JP6905830B2 - 基板処理装置および基板処理方法 - Google Patents
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Description
0≦X2<(X3−D)
となるように設定すればよいこととなる。
3 浮上ステージ部(浮上部)
21,41 コロコンベア(移載部、ローラ部材)
22,42 回転・昇降駆動機構(切替部)
31 入口浮上ステージ(ステージ、中継ステージ)
32 塗布ステージ(位置制御ステージ)
33 出口浮上ステージ(ステージ、中継ステージ)
35 浮上制御機構(浮力発生機構)
36,38 昇降駆動機構(昇降機構)
51 チャック(搬送部)
61,71 ノズル(吐出部)
513 保持部(保持部位)
W 基板
Claims (8)
- 基板の下面を部分的に保持しながら移動して前記基板を搬送する搬送部と、
前記基板に当接して水平方向の推進力を付与することで、前記搬送部への前記基板の搬入および前記搬送部からの前記基板の搬出の少なくとも一方を行う移載部と、
前記搬送部のうち前記基板を保持する保持部位と前記移載部のうち前記基板に当接する当接部位との間の相対高さを変更することで、前記保持部位が前記当接部位よりも高い位置に位置して前記基板を保持する第1状態、および、前記当接部位が前記保持部位よりも高い位置に位置して前記基板に当接する第2状態、の間を切り替える切替部と、
前記第1状態および前記第2状態のそれぞれで、前記基板に下方から浮力を与えて浮上させることで前記基板を水平姿勢に制御する浮上部と、
前記搬送部により搬送される前記基板の上面に対向配置され、前記基板に処理液を吐出する吐出部と
を備え、
前記浮上部は、
前記搬送部により搬送される前記基板の下面に上面が対向して前記基板の鉛直方向位置を制御する位置制御ステージと、
前記位置制御ステージと前記移載部との間に配置され、前記搬送部により搬送される前記基板の下面に上面が対向する中継ステージと、
前記位置制御ステージの上面と前記基板の下面との間、および、前記中継ステージの上面と前記基板の下面との間に気体を流通させることで、前記基板に浮力を与える浮力発生機構と、
前記中継ステージを昇降させる昇降機構と
を有し、
前記昇降機構は、前記第1状態では前記中継ステージの上面が前記位置制御ステージの上面と同じ高さとなるように前記中継ステージを位置決めする一方、前記第2状態では前記中継ステージの上面が前記位置制御ステージの上面よりも高くなるように前記中継ステージを位置決めする基板処理装置。 - 前記浮上部は、前記基板の下面に上面が対向するステージと、前記ステージの上面と前記基板の下面との間に気体を流通させることで前記基板に浮力を与える浮力発生機構と、前記切替部による切り替えに応じて前記ステージを昇降させる昇降機構とを有する請求項1に記載の基板処理装置。
- 前記切替部は、前記当接部位を昇降させることで前記第1状態と前記第2状態とを切り替える請求項1または2に記載の基板処理装置。
- 前記切替部は、前記保持部位を昇降させることで前記第1状態と前記第2状態とを切り替える請求項1または2に記載の基板処理装置。
- 前記移載部は、前記基板の下面に当接しながら回転して前記基板に前記推進力を付与するローラ部材を備える請求項1ないし4のいずれかに記載の基板処理装置。
- 基板の下面を部分的に保持する搬送部を移動させて前記基板を搬送し、搬送される前記基板の下方から浮力を与えて前記基板の姿勢を制御しつつ、前記基板の上面に処理液を吐出する基板処理方法において、
前記搬送部による前記基板の搬送経路に前記基板に当接して水平方向の推進力を付与する移載部を設けるとともに、前記搬送部のうち前記基板を保持する保持部位と前記移載部のうち前記基板に当接する当接部位との間の相対高さを変更可能とし、
前記保持部位が前記当接部位よりも高い位置に位置して前記基板を保持する第1状態で、前記搬送部により前記基板を搬送し、
前記当接部位が前記保持部位よりも高い位置に位置して前記基板に当接する第2状態で、前記搬送部への前記基板の搬入および前記搬送部からの前記基板の搬出の少なくとも一方を行い、しかも、
前記第1状態および前記第2状態のそれぞれで、前記基板の下方から浮力を与えて前記基板の姿勢を制御し、
前記搬送部により搬送される前記基板の下面に位置制御ステージの上面を対向させて前記基板の鉛直方向位置を制御し、
前記位置制御ステージと前記移載部との間に、前記搬送部により搬送される前記基板の下面に上面が対向する中継ステージを配置し、
前記位置制御ステージの上面と前記基板の下面との間、および、前記中継ステージの上面と前記基板の下面との間に気体を流通させることで前記基板に浮力を与え、
前記中継ステージを昇降させる昇降機構が、前記第1状態では前記中継ステージの上面が前記位置制御ステージの上面と同じ高さとなるように前記中継ステージを位置決めする一方、前記第2状態では前記中継ステージの上面が前記位置制御ステージの上面よりも高くなるように前記中継ステージを位置決めする基板処理方法。 - 前記移載部は前記搬送部が前記基板の搬送を終了する搬送終了位置に臨んで設けられ、
前記搬送部が前記搬送終了位置に移動してくる際には前記第1状態とし、前記搬送部が前記搬送終了位置に到達した後に前記当接部位を前記保持部位に対して上昇させることで前記第2状態に移行させる請求項6に記載の基板処理方法。 - 前記移載部は前記搬送部が前記基板の搬送を開始する搬送開始位置に臨んで設けられ、
前記搬送開始位置にある前記搬送部に対し、前記第2状態で前記移載部から前記基板を搬入した後に、前記当接部位を前記保持部位に対して下降させることで前記第1状態に移行させる請求項6に記載の基板処理方法。
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JP2017002683A JP6905830B2 (ja) | 2017-01-11 | 2017-01-11 | 基板処理装置および基板処理方法 |
KR1020180001222A KR102117745B1 (ko) | 2017-01-11 | 2018-01-04 | 기판 처리 방법 그리고 기판 처리 장치 |
CN201810027859.XA CN108305847B (zh) | 2017-01-11 | 2018-01-11 | 基板搬运装置、基板搬运方法以及基板处理装置 |
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JP4884871B2 (ja) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP2009022823A (ja) * | 2007-07-17 | 2009-02-05 | Dainippon Screen Mfg Co Ltd | 検査装置および基板処理システム |
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JP2010232472A (ja) * | 2009-03-27 | 2010-10-14 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
JP2010240550A (ja) * | 2009-04-03 | 2010-10-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
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TWI631649B (zh) * | 2010-02-17 | 2018-08-01 | 尼康股份有限公司 | 基板更換裝置、曝光裝置、基板更換方法、曝光方法、平面面板顯示器之製造方法、以及元件製造方法 |
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KR20180082960A (ko) | 2018-07-19 |
KR102117745B1 (ko) | 2020-06-01 |
CN108305847A (zh) | 2018-07-20 |
JP2018113328A (ja) | 2018-07-19 |
CN108305847B (zh) | 2022-05-10 |
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