合感测或计量设备的任何抛光衬垫。例如，抛光衬垫可被打印、浇铸或模制，无线通信设备600被安置于其中。在一个实施例中，无线通信设备600经配置以与询问器以无线方式通信。无线通信协议的示例包括近场通信技术、
Figure BDA0004145317660000131
光学信号传输技术、声学信号传输技术、射频通信技术及其他适合无线通信技术。替代地，无线通信设备600可硬连线至询问器601以促进其间的通信。
尽管图6中图示单个无线通信设备600及单个询问器601，但应预期，可在衬垫及平台中分别实施多个无线通信设备600及询问器601(参见图1)。另外，可由单个询问器601感测一或多个无线通信设备600。亦应预期，无线通信设备600可定位于衬垫200的表面之内或之上各个位置处，诸如，中心位置(即，圆形衬垫的原点或旋转轴重合点处)、中间位置(即，距圆形衬垫的原点的1/2半径)或外部位置(即，毗邻的圆形衬垫的圆周)。亦可组合地利用多个NFC设备600且可一起利用各个位置(即，中心位置及外部位置，或中心、中间及外部位置)。通过相互协调地利用多个无线通信设备600，将由于跨越衬垫20在多个地址处收集数据而产生处理环境的较综合视角。一般而言，无线通信设备600相对于衬垫200定位以使得基板110的路径在处理期间跨越抛光系统100的抛光表面在抛光工艺的各个点期间重叠。
类似地，询问器601可定位于平台102内各个位置处，诸如中心、中间及外部位置。询问器的位置可独立于无线通信设备600位置确定或可至少部分地通过无线通信设备位置来确定以促进无线通信设备600与询问器601之间的通信。
安置于平台102中的询问器601一般而言包括读取器608及天线610。读取器可包括或耦合至电源(诸如，RF电源)且可经配置以经由天线610传输待由无线通信设备600接收的信号。在一个实施例中，读取器608可除其他设备外亦包括RF调制器及询问器控制器，此询问器控制器经配置以管理读取器608的信号传输及接收。在一个实施例中，RF调制器可经配置以产生和/或调制具有约13.56MHz的波长的RF信号。在被动标签实施例中，询问器601及无线通信设备600可以具有小于约12英寸(例如，小于约2英寸，诸如小于约1英寸)的距离的空间关系定位。在主动标签实施例中，询问器601与无线通信设备600之间的空间关系可大于被动标签实施例且可取决于可用于信号传输的功率。
无线通信设备600一般而言包括标签602及天线606，此天线耦合至标签602或整体地制造于标签602中。在某些实施例中，传感器604亦可以通信方式耦合至标签602。取决于所期望实现，标签602可以是主动标签或被动标签。在主动标签实施例中，电源(诸如，电池)可电耦合至标签且将适合功率提供至标签，因此标签可经由形成于装置之间的通信链路607将信号传输至询问器601。应预期，主动标签可实施于其中将功率耦合至标签的实施例中。另外，主动标签可用于其中由标签传输的数据意欲在大于可在使用被动标签时所获得距离的距离处由询问器601感测的实施例中。然而，应预期，主动标签可用于其中会适合地利用被动标签的近场通信实施例中。
在被动标签实施例中，标签可经配置以自询问器601接收信号(诸如，射频信号)且利用所接收信号的电磁能以经由通信链路607将含有标签602独有的一定量的数据的信号传输(或反射)回询问器601。被动标签可用于其中以小于距标签602的临界通信距离定位询问器601的实施例中。临界通信距离一般而言定义为超出后便不由询问器601可靠地接收由被动标签反射的电磁信号的距离。临界通信距离可取决于与由询问器601产生的信号相关联的功率量和标签传输器的大小及功率而根据实施例变化。下文参考图7讨论被动标签的更详细描述。
图7图示根据本文所述的实施例的无线通信设备600的电组件示意图。图7中所图示的实施例意欲表示基本功能标签，且因此应预期，可实施各种其他电组件设计或配置以达成标签的所期望功能。标签602一般而言包括晶体管702、电感器704、电容器706及集成电路708。在一个实施例中，集成电路708可表示经配置以存储标签602独有的数据的存储器。在另一实施例中，存储器可经配置以在将由传感器604接收的数据传输至询问器601之前存储此数据。在某些实施例中，电感器704(诸如，电感线圈)可用作天线以在询问器601与电感器704之间接收且传输信号。在一个实施例中，电感器704是天线606且用于经由形成于装置之间的通信链路将含有来自标签602的数据的信号以电感方式反射至询问器601。
