WO2003019679A1 - Light emitting device using led - Google Patents
Light emitting device using led Download PDFInfo
- Publication number
- WO2003019679A1 WO2003019679A1 PCT/JP2002/008697 JP0208697W WO03019679A1 WO 2003019679 A1 WO2003019679 A1 WO 2003019679A1 JP 0208697 W JP0208697 W JP 0208697W WO 03019679 A1 WO03019679 A1 WO 03019679A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal plate
- led chip
- light emitting
- led
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H10W72/5522—
-
- H10W74/00—
-
- H10W90/00—
-
- H10W90/754—
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HK04101926.3A HK1059148B (en) | 2001-08-28 | 2002-08-28 | Light emitting device using led |
| US10/466,114 US6930332B2 (en) | 2001-08-28 | 2002-08-28 | Light emitting device using LED |
| EP02762899A EP1439584B1 (en) | 2001-08-28 | 2002-08-28 | Light emitting device using led |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-258680 | 2001-08-28 | ||
| JP2001258680 | 2001-08-28 | ||
| JP2001-340832 | 2001-11-06 | ||
| JP2001340832A JP4045781B2 (ja) | 2001-08-28 | 2001-11-06 | 発光装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003019679A1 true WO2003019679A1 (en) | 2003-03-06 |
Family
ID=26621159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2002/008697 Ceased WO2003019679A1 (en) | 2001-08-28 | 2002-08-28 | Light emitting device using led |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6930332B2 (ja) |
| EP (1) | EP1439584B1 (ja) |
| JP (1) | JP4045781B2 (ja) |
| CN (1) | CN1220285C (ja) |
| TW (1) | TW556364B (ja) |
| WO (1) | WO2003019679A1 (ja) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004068594A1 (de) * | 2003-01-30 | 2004-08-12 | Osram Opto Semiconductors Gmbh | Elektromagnetische strahlung aussendendes und/oder empfangendes halbleiter-bauelement und gehäuse-grundkörper für ein derartiges bauelement |
| WO2005048358A1 (de) * | 2003-11-07 | 2005-05-26 | Tridonic Optoelectronics Gmbh | Leuchtdioden-anordnung mit wärmeabführender platine |
| WO2005099323A2 (de) | 2004-04-07 | 2005-10-20 | P.M.C. Projekt Management Consult Gmbh | Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung |
| CN1293524C (zh) * | 2004-09-16 | 2007-01-03 | 新灯源科技有限公司 | 具高效率散热结构的发光装置 |
| US7253447B2 (en) | 2003-02-28 | 2007-08-07 | Citizen Electronics Co., Ltd. | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| CN100382345C (zh) * | 2004-01-05 | 2008-04-16 | 株式会社东芝 | 光半导体装置 |
| EP1521313A3 (en) * | 2003-10-03 | 2010-12-29 | Philips Lumileds Lighting Company LLC | Integrated reflector cup for a light emitting device mount |
| DE102004044149B4 (de) * | 2003-10-09 | 2011-02-17 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Hochleistungs-Leuchtdiodenvorrichtung |
| US8070316B2 (en) | 2005-12-22 | 2011-12-06 | Panasonic Electric Works Co., Ltd. | Lighting apparatus with LEDs |
| US8975646B2 (en) | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
| WO2022260174A1 (ja) * | 2021-06-11 | 2022-12-15 | シチズン電子株式会社 | 発光装置 |
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| US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
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| JP2004265977A (ja) * | 2003-02-28 | 2004-09-24 | Noritsu Koki Co Ltd | 発光ダイオード光源ユニット |
| TW594950B (en) * | 2003-03-18 | 2004-06-21 | United Epitaxy Co Ltd | Light emitting diode and package scheme and method thereof |
| CN100587560C (zh) | 2003-04-01 | 2010-02-03 | 夏普株式会社 | 发光装置用组件、发光装置、背侧光照射装置、显示装置 |
| WO2004105142A1 (en) * | 2003-05-26 | 2004-12-02 | Matsushita Electric Works, Ltd. | Light-emitting device |
| US7211835B2 (en) * | 2003-07-09 | 2007-05-01 | Nichia Corporation | Light emitting device, method of manufacturing the same and lighting equipment |
| US20050133808A1 (en) * | 2003-09-11 | 2005-06-23 | Kyocera Corporation | Package for housing light-emitting element, light-emitting apparatus and illumination apparatus |
| JP3921474B2 (ja) * | 2003-10-30 | 2007-05-30 | 京セラ株式会社 | 発光装置および照明装置 |
| JP2005210042A (ja) * | 2003-09-11 | 2005-08-04 | Kyocera Corp | 発光装置および照明装置 |
| DE602004020906D1 (de) * | 2003-09-19 | 2009-06-10 | Panasonic Corp | Beleuchtungseinrichtung |
