CN102763209B - 搬送装置、搬送方法、曝光装置、以及元件制造方法 - Google Patents

搬送装置、搬送方法、曝光装置、以及元件制造方法 Download PDF

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Publication number
CN102763209B
CN102763209B CN201180009815.0A CN201180009815A CN102763209B CN 102763209 B CN102763209 B CN 102763209B CN 201180009815 A CN201180009815 A CN 201180009815A CN 102763209 B CN102763209 B CN 102763209B
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China
Prior art keywords
substrate
platform
plate
support
tool
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CN201180009815.0A
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English (en)
Chinese (zh)
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CN102763209A (zh
Inventor
金城麻子
牛岛康之
花崎哲嗣
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Nikon Corp
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Nikon Corp
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Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN201611218293.6A priority Critical patent/CN107017191B/zh
Priority to CN201611216877.XA priority patent/CN106876311B/zh
Publication of CN102763209A publication Critical patent/CN102763209A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Liquid Crystal (AREA)
CN201180009815.0A 2010-02-17 2011-02-17 搬送装置、搬送方法、曝光装置、以及元件制造方法 Active CN102763209B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201611218293.6A CN107017191B (zh) 2010-02-17 2011-02-17 搬送装置、曝光装置、以及元件制造方法
CN201611216877.XA CN106876311B (zh) 2010-02-17 2011-02-17 搬送装置、搬送方法、曝光装置、以及元件制造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30535510P 2010-02-17 2010-02-17
US30543910P 2010-02-17 2010-02-17
US61/305,355 2010-02-17
US61/305,439 2010-02-17
PCT/JP2011/053356 WO2011102410A1 (ja) 2010-02-17 2011-02-17 搬送装置、搬送方法、露光装置、及びデバイス製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201611216877.XA Division CN106876311B (zh) 2010-02-17 2011-02-17 搬送装置、搬送方法、曝光装置、以及元件制造方法
CN201611218293.6A Division CN107017191B (zh) 2010-02-17 2011-02-17 搬送装置、曝光装置、以及元件制造方法

Publications (2)

Publication Number Publication Date
CN102763209A CN102763209A (zh) 2012-10-31
CN102763209B true CN102763209B (zh) 2017-02-08

Family

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Application Number Title Priority Date Filing Date
CN201180009815.0A Active CN102763209B (zh) 2010-02-17 2011-02-17 搬送装置、搬送方法、曝光装置、以及元件制造方法
CN201611216877.XA Active CN106876311B (zh) 2010-02-17 2011-02-17 搬送装置、搬送方法、曝光装置、以及元件制造方法
CN201611218293.6A Active CN107017191B (zh) 2010-02-17 2011-02-17 搬送装置、曝光装置、以及元件制造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201611216877.XA Active CN106876311B (zh) 2010-02-17 2011-02-17 搬送装置、搬送方法、曝光装置、以及元件制造方法
CN201611218293.6A Active CN107017191B (zh) 2010-02-17 2011-02-17 搬送装置、曝光装置、以及元件制造方法

Country Status (5)

Country Link
JP (6) JP5915521B2 (ko)
KR (3) KR102023655B1 (ko)
CN (3) CN102763209B (ko)
TW (4) TWI661505B (ko)
WO (1) WO2011102410A1 (ko)

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WO2013031222A1 (ja) * 2011-08-30 2013-03-07 株式会社ニコン 物体搬送装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体の搬送方法、及び物体交換方法
US9360772B2 (en) 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
CN107436540B (zh) * 2012-08-08 2020-05-26 株式会社尼康 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法
JP6358564B2 (ja) * 2012-11-30 2018-07-18 株式会社ニコン 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置
JP6095394B2 (ja) * 2013-02-13 2017-03-15 東レエンジニアリング株式会社 基板処理システム及び基板処理方法
JP6142217B2 (ja) * 2013-02-25 2017-06-07 株式会社ブイ・テクノロジー 露光用基板搬送装置
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CN103824792A (zh) * 2014-02-28 2014-05-28 上海和辉光电有限公司 一种储藏柜及控制方法
KR20230048568A (ko) * 2014-11-10 2023-04-11 브룩스 오토메이션 인코퍼레이티드 툴 자동-교시 방법 및 장치
CN107466381B (zh) * 2015-03-30 2021-03-09 株式会社尼康 物体搬运装置及方法、曝光装置及方法、平板显示器的制造方法、元件制造方法
TWI699582B (zh) * 2015-07-01 2020-07-21 日商信越工程股份有限公司 貼合器件的製造裝置及製造方法
WO2017057465A1 (ja) * 2015-09-30 2017-04-06 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに計測方法
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JP6874314B2 (ja) * 2016-09-30 2021-05-19 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
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CN108502543B (zh) * 2017-02-28 2020-01-24 上海微电子装备（集团）股份有限公司 一种基板传输装置及方法
CN111149060B (zh) * 2017-09-29 2022-08-30 株式会社尼康 基板搬运、曝光装置、方法、平板显示器及元件制造方法
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