重新参考图6，无线通信设备600及更特定而言标签602可定位于抛光衬垫200内在衬垫200的上表面208下方，此上表面在处理期间接触基板。在一个实施例中，无线通信设备600定位于上表面208下方约200μm与约500μm之间的距离620处。可基于由标签602和/或传感器604执行的感测的所期望类型及衬垫200的表面的形貌(例如，凹槽、通道或其他特征)而选择距离620。在另一实施例中，标签602可定位于顶部表面208下方距离620处但传感器604可较靠近于顶部表面208。尽管仅图示一个传感器604，但应预期，可并入有多个传感器以提供一系列追踪、感测及计量数据以监控及改良抛光性能。例如，可现场(即，在抛光期间)执行由无线通信设备600确定的抛光性能且可现场调整处理参数以改良基板抛光特性。可感测的处理参数包括温度数据、压力数据、电导率数据、弹性模量数据、光学数据、声学数据、膜厚度数据及经配置以在基板抛光工艺期间测量处理参数的其他数据类型。
在一个实施例中，安置于传感器604与衬垫200的抛光表面之间的衬垫200的区622可经配置以增强通过使用耦合至区622的传感器604对所期望处理参数的测量。在一个实施例中，区622可自传感器604延伸至衬垫200的顶部表面208，或在另一实施例中，区622可自传感器604延伸至凹槽218。通过减小感测所期望处理参数的“阻力”，可实时达成处理参数的较准确测量。例如，若传感器604是温度传感器，则区622可由导热系数大于衬垫200的其余部分的导热材料形成。通过减小衬垫200的抛光表面与传感器604之间的热阻，可以较大速率达成由传感器604进行的信号检测。
在另一示例中，若传感器604是压力传感器，则区622可由弹性模量大于衬垫200的其余部分的材料形成。换言之，区622可比周围衬垫材料更硬以促进在抛光表面处对所施加压力的较准确感测。在另一示例中，若传感器604是经配置以检测抛光表面处的电导率的改变的电导率传感器，则区622可由含有电导率大于周围衬垫材料的区的材料形成。因此，可减小区622中的电阻，这可改良传感器604自抛光表面接收信号的数据速率。应预期，可采用各种其他传感器且可在区622中利用适当配置的材料以改良处理参数检测的准确性。一般而言，可经由3D打印工艺有利地采用区622的制造，3D打印工艺以成本高效且可控制方式达成衬垫200内的材料选择性。
传感器604意欲表示适于在CMP工艺中使用的各种类型的感测及计量设备。在一个实施例中，传感器604可经配置用于抛光系统识别及追踪。例如，抛光系统100可经配置以在将具有无线通信设备600的抛光衬垫安装至平台102时参与操作。在此实施例中，平台102中的询问器601将自标签602接收数据，该数据指示已将正确类型的抛光衬垫安装于抛光系统上。在经由由询问器601接收的标签数据认证抛光衬垫类型之后，抛光系统101将“解锁”且参与全部抛光功能性。在一些实施例中，在经由所接收标签数据认证抛光衬垫类型之后，抛光系统101基于所接收标签数据调整一或多个抛光参数。在一个示例中，所接收标签数据可包括关于抛光衬垫类型、衬垫配置(例如，表面特征502、基底材料层504以及背托层506类型、厚度)、衬垫200的表面结构的信息或其他有用信息。
在另一实施例中，传感器604可用于追踪安装于抛光系统100上的抛光衬垫的使用统计。例如，可由无线通信设备600追踪已利用衬垫的循环数量且可将该数据传输至询问器601。可解释该数据且可较准确地追踪衬垫寿命以确保以提供经改良抛光特性的间隔替换衬垫。在一些实施例中，抛光系统101基于在经传输标签数据中接收的抛光衬垫的经追踪使用统计而调整一或多个抛光参数。
在一些实施例中，传感器604(或在某些实施例中，多个传感器)可经配置以检测一或多个抛光参数。在一个示例中，传感器604可以是热传感器(例如，RTD、热电偶)，此热传感器包括经配置以检测抛光衬垫200、浆料、基板110或其任何组合的温度的组件。在另一示例中，传感器604可以是声学传感器(未示出)，此声学传感器经配置以确定抛光工艺期间的声学振动改变。电导率传感器是可用于无线通信设备600中的另一类型的传感器604。在此示例中，电导率传感器(未示出)可经配置以检测浆料中的金属负载(即，金属浓度的增加)或由于自衬垫200的各个区的浆料清洁所致的跨越衬垫200的表面的电导率改变。在一个配置中，电导率传感器可包括两个电极(未示出)，这些电极与标签602及无线通信设备600通信且各自暴露于抛光表面208处。接着可使用经暴露电极以通过使用标签602中所找到的组件跨越电极施加电压而直接测量浆料、基板表面和/或衬垫200的表面的电导率。在一些实施例中，抛光系统101基于自标签602递送至询问器601的经传输标签数据中所接收的一或多个抛光参数数据而调整一或多个抛光参数。