| EP1670069A4 (en) * | 2003-09-29 | 2011-09-21 | Panasonic Corp | LINEAR LIGHT SOURCE AND MANUFACTURING METHOD AND SURFACE EMISSION ELEMENT |
| FR2862424B1 (fr) * | 2003-11-18 | 2006-10-20 | Valeo Electronique Sys Liaison | Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif |
| US7198387B1 (en) * | 2003-12-18 | 2007-04-03 | B/E Aerospace, Inc. | Light fixture for an LED-based aircraft lighting system |
| US7321161B2 (en) * | 2003-12-19 | 2008-01-22 | Philips Lumileds Lighting Company, Llc | LED package assembly with datum reference feature |
| TWI275189B (en) * | 2003-12-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component |
| JP4614679B2 (ja) * | 2004-01-29 | 2011-01-19 | 京セラ株式会社 | 発光装置およびその製造方法ならびに照明装置 |
| JP2005243973A (ja) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | 発光装置および照明装置 |
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| TWI257184B (en) * | 2004-03-24 | 2006-06-21 | Toshiba Lighting & Technology | Lighting apparatus |
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| US7427806B2 (en) | 2003-01-30 | 2008-09-23 | Oram Gmbh | Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
| WO2004068594A1 (de) * | 2003-01-30 | 2004-08-12 | Osram Opto Semiconductors Gmbh | Elektromagnetische strahlung aussendendes und/oder empfangendes halbleiter-bauelement und gehäuse-grundkörper für ein derartiges bauelement |
| US7745835B2 (en) | 2003-02-28 | 2010-06-29 | Citizen Electronics Co., Ltd. | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| US7737462B2 (en) | 2003-02-28 | 2010-06-15 | Citizen Electronics Co., Ltd | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| US7253447B2 (en) | 2003-02-28 | 2007-08-07 | Citizen Electronics Co., Ltd. | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| DE102004009998B4 (de) * | 2003-02-28 | 2010-05-06 | Citizen Electronics Co., Ltd., Fujiyoshida-shi | Licht ausstrahlende Diode und Licht ausstrahlende Diodenvorrichtung umfassend eine Licht ausstrahlende Diode |
| EP1521313A3 (en) * | 2003-10-03 | 2010-12-29 | Philips Lumileds Lighting Company LLC | Integrated reflector cup for a light emitting device mount |
| DE102004044149B4 (de) * | 2003-10-09 | 2011-02-17 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Hochleistungs-Leuchtdiodenvorrichtung |
| JP2007510297A (ja) * | 2003-11-07 | 2007-04-19 | トリドニック オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放熱板を有する発光ダイオードの構成 |
| CN100442552C (zh) * | 2003-11-07 | 2008-12-10 | 特里多尼克光电子有限公司 | 带有散热板的发光二极管装置 |
| AU2004310132B2 (en) * | 2003-11-07 | 2010-04-22 | Ledon Lighting Jennersdorf Gmbh | Light-emitting diode arrangement comprising a heat-dissipating plate |
| WO2005048358A1 (de) * | 2003-11-07 | 2005-05-26 | Tridonic Optoelectronics Gmbh | Leuchtdioden-anordnung mit wärmeabführender platine |
| US8766283B2 (en) | 2003-11-07 | 2014-07-01 | Tridonic Optoelectronics Gmbh | Light-emitting diode arrangement with heat dissipating plate |
| DE10351934B4 (de) * | 2003-11-07 | 2017-07-13 | Tridonic Jennersdorf Gmbh | Leuchtdioden-Anordnung mit wärmeabführender Platine |
| CN100382345C (zh) * | 2004-01-05 | 2008-04-16 | 株式会社东芝 | 光半导体装置 |
| WO2005099323A3 (de) * | 2004-04-07 | 2006-02-16 | P M C Projekt Man Consult Gmbh | Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung |
| WO2005099323A2 (de) | 2004-04-07 | 2005-10-20 | P.M.C. Projekt Management Consult Gmbh | Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung |
| US8975646B2 (en) | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
| CN1293524C (zh) * | 2004-09-16 | 2007-01-03 | 新灯源科技有限公司 | 具高效率散热结构的发光装置 |
| US8070316B2 (en) | 2005-12-22 | 2011-12-06 | Panasonic Electric Works Co., Ltd. | Lighting apparatus with LEDs |
| WO2022260174A1 (ja) * | 2021-06-11 | 2022-12-15 | シチズン電子株式会社 | 発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4045781B2 (ja) | 2008-02-13 |
| JP2003152225A (ja) | 2003-05-23 |
| CN1220285C (zh) | 2005-09-21 |
| US6930332B2 (en) | 2005-08-16 |
| EP1439584A1 (en) | 2004-07-21 |
| HK1059148A1 (zh) | 2004-06-18 |
| TW556364B (en) | 2003-10-01 |
| EP1439584A4 (en) | 2006-07-19 |
| EP1439584B1 (en) | 2012-01-18 |
| CN1466782A (zh) | 2004-01-07 |
| US20040065894A1 (en) | 2004-04-08 |
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