JP5915521B2 - 搬送装置、搬送方法、露光装置、及びデバイス製造方法 - Google Patents

搬送装置、搬送方法、露光装置、及びデバイス製造方法 Download PDF

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JP5915521B2
JP5915521B2 JP2012500640A JP2012500640A JP5915521B2 JP 5915521 B2 JP5915521 B2 JP 5915521B2 JP 2012500640 A JP2012500640 A JP 2012500640A JP 2012500640 A JP2012500640 A JP 2012500640A JP 5915521 B2 JP5915521 B2 JP 5915521B2
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substrate
plate holder
carry
unit
support
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JPWO2011102410A1 (ja
Inventor
麻子 金城
麻子 金城
牛島　康之
康之 牛島
哲嗣 花崎
哲嗣 花崎
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
JP2012500640A 2010-02-17 2011-02-17 搬送装置、搬送方法、露光装置、及びデバイス製造方法 Active JP5915521B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30535510P 2010-02-17 2010-02-17
US30543910P 2010-02-17 2010-02-17
US61/305,439 2010-02-17
US61/305,355 2010-02-17
PCT/JP2011/053356 WO2011102410A1 (ja) 2010-02-17 2011-02-17 搬送装置、搬送方法、露光装置、及びデバイス製造方法

Related Child Applications (2)

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JP2014201948A Division JP2015008334A (ja) 2010-02-17 2014-09-30 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2016077555A Division JP6191721B2 (ja) 2010-02-17 2016-04-07 搬送装置、搬送方法、露光装置、及びデバイス製造方法

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JPWO2011102410A1 JPWO2011102410A1 (ja) 2013-06-17
JP5915521B2 true JP5915521B2 (ja) 2016-05-11

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JP2012500640A Active JP5915521B2 (ja) 2010-02-17 2011-02-17 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2014201948A Pending JP2015008334A (ja) 2010-02-17 2014-09-30 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2016077555A Active JP6191721B2 (ja) 2010-02-17 2016-04-07 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2016240766A Pending JP2017059852A (ja) 2010-02-17 2016-12-12 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP2017155480A Active JP6512248B2 (ja) 2010-02-17 2017-08-10 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2019075822A Active JP6780732B2 (ja) 2010-02-17 2019-04-11 搬送装置、露光装置、及びデバイス製造方法

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JP2014201948A Pending JP2015008334A (ja) 2010-02-17 2014-09-30 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2016077555A Active JP6191721B2 (ja) 2010-02-17 2016-04-07 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2016240766A Pending JP2017059852A (ja) 2010-02-17 2016-12-12 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP2017155480A Active JP6512248B2 (ja) 2010-02-17 2017-08-10 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2019075822A Active JP6780732B2 (ja) 2010-02-17 2019-04-11 搬送装置、露光装置、及びデバイス製造方法

Country Status (5)

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JP (6) JP5915521B2 (ko)
KR (3) KR102172551B1 (ko)
CN (3) CN106876311B (ko)
TW (4) TWI777060B (ko)
WO (1) WO2011102410A1 (ko)

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US9360772B2 (en) * 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
WO2014024483A1 (ja) * 2012-08-08 2014-02-13 株式会社ニコン 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
EP4009356A1 (en) * 2012-11-30 2022-06-08 Nikon Corporation Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device
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CN108502543B (zh) * 2017-02-28 2020-01-24 上海微电子装备（集团）股份有限公司 一种基板传输装置及方法
CN111149059B (zh) * 2017-09-29 2022-08-26 株式会社尼康 基板搬运、曝光装置、方法、平板显示器及元件制造方法
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WO2019064585A1 (ja) * 2017-09-29 2019-04-04 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法
CN111164513B (zh) * 2017-09-29 2022-08-16 株式会社尼康 基板搬运、曝光装置、方法、平板显示器及元件制造方法
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KR102054714B1 (ko) * 2018-05-09 2019-12-12 주식회사 글로벌시스템즈 트레이순환형 비접촉 정밀 처리 시스템
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JP7196734B2 (ja) * 2019-03-29 2022-12-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
KR102182632B1 (ko) * 2019-06-10 2020-11-24 주식회사 크레셈 반도체 기판 검사장치
CN110498233B (zh) * 2019-07-26 2021-04-27 江苏科技大学 二维无接触输送平台装置
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