传感器604的另一示例是加速度计(例如，MEMS装置)，此加速度计可经配置以感测角动量、动态力、相对于角旋转方向自平面向外的振动移动和/或扭矩的改变。传感器604的额外示例是用于感测抛光期间抵靠着基板110的衬垫200的剪应力的摩擦力传感器，诸如，应变仪。传感器604的又一实施例是压力传感器，诸如荷重计(例如，MEMS荷重计)，此压力传感器可经配置以测量施加至衬垫200的力及跨越基板110的地带压力(即，腔室122a、122b)。在一些实施例中，抛光系统101基于加速度计、摩擦力传感器、自标签602传送至询问器601的剪应力和/或负载数据而调整一或多个CMP抛光参数。
上述传感器实施例可单独或相互结合地用于在抛光期间更有效地测量处理参数。应预期，可实施抛光工艺的现场处理和/或实时调整以改良(例如)抛光均匀性及抛光端点检测。一般而言，响应于一或多个经检测处理参数而由传感器604产生的信号可由标签602编码且由天线606传输。抛光系统101经配置以基于在自标签602递送至询问器601及控制器612的经传输标签数据中所接收的传感器数据而调整一或多个抛光工艺参数。
询问器601亦可以通信方式耦合至基于处理器的系统控制器，诸如，控制器612。例如，控制器612可经配置以导致由读取器608产生信号。控制器612亦可经配置以接收且分析经由询问器601自无线通信设备602接收的数据。控制器612包括可编程中央处理单元(central processing unit；CPU)614，此可编程中央处理单元可与耦合至抛光设备100的各种组件的存储器618(例如，非易失性存储器)及大容量存储装置、输入控制单元及显示单元(未示出)(诸如，电源、时钟、高速缓存、输入/输出(input/output；I/O)电路及类似物)一起操作以促进基板抛光工艺的控制。控制器612亦可包括用于经由抛光设备100中的系统级传感器监控基板处理的硬件。
如上文所述，为促进抛光设备100(且更特定而言，无线通信设备600及询问器601)的控制，CPU 614可以是可在用于控制各种腔室及子处理器的工业环境(诸如，可编程逻辑控制器(programmable logic controller；PLC))中使用的任何形式的通用计算机处理器中的一者。存储器618耦合至CPU 614且存储器618是非瞬态的且可以是现成存储器中的一或多者，诸如随机存取存储器(random access memory；RAM)、只读存储器(read onlymemory；ROM)、软盘驱动器、硬磁盘或任何其他形式的数字存储器(本地或远程)。支持电路616耦合至CPU 614以用于以传统方式支持处理器。经由询问器601来自无线通信设备600的信号产生指令、数据接收及分析可由存储器618执行且通常作为软件例程存储于存储器618中。软件例程亦可由第二CPU(未示出)存储和/或执行，此第二CPU位于正由CPU 618控制的硬件的远程。
存储器618为含有指令的计算机可读存储介质的形式，这些指令在由CPU 614执行时促进抛光设备100的操作，包括无线通信设备600及询问器601的操作。存储器618中的指令为程序产品(诸如，实施本公开的方法的程序)形式。程序代码可依照若干不同程序设计语言中的任何一者。在一个示例中，本公开可实施为存储于计算机可读存储介质上供与计算机系统一起使用的程序产品。程序产品的程序定义实施例(包括本文所述的方法)的功能。说明性计算机可读存储介质包括但不限于：(i)不可写入存储介质(例如，计算机内的只读存储器装置诸如可由CD-ROM驱动器读取的CD-ROM盘、闪存、ROM芯片或任何类型的固态非易失性半导体存储器)，信息永久地存储在此存储介质上；以及(ii)可写入存储介质(例如，磁盘驱动器或硬盘驱动器内的软盘或任何类型的固态随机存取半导体存储器)，在此存储介质上存储可变更信息。这些计算机可读存储介质在携载针对本文所述的方法的功能的计算机可读指令时为本公开的实施例。
图8图示根据本文所述的实施例的图示并入有无线通信设备600的保持环120及平台102的抛光头108的部分横截面图。一般而言，保持环120经配置且经定位以防止抛光工艺期间基板110的不期望移动。如图所示，保持环120可自柔性膜132向外径向地安置。因此，保持环120毗邻于且极接近于衬垫106及平台102而安置。在某些实施例中，保持环120可被可移除地耦合至抛光头108以促进保持环120的替换(若需要)。
在一个实施例中，无线通信设备600可安置于保持环120的面向衬垫106的表面上或限定此表面。替代地，无线通信设备600可安置于保持环120内远离保持环120的面向衬垫106的表面的另一位置处。无线通信设备600及询问器601可如此接近地安置以允许抛光工艺期间的近场通信。因此，将一或多个传感器(诸如，上文所述的传感器)并入至保持环120中可以是有利的。
在一个实施例中，可通过3D打印工艺制造保持环120及无线通信设备600。3D打印工艺可达成保持环120及无线通信设备600的同时制作。替代地，可在保持环120的3D打印期间维持空隙且随后可将预制造的无线通信设备插入至此空隙中。在某些实施例中，无线通信设备600可提供关于经由抛光系统100旋转抛光头108的处理数据。亦应预期，除非诸如衬垫106、平台102及抛光头108的适当配置组件的每一者皆安装于抛光系统100上，否则保持环100及无线通信设备600可用于“锁定”抛光系统100的操作。亦可由安置于保持环120中的无线通信设备600检测其他抛光工艺参数监控及感测，诸如热、电导率、压力、应力及声学感测。
图9图示根据本文所述的实施例的并入有无线通信设备600的柔性膜132及平台102的部分横截面图。柔性膜132一般而言经配置以将基板110紧固于柔性膜上且在抛光期间推动基板110抵靠着衬垫106。柔性膜132一般而言利用压力梯度以将基板110耦合于柔性膜上以防止抛光工艺期间的基板110的不期望移动。在某些实施例中，柔性膜132可被可移除地耦合至抛光头108以促进柔性膜132的替换(若需要)。
在一个实施例中，无线通信设备600可安置于限定腔室122a、122b中的任一者或此两者的柔性膜132的表面上或限定此表面。替代地，无线通信设备600中的一或多者可安置于柔性膜132的一部分内。因此，柔性膜132毗邻于且极接近于正抵靠着衬垫106及平台102推动的基板110的后表面安置。无线通信设备600及询问器601可如此接近地安置以允许抛光工艺期间的近场通信。因此，将一或多个传感器(诸如，上文所述的传感器)并入至柔性膜132中可以是有利的。
在一个实施例中，可通过3D打印工艺制造柔性膜132及无线通信设备600。3D打印工艺可达成柔性膜及无线通信设备600的同时制作。在此实施例中，无线通信设备600可全部地或部分地安置于柔性膜132内。在此示例中，应预期，无线通信设备600可呈现适合挠度以允许柔性膜132的挠曲。替代地，可在柔性膜132的3D打印期间维持空隙且随后可将预制造的无线通信设备插入至此空隙中。
类似于安置于保持环120内的无线通信设备，无线通信设备600可提供关于经由抛光系统100旋转包括柔性膜132的抛光头108的处理数据。在另一实施例中，无线通信设备600可提供关于柔性膜132的加压及降压循环的处理数据。亦应预期，除非诸如衬垫106、平台102及抛光头108的适当配置组件的每一者皆安装于抛光系统100上，否则柔性膜132及无线通信设备600可用于“锁定”抛光系统100的操作。如上文所述，在提供抵靠着基板110施加的压力数据的监控及感测中，并入有无线通信设备600的柔性膜132可尤其有用。亦可由安置于柔性膜132中的无线通信设备600执行其他抛光工艺参数监控及感测，诸如热、电导率、压力、应力及声学感测。
应预期，可结合图8及图9的实施例以提供具有安置于保持环120及柔性膜132两者内的无线通信设备600的抛光系统100。一般而言，无线通信设备600可经配置以在抛光系统100内的不同位置处感测相同处理参数或无线通信设备600可经配置以感测不同处理参数。此外，无线通信设备600可制造至抛光头108的其他组件(诸如，3D打印的组件)中。另外，耦合至保持环120或柔性膜132的无线通信设备600可与询问器601通信，此询问器可固定地安置于平台102内。由询问器601接收的信号可由控制器612分析且可自抛光头108移除保持环120和/或柔性膜132。例如，若来自无线通信设备600的信号指示保持环120和/或柔性膜132的不良处理性能，则可替换保持环120和/或柔性膜132。替代地，若保持环120和/或柔性膜132未经配置供在抛光头108中使用，则控制器612可指示其不兼容性且可用适当配置组件替换保持环120和/或柔性膜132。
无线通信设备600一般而言经配置以按毫秒数据速率或更大速率收集数据。因此，适合于检测且传输处理参数数据的时间常数可以是无线通信设备600的优点。在某些实施例中，可相关于正检测的参数自无线通信设备600的物理位置导出经改良的时间常数。因此，可执行实时参数感测且将此实时参数感测传达至控制器612以改良抛光工艺。
另外，可连续地或间歇地操作无线通信设备600。例如，若无线通信设备600安置于衬垫200内，则无线通信设备600可经配置以连续地感测各种处理参数。替代地，可间歇地操作无线通信设备600以在正在毗邻无线通信设备600的区中抛光基板时检测处理参数。类似地，可连续地或间歇地操作耦合至保持环120或柔性膜132的无线通信设备600。控制器612可耦合至可确定抛光头108相对于询问器601的位置的邻近传感器(未示出)或类似物。当抛光头定位于适合于由询问器601通信的区中时，邻近传感器可将信号提供至控制器612。控制器612可导致询问器601发起无线通信设备600与询问器601之间的信号传输。当抛光头108(及耦合至保持环120或柔性膜132的无线通信设备600)位于适合于与询问器601通信的位置中时，邻近传感器可发信号至控制器612且控制器612可终止自询问器601的信号传输和/或接收。
在利用多个无线通信设备600的实施例中，询问器601可经配置以与多个无线通信设备600通信且经由控制器612协调抛光。替代地，可利用多个询问器。在此实施例中，可将单个无线通信设备以通信方式耦合至单个询问器。应预期，可利用任何数目的无线通信设备及询问器以改良抛光工艺监控及感测。若利用多个无线通信设备及询问器，则可将各种波长滤波器和/或电磁屏蔽设备并入至抛光系统中以减少或消除无线通信设备和/或询问器之间的不期望的串扰。
图10图示根据本文所述的一个实施例的制造具有RFID标签的抛光衬垫的方法1000。尽管下文所述的图10及图11的实施例是针对抛光衬垫的增材制造，但应预期，这些实施例可以可应用于其他抛光系统组件，诸如保持环及柔性膜等等。此外，可利用诸如浇铸及模制的其他制造工艺以形成具有安置于其中的RFID标签的衬垫。
在操作1010处，打印抛光衬垫的第一部分。用于第一部分的适合材料可包括关于图2所提及的材料，但一般而言包括经配置以抛光基板的聚合材料。关于图12更详细地描述打印工艺，诸如3D打印工艺。抛光衬垫的第一部分可以是基底层或衬垫特征的结合。
在操作1020处，在第一部分上打印无线通信设备600，诸如RFID标签。用于打印RFID标签的适合材料一般而言包括导电材料或半导电材料。导电和/或半导电聚合物材料的示例包括但不限于聚(芴)、聚(苯撑)、聚(芘)、聚(薁)、聚(萘)、聚(乙炔)、聚(对苯撑伸乙烯)、聚(吡咯)、聚(咔唑)、聚(吲哚)、聚(氮呯)、聚(苯胺)、聚(噻吩)、聚(3,4-伸乙二氧基噻吩)及聚(对苯撑硫醚)材料等等，包括上述组合及混合物。另外，可利用含有所期望导电或半导电性质的纳米颗粒的材料，诸如油墨。例如，可利用银或金纳米颗粒来形成导电油墨或可利用硅纳米颗粒来形成半导电油墨。上述纳米颗粒可并入至上文所提及的聚合物材料或可与其他适合材料一起利用。在其他实施例中，可通过增材制造工艺(3D打印)或丝网打印工艺沉积金属材料来打印RFID标签的各部分。
在操作1030处，在RFID标签上方且围绕RFID标签打印抛光衬垫的第二部分。亦可在抛光衬垫的第一部分上方打印抛光衬垫的第二部分。如此，RFID标签可全部地或部分地囊封于抛光衬垫内。在一个实施例中，抛光衬垫的第二部分可经配置以接触且抛光基板。在另一实施例中，抛光衬垫的第一部分可经配置以接触且抛光基板。
图11图示根据本文所述的一个实施例的制造并入有无线通信设备600(诸如，RFID标签)的抛光衬垫的方法1100。在操作1110处，可打印抛光衬垫的第一部分，其中具有形成于其中的凹部或空隙。凹部可以是其中实质上不存在衬垫材料的第一部分的区。凹部可经确定大小而具有适合尺寸以容纳预制造的RFID标签。
在操作1120处，可将预成型的RFID标签插入至形成于第一部分中的凹部中。可在标签基板上形成RFID标签或可将RFID标签压入配合、黏结、黏附或以其他方式机械地耦合至第一部分处于凹部内。在操作1130处，可在RFID标签上方且围绕RFID标签打印抛光衬垫的第二部分。因此，预制造的RFID标签可经囊封且安置于衬垫的第一及第二部分内。
在关于图10及图11所述的实施例中，标签打印工艺及凹部形成工艺可考虑到最终形成的衬垫的可压缩性。由于RFID标签一般而言由可具有不同于第一及第二衬垫部分的材料的机械性质及动态性质的材料形成，因此应预期，可将各种微结构元件并入至衬垫的RFID标签或部分中以提供跨越衬垫具有较均匀机械性质及动态性质的衬垫。亦应预期，可将各种其他组件(诸如，布线)整体地制造至抛光衬垫中。在一些实施例中，调整安置于RFID标签下方和/或RFID标签上方的经添加材料的层的组分和/或性质以跨越衬垫提供均匀机械性质及动态性质。换言之，通过以下方式可补偿抛光衬垫的局域化区内的RFID标签的存在：通过调整使用本文所述的增材制造工艺沉积的材料和/或材料结构来调整RFID标签下方、RFID标签上方或毗邻于RFID标签的材料的材料性质。因此，通过使用增材制造工艺形成且具有安置于其中的一或多个RFID标签的衬垫、膜、保持环及其他结构可具有较均匀机械及动态性质，即使将一或多个RFID标签安置于所形成装置内亦如此。
图12是根据本文所述的实施例的用于制造抛光衬垫及其他CMP设备的3D打印设备1200的示意性剖视图。尽管参考抛光衬垫(诸如，抛光衬垫200、300、400及500)举出下文所述的特定示例，但应预期，亦可通过3D打印工艺制造其他CMP设备，诸如保持环(即，保持环120)及柔性膜(即，柔性膜132)。在一个实施例中，可在支撑物1202上打印抛光衬垫200。由液滴喷射打印机1206依据CAD(计算机辅助设计)程序形成抛光衬垫200。液滴喷射打印机1206及支撑物1202可在打印工艺期间彼此相对移动。
液滴喷射打印机1206一般而言包括具有用于施配前体的喷嘴的一或多个打印头。可以诸如液体或粉末形式的各种形态提供前体。在所图示的实施例中，液滴喷射打印机1206包括具有第一喷嘴1210的第一打印头1208及具有第二喷嘴1212的第二打印头1214。第一喷嘴1210可经配置以施配用于第一材料(诸如，软或弹性材料)的液体前体，而第二喷嘴1212可用于施配用于第二材料(诸如，硬材料)的液体前体。在另一实施例中，头1208、1214及喷嘴1210、1212可经配置以加热聚合前体以使前体以可流动或类液体状态流动以达成所期望设备的形成。
在其他实施例中，液滴喷射打印机1206可包括两个以上打印头以形成具有两种以上材料的抛光衬垫。例如，在关于打印RFID标签(诸如，无线通信设备600)的实施例中，第一喷嘴1210可经配置以施配导电或半导电材料的聚合前体以打印标签的导电组件。第二喷嘴1212可经配置以施配用于非导电标签组件的非导电材料的聚合前体。可在经选择位置或区处施配前体以形成抛光衬垫200。这些经选择位置集体地形成目标打印图案且可存储为CAD兼容文档，接着由控制液滴喷射打印机1206的电子控制器1204(例如，计算机)读取此CAD兼容文档。
本文所述的3D打印工艺包括但不限于聚合物喷出沉积、喷墨打印、熔融沉积模型化、黏结剂喷出、粉末床熔融、选择性激光烧结、立体微影、还原光聚合数字光处理、薄片层压及定向能量沉积以及其他3D沉积或打印工艺。
在3D打印之后，可通过固化来凝固抛光衬垫。可通过将经打印的抛光衬垫加热至固化温度来执行固化。替代地，可通过将经打印的抛光衬垫暴露至由紫外线光源产生的紫外线来执行固化。
3D打印提供用于产生由不同材料和/或不同材料组合物形成的抛光衬垫的方便且高度可控制工艺。例如，3D打印使得能够将NFC设备(诸如，RFID标签)高效且成本有效地并入至抛光衬垫。
例如，抛光衬垫200可由两种或更多种材料的混合物形成。在此实施例中，衬垫及衬垫特征可由一或多种第一材料形成且整体地安置于衬垫内的无线通信设备600可由一或多种第二材料形成。在一个实施例中，一或多种第一材料主要为非导电的而一或多种第二材料主要为导电或半导电的。在此实施例中，可用经由第一打印头1208自第一喷嘴1210挤压的第一材料液滴的混合物形成衬垫200及抛光特征204、206。无线通信设备(此处未示出但图6中更详细地图示)可用经由第二打印头1214自第二喷嘴1212挤压的第二材料液滴的混合物形成。打印头1210可首先与对应于抛光特征204、206的像素对准且在预定像素上施配液滴。打印头1212可接着与对应于无线通信设备的像素对准且在预定像素上施配液滴。结果是，可在顺序工艺中形成抛光特征204、206及无线通信设备。亦应预期，取决于3D打印设备1200的设计，可同时形成抛光特征204、206及无线通信设备600。
可根据一或多种第一材料的比率和/或分布来调整或调谐抛光特征204、206的性质。可根据一或多种第二材料的比率和/或分布来形成无线通信设备600。在一个实施例中，可通过选择自第一喷嘴1210挤压的液滴的大小、位置、速度和/或密度来控制抛光特征204、206的组分。类似地，通过选择自第二喷嘴1212挤压的液滴的大小、位置、速度和/或密度来控制无线通信设备的组分。因此，应预期，本公开的实施例涵盖用多种材料形成抛光衬垫且可利用此材料来制造具有安置于其中的无线通信设备的抛光衬垫。
增材制造工艺示例
在一个实施例中，3D打印可用于制造抛光衬垫、保持环、柔性膜及本文所述的其他CMP抛光设备组件。在一个实施例中，可通过针对3D对象的每一层的组件的CAD模型的使用及用于映射关于这些组件的信息的切片算法的使用来执行形成3D对象的方法。可通过在粉末床的表面上方分配粉末来形成对象的层。可接着沉积经挑选的黏结剂材料以便选择性地接合其中待形成对象的区的颗粒。可降低支撑粉末床及正制造的组件的致动器(例如，活塞)以形成下一粉末层。在形成每一层之后，重复工艺后接着进行最终固化工艺(例如，UV暴露或热处理)以完成对象的一部分。由于3D打印可对材料组分、微结构及表面纹理实行局部控制，因此借助本文所述的方法达成各种(及先前难达到的)几何形状。
在一个实施例中，可在可由计算机显现装置或计算机显示设备读取的数据结构中表示如本文所述的抛光衬垫。图12示出根据一个实施例的具有计算机可读介质的计算机系统(即，电子控制器1204)的示意性表示。计算机可读介质可含有表示抛光衬垫的数据结构。数据结构可以是计算机文档且可含有关于一或多个组件的结构、材料、纹理、物理性质或其他特性的信息。数据结构亦可含有代码，诸如实现计算机显现装置或计算机显示设备的经选择功能性的计算机可执行代码或装置控制代码。数据结构可存储于计算机可读介质上。计算机可读介质可包括实体存储介质，诸如磁性存储器或任何方便实体存储介质。实体存储介质可以是可由计算机系统读取以在计算机屏幕或实体显现装置(其可以是增材制造装置，诸如，3D打印机)上显现由数据结构表示的组件。
尽管上文是针对本公开的实施例，但可在不背离本公开的基本范围的情况下想到本公开的其他及额外实施例，且本公开的范围由下文的权利要求确定。

Claims (20)

1.一种抛光衬垫设备，包括：
经打印的聚合主体，所述经打印的聚合主体包括：
多个抛光特征，所述多个抛光特征包括第一材料并且限定抛光表面，所述抛光表面经配置以接触基板；以及
一或多个基底特征，所述一或多个基底特征包括与所述第一材料不同的第二材料，其中
所述一或多个基底特征被安置成距所述多个抛光特征的所述抛光表面一距离，并且所述一或多个基底特征和所述多个抛光特征沿着与所述抛光表面平行的方向以交替布置进行安置；以及
RFID标签，所述RFID标签整体地安置于所述经打印的聚合主体内。
2.如权利要求1所述的设备，其中所述第一材料和所述第二材料选自由以下各项组成的群组：环氧树脂、酚类、胺、聚酯、胺甲酸乙酯、硅、丙烯酸酯、上述项的混合物、共聚物以及接枝物。
3.如权利要求1所述的设备，其中所述RFID标签具有电感天线，所述电感天线经配置以使用无线通信技术与询问器通信。
4.如权利要求1所述的设备，其中所述RFID标签被定位在距所述抛光表面200μm至500μm之间。
5.如权利要求1所述的设备，其中凹部被形成在所述经打印的聚合主体中，并且所述RFID标签被耦合至形成在所述经打印的聚合主体内的所述凹部的表面。
6.如权利要求5所述的设备，其中所述RFID标签包括导电聚合物材料，所述导电聚合物材料包括导电纳米颗粒。
7.如权利要求1所述的设备，其中所述多个抛光特征被形成在所述一或多个基底特征上，所述多个抛光特征具有第一高度，所述一或多个基底特征具有第二高度，其中所述第一高度大于所述第二高度。
8.一种化学机械抛光系统，包括：
平台，所述平台具有支撑表面；
经打印的抛光衬垫，所述经打印的抛光衬垫具有安置于其中的RFID标签，其中所述RFID标签存储与所述经打印的抛光衬垫的性质相关联的多个信息，所述经打印的抛光衬垫安置于所述平台的所述支撑表面上方并且包括：
多个抛光特征，所述多个抛光特征包括第一材料并且限定抛光表面，所述抛光表面经配置以接触基板，其中所述多个抛光特征被布置成同心环；以及
一或多个基底特征，所述一或多个基底特征包括与所述第一材料不同的第二材料，其中所述一或多个基底特征被安置成距所述抛光表面一距离，并且其中所述一或多个基底特征和所述多个抛光特征沿着与所述抛光表面平行的方向以交替布置进行安置；以及
抛光头，所述抛光头与所述平台相对地定位，其中所述抛光头经配置以推动基板抵靠着所述经打印的抛光衬垫的所述抛光表面。
9.如权利要求8所述的抛光系统，进一步包括：
询问器，所述询问器耦合至所述平台，其中所述询问器和所述RFID标签经配置以使用无线通信技术相互通信。
10.如权利要求8所述的抛光系统，其中所述经打印的抛光衬垫由非导电聚合物材料形成，且所述RFID标签由导电聚合物材料形成。
11.如权利要求8所述的抛光系统，进一步包括：
保持环，所述保持环包括安置于其中的RFID标签。
12.如权利要求8所述的抛光系统，进一步包括：
柔性膜，所述柔性膜包括安置于其中的RFID标签。
13.如权利要求8所述的抛光系统，其中凹部被形成在所述经打印的抛光衬垫中，并且所述RFID标签被耦合至形成在所述经打印的抛光衬垫内的所述凹部的表面。
14.一种制造抛光衬垫的方法，包括：
通过分配第一材料形成聚合主体的多个抛光特征，其中所述多个抛光特征被布置成同心环并限定抛光表面，所述抛光表面经配置以接触基板；
通过分配第二材料形成所述聚合主体的一或多个基底特征，所述第二材料与所述第一材料不同；以及
将射频识别(RFID)标签安置于所述聚合主体内并距所述抛光表面一距离，其中
所述一或多个基底特征各自安置于距所述多个抛光特征一距离处，
所述一或多个基底特征和所述多个抛光特征沿着与所述抛光表面平行的方向以交替布置进行安置，以及
所述RFID标签存储与所述聚合主体的两个或更多个性质相关联的多个信息。
15.如权利要求14所述的方法，其中所述第一材料和所述第二材料选自由以下各项组成的群组：环氧树脂、酚类、胺、聚酯、胺甲酸乙酯、硅、丙烯酸酯、上述项的混合物、共聚物以及接枝物。
16.如权利要求14所述的方法，其中所述RFID标签具有电感天线，所述电感天线经配置以使用无线通信技术与询问器通信。
17.如权利要求14所述的方法，其中所述距离在距所述抛光表面约200μm至约500μm之间。
18.如权利要求14所述的方法，进一步包括：
在所述聚合主体内形成凹部，其中
所述RFID标签被耦合至形成在所述聚合主体内的所述凹部的表面。
19.如权利要求18所述的方法，其中所述RFID标签包括导电聚合物材料，所述导电聚合物材料包括导电纳米颗粒。
20.如权利要求14所述的方法，其中所述多个抛光特征被形成在所述一或多个基底特征上，所述多个抛光特征具有第一高度，所述一或多个基底特征具有第二高度，其中所述第一高度大于所述第二高度。
CN202310301737.6A 2015-11-06 2016-10-19 用于结合cmp工艺的追踪数据与3d打印的cmp耗材的技术 Pending CN116197811A (zh)

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US20200135517A1 (en) 2020-04-30
WO2017078933A1 (en) 2017-05-11
JP2018535107A (ja) 2018-11-29
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TW202110581A (zh) 2021-03-16
JP7277528B2 (ja) 2023-05-19
US11986922B2 (en) 2024-05-21
KR20180071368A (ko) 2018-06-27
JP2022023027A (ja) 2022-02-07
CN108369904A (zh) 2018-08-03
US20170133252A1 (en) 2017-05-11
TWI697384B (zh) 2020-07-01
CN108369904B (zh) 2023-04-07
US10593574B2 (en) 2020-03-17
TWI749562B (zh) 2021-12-11
JP6940497B2 (ja) 2021-09-29

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